Patents by Inventor Seung Yong Shin

Seung Yong Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150222888
    Abstract: A multiview image display apparatus includes: a display configured to switch an operation mode of the display between a 3-dimensional (3D) mode and a 2-dimensional (2D) mode and provide a multiview image in the 3D mode; a detector configured to detect at least one of a viewing position and a viewing posture of a viewer; and a controller configured to, in response to at least one of the viewing position and the viewing posture of the viewer meeting a preset criteria, control the display to switch an operation mode of the display from the 3D mode to the 2D mode and to provide a 2D image.
    Type: Application
    Filed: September 3, 2014
    Publication date: August 6, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-mo KANG, Sung-yeol KIM, Ho-young LEE, Seung-yong SHIN
  • Publication number: 20140346038
    Abstract: Provided are a crystalline alloy having significantly better thermal stability than an amorphous alloy as well as glass-forming ability, and a method of manufacturing the crystalline alloy. The present invention also provides an alloy sputtering target that is manufactured by using the crystalline alloy, and a method of manufacturing the alloy target. According to an aspect of the present invention, provided is a crystalline alloy having glass-forming ability which is formed of three or more elements having glass-forming ability, wherein the average grain size of the alloy is in a range of 0.1 ?m to 5 ?m and the alloy includes 5 at % to 20 at % of aluminum (Al), 15 at % to 40 at % of any one or more selected from copper (Cu) and nickel (Ni), and the remainder being zirconium (Zr).
    Type: Application
    Filed: December 4, 2012
    Publication date: November 27, 2014
    Inventors: Seung-Yong Shin, Kyoung-Il Moon, Ju-Hyun Sun, Chang-Hun Lee
  • Patent number: 8691142
    Abstract: Zr—Ti—Ni(Cu)-based filler alloy composition having low melting point for brazing titanium and titanium alloys is expressed as: ZraTibNic (Formula 1) where a, b and c denote atomic % of Zr, Ti and Ni, respectively; 47?a?52; 24?b?30; 22?c?26; and 0.3<c/(a+c)<0.35, or ZraTibNicCud (Formula 2) where a, b, c and d denote atomic % of Zr, Ti, Ni and Cu respectively; 48?a?60; 20?b?28; 19?c+d?30; 3?d?12; and 0.12<d/(c+d)?0.5. Including Zr(Ti) solid solution phase as major constituent phase, the alloy compositions have lower liquidus temperature than those of conventional alloys and they include a little amount of Cu or does not include it at all. When the alloy is used as filler alloy for brazing titanium and titanium alloys, brazing can be performed at remarkably low temperature. This can inhibit the microstructure of titanium base metal from changing and being damaged, keeping the titanium base metal preserving inherent properties after brazing.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: April 8, 2014
    Assignee: Korea Institute of Industrial Technology
    Inventors: Seung-Yong Shin, Dong-Myoung Lee, Ju-Hyun Sun, Yong-Hwan Kim, Dong-Han Kang
  • Publication number: 20140006690
    Abstract: Provided is a storage device capable of increasing its life cycle and operating method thereof. The storage device includes a nonvolatile memory device that stores data and a controller that controls the nonvolatile memory device. The controller receive can modify a write time-out value of the nonvolatile memory device in accordance with predetermined conditions, such as request from a host or exceeding of a predefined life cycle.
