Abstract: A window member includes a main part including a first side extending in a first direction, a second side extending in a second direction, and a first corner side connecting the first and second sides. The window member further includes a first side part in contact with the first side, a second side part in contact with the second side, and a first corner part connecting the first and second side parts. The first corner part includes a first upper corner part, a first middle corner part, and a first lower corner part. A lower surface of the first middle corner part has a first radius of curvature, a lower surface of the first lower corner part has a second radius of curvature, and the first radius of curvature is greater than the second radius of curvature.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first via portion disposed in the first insulating layer; and a second via portion disposed in the second insulating layer; wherein the first via portion includes: a first via part passing through the first insulating layer; a first-first pad disposed on an upper surface of the first insulating layer and connected to an upper surface of the first via part; and a first-second pad disposed on a lower surface of the first insulating layer and connected to a lower surface of the first via part; wherein the second via portion includes: a second via part passing through the second insulating layer and having a lower surface connected to an upper surface of the first-first pad; a second pad disposed on an upper surface of the second insulating layer and connected to an upper surface of the second via part; wherein a width of the first-first pad is smaller than or e

Abstract: A printed circuit board according to an embodiment includes an insulating layer; and a via portion disposed on the insulating layer; wherein the via portion includes: a first pad disposed under the insulating layer; a second pad disposed on the insulating layer; and a via part disposed between the first and second pads in the insulating layer; and wherein a width of the first pad is less than or equal to a width of a lower surface of the via part.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; and a cavity formed in the first and second insulating layers; wherein the cavity includes a first portion formed in the second insulating layer; and a second portion formed in the first insulating layer; wherein the first portion has a first cross-sectional shape, and wherein the second part has a second cross-sectional shape different from the first cross-sectional shape.

Abstract: A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.

Abstract: Disclosed is a printed circuit board including a base insulating layer, an upper insulating layer formed on the base insulating layer, a lower insulating layer formed under the base insulating layer. The upper insulating layer has a plurality of first vias filled in the first through holes, respectively, and the lower insulating layer has a second via filled in one second through hole formed through a top and a bottom surface and commonly connected with the first vias.

Abstract: A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating layer; a solder resist having an opening section exposing the upper surface of the pad and formed on the insulating layer and a bump formed on the pad exposed through the opening section of the solder resist and having a lower area narrower than the upper area.

Abstract: A semiconductor package substrate includes an insulating substrate; a circuit pattern on the insulating substrate; a protective layer on the insulating substrate, the protective layer covering the circuit pattern on the insulating substrate; a pad on the protective layer; and an adhesive member on the protective layer, wherein the pad includes a first pad buried in the protective layer, and a second pad on the first pad, the second pad protruding over the protective layer.

Abstract: A printed circuit board according to an embodiment of the present invention includes an insulating layer, a pad formed on the insulating layer and exposed through an opening section of a solder resist, a bump formed by filling an opening portion of the solder resist from top of the pad and having an narrow width than the opening of the solder resist.

Abstract: Disclosed is a printed circuit board including a base insulating layer, an upper insulating layer formed on the base insulating layer, a lower insulating layer formed under the base insulating layer. The upper insulating layer has a plurality of first vias filled in the first through holes, respectively, and the lower insulating layer has a second via filled in one second through hole formed through a top and a bottom surface and commonly connected with the first vias.

Abstract: A semiconductor package substrate includes an insulating substrate, a circuit pattern on the insulating substrate, a protective layer formed on the insulating substrate to cover the circuit pattern on the insulating substrate, a pad formed on the protective layer while protruding from a surface of the protective layer, and an adhesive member on the pad.

Abstract: A semiconductor package substrate includes an insulating substrate; a circuit pattern on the insulating substrate; a protective layer on the insulating substrate, the protective layer covering the circuit pattern on the insulating substrate; a pad on the protective layer; and an adhesive member on the protective layer, wherein the pad includes a first pad buried in the protective layer, and a second pad on the first pad, the second pad protruding over the protective layer.

Abstract: A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating layer; a solder resist having an opening section exposing the upper surface of the pad and formed on the insulating layer and a bump formed on the pad exposed through the opening section of the solder resist and having a lower area narrower than the upper area.

Abstract: A printed circuit board according to an embodiment of the present invention includes an insulating layer, a pad formed on the insulating layer and exposed through an opening section of a solder resist, a bump formed by filling an opening portion of the solder resist from top of the pad and having an narrow width than the opening of the solder resist.