Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.

Abstract: The present invention relates to an image encoding and decoding technique, and more particularly, to an image encoder and decoder using unidirectional prediction. The image encoder includes a dividing unit to divide a macro block into a plurality of sub-blocks, a unidirectional application determining unit to determine whether an identical prediction mode is applied to each of the plurality of sub-blocks, and a prediction mode determining unit to determine a prediction mode with respect to each of the plurality of sub-blocks based on a determined result of the unidirectional application determining unit.

Abstract: There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor device comprising, a first active pattern on a substrate, the first active pattern including a first lower pattern, which extends in a first direction, and first sheet patterns, which are on the first lower pattern, a second active pattern on the substrate, the second active pattern including a second lower pattern, which is spaced apart from the first lower pattern in a second direction and a second sheet patterns, which are on the second lower pattern, wherein the first lower pattern and the second lower pattern is separated by a fin trench.

Abstract: A fan-out semiconductor package includes a frame comprising wiring layers, and a dummy layer, and having a recessed portion on a bottom surface on which a stopper layer is disposed; a semiconductor chip disposed in the recessed portion such that an inactive surface opposes the stopper layer; a first interconnect structure disposed on the connection pad; a second interconnect structure disposed on the outermost wiring layer; a dummy structure disposed on the dummy layer; an encapsulant encapsulating at least portions of the frame, the semiconductor chip, the first interconnect structure, the second interconnect structure, and the dummy structure, and filling at least a portion of the recessed portion; and a connection member disposed on the frame and an active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to first and second metal bumps. The dummy structure has sloped side surfaces.

Abstract: A fan-out semiconductor package includes a frame comprising wiring layers, and a dummy layer, and having a recessed portion on a bottom surface on which a stopper layer is disposed; a semiconductor chip disposed in the recessed portion such that an inactive surface opposes the stopper layer; a first interconnect structure disposed on the connection pad; a second interconnect structure disposed on the outermost wiring layer; a dummy structure disposed on the dummy layer; an encapsulant encapsulating at least portions of the frame, the semiconductor chip, the first interconnect structure, the second interconnect structure, and the dummy structure, and filling at least a portion of the recessed portion; and a connection member disposed on the frame and an active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to first and second metal bumps. The dummy structure has sloped side surfaces.

Abstract: The present invention relates to a multipurpose assistance lamp which includes: a lighting unit which includes a transparent film and a casing plate which are disposed on a front surface and a back surface of an OLED lighting sheet, respectively; and a back housing which is attached to a back surface of the casing plate, and accommodates therein a circuit part and a battery for operating the OLED lighting sheet, thereby minimizing a thickness and providing light having improved brightness, by adopting an OLED as a light source.

Abstract: There is provided a multipurpose disaster safety lantern including a top body in which a lighting light emitting diode (LED) is accommodated, and which has a reflective guide and a lens configured to direct a light beam radiated from the lighting LED and is formed of rubber having elasticity, an air discharge protrusion which is arranged on aside surface of the top body to communicate with a space between a front surface of the top body and the lens and is formed of rubber having elasticity, and an inside of which is empty, a main body which is coupled to the top body and which forms a body of the lantern, and at least one first LED bar provided on a surface of the main body along a longitudinal direction of the main body.

Abstract: A fan-out semiconductor package includes: a first semiconductor chip having a first active surface having first connection pads; a first encapsulant encapsulating the first semiconductor chip; a first connection member disposed on the first active surface and including a first redistribution layer electrically connected to the first connection pads; a second semiconductor chip having a second active surface having second connection pads; a second encapsulant covering the first connection member and encapsulating the second semiconductor chip; a second connection member disposed on the second active surface and including a second redistribution layer electrically connected to the second connection pads; and a third via penetrating through the second encapsulant, connecting the first redistribution layer and the second redistribution layer to each other, and including a metal post connected to the first redistribution layer and a via conductor disposed on the metal post and connected to the second redistributio

Abstract: A fan-out semiconductor package includes: a first semiconductor chip having a first active surface having first connection pads; a first encapsulant encapsulating the first semiconductor chip; a first connection member disposed on the first active surface and including a first redistribution layer electrically connected to the first connection pads; a second semiconductor chip having a second active surface having second connection pads; a second encapsulant covering the first connection member and encapsulating the second semiconductor chip; a second connection member disposed on the second active surface and including a second redistribution layer electrically connected to the second connection pads; and a third via penetrating through the second encapsulant, connecting the first redistribution layer and the second redistribution layer to each other, and including a metal post connected to the first redistribution layer and a via conductor disposed on the metal post and connected to the second redistributio

Abstract: The present invention relates to an OLED standing lamp in which a lighting unit includes a band-shaped transparent film and a band-shaped casing plate, which are disposed on a front surface and a back surface of a band-shaped OLED lighting sheet, respectively, a support body has one end portion at an upper side thereof which is fastened to one end portion of the lighting unit and supports the lighting unit so that the lighting unit is spaced apart from the ground, and a base is extended on the ground and supports the support body fastened to the lighting unit, thereby minimizing a thickness and providing light having improved brightness, by adopting an OLED as a light source.