    Type: Application
    Filed: March 11, 2013
    Publication date: January 2, 2014
    Inventors: Seung-Yong SHIN, Young-Hyun JUN, Hee-Chang CHO
  • Patent number: 8486330
    Abstract: Disclosed is Zr—Ti—Ni(Cu)-based filler alloy composition having low melting point for brazing titanium and titanium alloys. The Zr—Ti—Ni(Cu)-based alloy composition is expressed as: ZraTibNic (Formula 1) where a, b and c denote atomic % of Zr, Ti and Ni, respectively; 47?a?52; 24?b?30; 22?c?26; and 0.3<c/(a+c)<0.35, or ZraTibNicCud (Formula 2) where a, b, c and d denote atomic % of Zr, Ti, Ni and Cu respectively; 48?a?60; 20?b?28; 19?c+d?30; 3?d?12; and 0.12<d/(c+d)?0.5. Including Zr(Ti) solid solution phase as its major constituent phase, the alloy compositions of this invention have lower liquidus temperature than those of conventional alloys and they include a little amount of Cu or does not include it at all. When alloy of the present invention is used as filler alloy for brazing titanium and titanium alloys, brazing can be performed at remarkably low temperature.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: July 16, 2013
    Assignees: Korea Institute of Industrial Technology, Yosan Eng. Ltd.
    Inventors: Seung-Yong Shin, Dong-Myoung Lee, Ju-Hyun Sun, Yong-Hwan Kim, Dong-Han Kang
  • Publication number: 20120275947
    Abstract: Zr—Ti—Ni(Cu)-based filler alloy composition having low melting point for brazing titanium and titanium alloys is expressed as: ZraTibNic (Formula 1) where a,b and c denote atomic % of Zr, Ti and Ni, respectively; 47?a?52; 24?b?30; 22?c?26; and 0.3<c/(a+c)<0.35, or ZraTibNicCud (Formula 2) where a,b,c and d denote atomic % of Zr, Ti, Ni and Cu respectively; 48?a?60; 20?b?28; 19?c+d?30; 3?d?12; and 0.12<d/(c+d)?0.5. Including Zr(Ti) solid solution phase as major constituent phase, the alloy compositions have lower liquidus temperature than those of conventional alloys and they include a little amount of Cu or does not include it at all. When the alloy is used as filler alloy for brazing titanium and titanium alloys, brazing can be performed at remarkably low temperature. This can inhibit the microstructure of titanium base metal from changing and being damaged, keeping the titanium base metal preserving inherent properties after brazing.
    Type: Application
    Filed: July 3, 2012
    Publication date: November 1, 2012
    Applicants: YOSAN ENG. LTD., KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: SEUNG-YONG SHIN, DONG-MYOUNG LEE, JU-HYUN SUN, YONG-HWAN KIM, DONG-HAN KANG
  • Publication number: 20120247948
    Abstract: The present invention relates to a sputtering target of a multi-component single body, a preparation method thereof, and a method for fabricating a multi-component alloy-based nanostructured thin film using the same. The sputtering target according to the present invention comprises an amorphous or partially crystallized glass-forming alloy system composed of a nitride forming metal element, which is capable of reacting with nitrogen to form a nitride, and a non-nitride forming element which has no or low solid solubility in the nitride forming metal element and does not react with nitrogen or has low reactivity with nitrogen, wherein the nitrogen forming metal element comprises at least one element selected from Ti, Zr, Hf, V, Nb, Ta, Cr, Y, Mo, W, Al, and Si, and the non-nitride forming element comprises at least one element selected from Mg, Ca, Sc, Ni, Cu, Ag, In, Sn, La, Au, and Pb.
    Type: Application
    Filed: November 19, 2010
    Publication date: October 4, 2012
    Inventors: Seung Yong Shin, Kyoung II Moon, Ju Hyun Sun, Chang Hun Lee, Jung Chan Bae
  • Patent number: 8121459
    Abstract: A preview method is discussed. According to an embodiment, the preview method includes calculating preview reproduction periods for respective chapters that are selected for reproduction, based on a set preview period; and reproducing each chapter for the preview reproduction period calculated for the corresponding chapter.
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: February 21, 2012
    Assignee: LG Electronics Inc.
