Patents by Inventor Seung Yoon On

Seung Yoon On has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250076132
    Abstract: A dual-mode coaxial fiber sensor has a structure in which a core fiber, a strain sensing layer formed on the core fiber and made of a conductive material, and a temperature sensing layer formed on the surface of the strain sensing layer and made of a conductive material are stacked, thereby simultaneously measuring a temperature and a strain using one sensor.
    Type: Application
    Filed: July 16, 2024
    Publication date: March 6, 2025
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Seong Su KIM, Won Vin KIM, Seong Yeon PARK, Seung Yoon ON
  • Publication number: 20240375327
    Abstract: An electronic package molding device includes a planar heating element configured to mold an electronic package by approaching one surface of an electronic package to melt a molding agent disposed on the one surface of the electronic package and apply pressure to bring the epoxy molding compound into close contact with the electronic package and a gas pressure regulator configured to adjust gas pressure between the electronic package and the planar heating element.
    Type: Application
    Filed: April 15, 2024
    Publication date: November 14, 2024
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Seong Su KIM, Seong Yeon PARK, Seung Yoon ON
  • Publication number: 20220333659
    Abstract: Provided is a composite material capable of measuring bending deformation, the composite material including: a first conductive composite body that is bendable; a dielectric body that is bendable and compressible; and a second conductive composite body that is bendable, wherein the first conductive composite body and the second conductive composite body are respectively stacked on both surfaces of the dielectric body, and heights of the first conductive composite body and the second conductive composite body from the dielectric body are different from each other.
    Type: Application
    Filed: December 27, 2021
    Publication date: October 20, 2022
    Inventors: Seong Su Kim, Hyunsoo Hong, Muhammad Salmam Sarfraz, Seung Yoon On, Jaemoon Jeong
  • Patent number: 11280688
    Abstract: The core-shell structured fiber-type strain sensor of the present disclosure, which includes a fibrous support forming a core and a multilayered shell layer formed on the fibrous support, exhibits improved strength and stiffness due to the core fiber, exhibits improved noise level due to an elastomer layer and allows manufacturing of a fiber-type sensor with improved linearity of measurement signals due to a sandwich-structured conductive layer, is advantageous in that stable strain measurement is possible without acting as a defect in a composite structure.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: March 22, 2022
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Seong Su Kim, Seung Yoon On
  • Publication number: 20210404892
    Abstract: The core-shell structured fiber-type strain sensor of the present disclosure, which includes a fibrous support forming a core and a multilayered shell layer formed on the fibrous support, exhibits improved strength and stiffness due to the core fiber, exhibits improved noise level due to an elastomer layer and allows manufacturing of a fiber-type sensor with improved linearity of measurement signals due to a sandwich-structured conductive layer, is advantageous in that stable strain measurement is possible without acting as a defect in a composite structure.
    Type: Application
    Filed: March 23, 2020
    Publication date: December 30, 2021
    Inventors: Seong Su Kim, Seung Yoon On