Patents by Inventor Seung-Chang BAEK
Seung-Chang BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11744028Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.Type: GrantFiled: June 25, 2021Date of Patent: August 29, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Seung Chang Baek, Hyeong Sam Son, Chang Jin Song, Chang Hyeok Shin, Sung Ho Cho, Chong Kun Cho, Han Gyu Hwang, Min Woo Yoo
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Publication number: 20210329800Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.Type: ApplicationFiled: June 25, 2021Publication date: October 21, 2021Inventors: Seung Chang BAEK, Hyeong Sam SON, Chang Jin SONG, Chang Hyeok SHIN, Sung Ho CHO, Chong Kun CHO, Han Gyu HWANG, Min Woo YOO
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Patent number: 11051416Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.Type: GrantFiled: February 3, 2020Date of Patent: June 29, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Seung Chang Baek, Hyeong Sam Son, Chang Jin Song, Chang Hyeok Shin, Sung Ho Cho, Chong Kun Cho, Han Gyu Hwang, Min Woo Yoo
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Publication number: 20200178409Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.Type: ApplicationFiled: February 3, 2020Publication date: June 4, 2020Inventors: Seung Chang BAEK, Hyeong Sam SON, Chang Jin SONG, Chang Hyeok SHIN, Sung Ho CHO, Chong Kun CHO, Han Gyu HWANG, Min Woo YOO
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Patent number: 10588226Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.Type: GrantFiled: March 6, 2018Date of Patent: March 10, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Seung Chang Baek, Hyeong Sam Son, Chang Jin Song, Chang Hyeok Shin, Sung Ho Cho, Chong Kun Cho, Han Gyu Hwang, Min Woo Yoo
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Patent number: 10433437Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.Type: GrantFiled: February 14, 2019Date of Patent: October 1, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Seung Chang Baek, Hyeong Sam Son, Chang Jin Song, Chang Hyeok Shin, Sung Ho Cho, Chong Kun Cho, Han Gyu Hwang, Min Woo Yoo
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Patent number: 10424765Abstract: Provided are a cover having a metallic grid structure and a method for manufacturing the cover. The cover includes a pattern portion formed of a metallic material, in which a plurality of patterns are independently disposed spaced apart from each other and an injection portion disposed between pattern portions to connect the pattern portions, the injection portion being formed of a non-metallic material. The method includes forming a pre-pattern portion including patterns in a regular or irregular form and a bridge connecting the patterns on a metallic plate, forming the injection portion on the pre-pattern portion by insert-injection or thermo-compression press, and removing the bridge.Type: GrantFiled: May 31, 2013Date of Patent: September 24, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Wook Hwang, Sung-Ho Cho, Hee-Cheul Moon, Seung-Chang Baek, Chan-Seob Park
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Publication number: 20190182974Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.Type: ApplicationFiled: February 14, 2019Publication date: June 13, 2019Inventors: Seung Chang BAEK, Hyeong Sam SON, Chang Jin SONG, Chang Hyeok SHIN, Sung Ho CHO, Chong Kun CHO, Han Gyu HWANG, Min Woo YOO
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Publication number: 20190159355Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.Type: ApplicationFiled: March 6, 2018Publication date: May 23, 2019Inventors: Seung Chang BAEK, Hyeong Sam SON, Chang Jin SONG, Chang Hyeok SHIN, Sung Ho CHO, Chong Kun CHO, Han Gyu HWANG, Min Woo YOO
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Publication number: 20180098448Abstract: An electronic device is provided.Type: ApplicationFiled: December 1, 2016Publication date: April 5, 2018Inventors: Seung Chang BAEK, Soon Cheol KWON, Chang Hyeok SHIN, Sung Whan YOON, Jung Hyun IM, Chang Youn HWANG, Han Gyu HWANG, Jong Chul CHOI
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Patent number: 8696920Abstract: A method of fabricating a case for a portable electronic device includes: preparing a case preform; processing the inner surface of the case preform using a laser; and surface-treating the outer surface of the case preform, wherein the outer surface of the case preform shows fine prominences and depressions formed by the surface-treating of the outer surface of the case preform, and patterns formed by processing the inner surface of the case preform appear bumpily on the outer surface of the case preform.Type: GrantFiled: April 21, 2011Date of Patent: April 15, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Chul Jin, Yong-Wook Hwang, Seung-Chang Baek, Jong-Woo Kim, Hoon-Soo Park
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Publication number: 20130323579Abstract: Provided are a cover having a metallic grid structure and a method for manufacturing the cover. The cover includes a pattern portion formed of a metallic material, in which a plurality of patterns are independently disposed spaced apart from each other and an injection portion disposed between pattern portions to connect the pattern portions, the injection portion being formed of a non-metallic material. The method includes forming a pre-pattern portion including patterns in a regular or irregular form and a bridge connecting the patterns on a metallic plate, forming the injection portion on the pre-pattern portion by insert-injection or thermo-compression press, and removing the bridge.Type: ApplicationFiled: May 31, 2013Publication date: December 5, 2013Inventors: Yong-Wook Hwang, Sung-Ho Cho, Hee-Cheul Moon, Seung-Chang Baek, Chan-Seob Park
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Patent number: 8507816Abstract: A keypad for an electronic device having metallic texture has rigidity and elasticity equivalent to those of stainless steel. The keypad is manufactured and includes a metal alloy board, a keypad body manufactured by primarily thermal-treating the metal alloy board to a rigidity enough to be molded and molding the primarily thermal-treated metal alloy board with a press, a button portion formed by secondarily thermal-treating the keypad body to cure the keypad body and etching the secondarily thermal-treated keypad body by means of etching processing, and urethane rubber and a silicon pad attached to a back surface of the keypad body which has undergone anodizing processing and various colorations.Type: GrantFiled: September 15, 2010Date of Patent: August 13, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Yoon-Hee Lee, Seung-Chang Baek, Young-Ki Kim, Yong-Wook Hwang, Jun-Young Lee, Sung-Wook Kang
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Publication number: 20110259780Abstract: A method of fabricating a case for a portable electronic device includes: preparing a case preform; processing the inner surface of the case preform using a laser; and surface-treating the outer surface of the case preform, wherein the outer surface of the case preform shows fine prominences and depressions formed by the surface-treating of the outer surface of the case preform, and patterns formed by processing the inner surface of the case preform appear bumpily on the outer surface of the case preform.Type: ApplicationFiled: April 21, 2011Publication date: October 27, 2011Applicant: Samsung Electronics Co., LTD.Inventors: Jae-Chul Jin, Yong-Wook Hwang, Seung-Chang Baek, Jong-Woo Kim, Hoon-Soo Park
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Publication number: 20110128165Abstract: A keypad for an electronic device having metallic texture has rigidity and elasticity equivalent to those of stainless steel. The keypad is manufactured and includes a metal alloy board, a keypad body manufactured by primarily thermal-treating the metal alloy board to a rigidity enough to be molded and molding the primarily thermal-treated metal alloy board with a press, a button portion formed by secondarily thermal-treating the keypad body to cure the keypad body and etching the secondarily thermal-treated keypad body by means of etching processing, and urethane rubber and a silicon pad attached to a back surface of the keypad body which has undergone anodizing processing and various colorations.Type: ApplicationFiled: September 15, 2010Publication date: June 2, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yoon-Hee LEE, Seung-Chang BAEK, Young-Ki KIM, Yong-Wook HWANG, Jun-Young LEE, Sung-Wook KANG