    Inventor: Seung Yong Shin
  • Patent number: 8038499
    Abstract: In a flat display panel, a surface of at least one of a sustain electrode and an address electrode may be formed to have a curved surface. The surface of the electrode may be formed as a continuous curved surface. The sustain electrode and the address electrode may be elongated in a lengthwise direction thereof. These lengthwise directions may be perpendicular to each other. The electrode may be formed by transferring an electrode material onto the substrate using an electrode frame defined with electrode forming grooves each having a same sectional shape as the electrode. Therefore, the surface of the electrode may be formed as the curved surface.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: October 18, 2011
    Assignee: LG Electronics Inc.
    Inventors: Bong Hyang Kim, Soon Kook Hong, Kang Ug Lee, Dug Hwan Kim, Seung Mok Oh, Sang Soo Lee, Seung Yong Shin, Seok Gu Kim, Dae Chul Kang
  • Publication number: 20110211987
    Abstract: Disclosed is Zr—Ti—Ni (Cu)-based filler alloy composition having low melting point for brazing titanium and titanium alloys. The Zr—Ti—Ni (Cu)-based alloy composition is expressed as: ZraTibNic (Formula 1) where a,b and c denote atomic % of Zr, Ti and Ni, respectively; 47<a<52; 24?b?30; 22<c<26; and 0.3<c/(a+c)<0.35, or ZraTibNicCud (Formula 2) where a,b,c and d denote atomic % of Zr, Ti, Ni and Cu respectively; 48?a?60; 20<b<28; 19<c+d<30; 3<d<12; and 0.12<d/(c+d)?0.5. Including Zr(Ti) solid solution phase as its major constituent phase, the alloy compositions of this invention have lower liquidus temperature than those of conventional alloys and they include a little amount of Cu or does not include it at all. When alloy of the present invention is used as filler alloy for brazing titanium and titanium alloys, brazing can be performed at remarkably low temperature.
    Type: Application
    Filed: August 7, 2008
    Publication date: September 1, 2011
    Applicants: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, YOSAN ENG. LTD.
    Inventors: Seung-Yong Shin, Dong-Myoung Lee, Ju-Hyun Sun, Yong-Hwan Kim, Dong-Han Kang
  • Publication number: 20100048086
    Abstract: In a flat display panel, a surface of at least one of a sustain electrode and an address electrode may be formed to have a curved surface. The surface of the electrode may be formed as a continuous curved surface. The sustain electrode and the address electrode may be elongated in a lengthwise direction thereof. These lengthwise directions may be perpendicular to each other. The electrode may be formed by transferring an electrode material onto the substrate using an electrode frame defined with electrode forming grooves each having a same sectional shape as the electrode. Therefore, the surface of the electrode may be formed as the curved surface.
    Type: Application
    Filed: October 27, 2009
    Publication date: February 25, 2010
    Inventors: Bong Hyang KIM, Soon Kook Hong, Kang Ug Lee, Dug Hwan Kim, Seung Mok Oh, Sang Soo Lee, Seung Yong Shin, Seok Gu Kim, Dae Chul Kang
  • Publication number: 20090175590
    Abstract: An IPTV reproducing apparatus and a method for reproducing data are disclosed.
    Type: Application
    Filed: January 7, 2009
    Publication date: July 9, 2009
    Inventors: Hee Chang RYU, Seung Yong Shin
  • Publication number: 20070178653
    Abstract: Disclosed are an apparatus and method for manufacturing a flat display panel. In forming sustain electrodes and address electrodes, to which electricity is supplied to discharge, on front and rear panels, electrode material, which resides in electrode forming grooves formed on the surface of an electrode roll and each having the same shape as that of electrodes, is transferred on a substrate. The electrode roll transfers the electrode material to the substrate while coming into close contact with and rotating on the substrate. The electrode material adhering to the surface of the electrode roll using a cleaner before the electrode roll transfers the electrode material to the substrate.
    Type: Application
    Filed: January 19, 2007
    Publication date: August 2, 2007
    Inventors: Bong Hyang Kim, Sang Soo Lee, Seung Yong Shin, Mun Tae Jung, Ji Hyun Kim, Soon Kook Hong