Abstract: A fan-out semiconductor package includes a frame having a through hole, a semiconductor chip disposed in the through hole and including connection pads, an encapsulant encapsulating at least a portion of the frame and the semiconductor chip, and a redistribution layer disposed on the frame and the semiconductor chip and including a first region and a second region. In the first region, a first via and a second via, electrically connected to one of the connection pads, disposed in different layers, and connected by a wiring pattern, are disposed. In the second region, a third via and a fourth via, electrically connected to another of the connection pads, disposed in different layers, and connected by the wiring pattern, are disposed. A distance between axes of the first via and the second via is shorter than a distance between axes of the third via and the fourth via.

Abstract: Disclosed is a multipurpose assistance lamp in which a lighting unit includes a transparent film and a casing plate, which have a curved surface, respectively, and are disposed on a front surface and a back surface of an OLED lighting sheet having a curved surface, a rotary body is coupled to one end portion of the lighting unit so as to support the lighting unit, and a circuit part and a battery for operating the OLED lighting sheet are provided in a base that is hingedly coupled to the rotary body, thereby reducing or minimizing a thickness by adopting an OLED as a light source, and providing light having improved brightness.

Abstract: There is provided a multipurpose disaster safety lantern including a top body in which a lighting light emitting diode (LED) is accommodated, and which has a reflective guide and a lens configured to direct a light beam radiated from the lighting LED and is formed of rubber having elasticity, an air discharge protrusion which is arranged on aside surface of the top body to communicate with a space between a front surface of the top body and the lens and is formed of rubber having elasticity, and an inside of which is empty, a main body which is coupled to the top body and which forms a body of the lantern, and at least one first LED bar provided on a surface of the main body along a longitudinal direction of the main body.

Abstract: A fan-out semiconductor package includes a frame having a through hole, a semiconductor chip disposed in the through hole and including connection pads, an encapsulant encapsulating at least a portion of the frame and the semiconductor chip, and a redistribution layer disposed on the frame and the semiconductor chip and including a first region and a second region. In the first region, a first via and a second via, electrically connected to one of the connection pads, disposed in different layers, and connected by a wiring pattern, are disposed. In the second region, a third via and a fourth via, electrically connected to another of the connection pads, disposed in different layers, and connected by the wiring pattern, are disposed. A distance between axes of the first via and the second via is shorter than a distance between axes of the third via and the fourth via.

Abstract: A fan-out semiconductor package includes a frame having a through hole, a semiconductor chip disposed in the through hole and including connection pads, an encapsulant encapsulating at least a portion of the frame and the semiconductor chip, and a redistribution layer disposed on the frame and the semiconductor chip and including a first region and a second region. In the first region, a first via and a second via, electrically connected to one of the connection pads, disposed in different layers, and connected by a wiring pattern, are disposed. In the second region, a third via and a fourth via, electrically connected to another of the connection pads, disposed in different layers, and connected by the wiring pattern, are disposed. A distance between axes of the first via and the second via is shorter than a distance between axes of the third via and the fourth via.

Abstract: A fan-out semiconductor package includes a frame having a through hole, a semiconductor chip disposed in the through hole and including connection pads, an encapsulant encapsulating at least a portion of the frame and the semiconductor chip, and a redistribution layer disposed on the frame and the semiconductor chip and including a first region and a second region. In the first region, a first via and a second via, electrically connected to one of the connection pads, disposed in different layers, and connected by a wiring pattern, are disposed. In the second region, a third via and a fourth via, electrically connected to another of the connection pads, disposed in different layers, and connected by the wiring pattern, are disposed. A distance between axes of the first via and the second via is shorter than a distance between axes of the third via and the fourth via.

Abstract: The present invention relates to an OLED standing lamp in which a lighting unit includes a band-shaped transparent film and a band-shaped casing plate, which are disposed on a front surface and a back surface of a band-shaped OLED lighting sheet, respectively, a support body has one end portion at an upper side thereof which is fastened to one end portion of the lighting unit and supports the lighting unit so that the lighting unit is spaced apart from the ground, and a base is extended on the ground and supports the support body fastened to the lighting unit, thereby minimizing a thickness and providing light having improved brightness, by adopting an OLED as a light source.

Abstract: Disclosed is a multipurpose assistance lamp in which a lighting unit includes a transparent film and a casing plate, which have a curved surface, respectively, and are disposed on a front surface and a back surface of an OLED lighting sheet having a curved surface, a rotary body is coupled to one end portion of the lighting unit so as to support the lighting unit, and a circuit part and a battery for operating the OLED lighting sheet are provided in a base that is hingedly coupled to the rotary body, thereby reducing or minimizing a thickness by adopting an OLED as a light source, and providing light having improved brightness.

Abstract: The present invention relates to a multipurpose assistance lamp which includes: a lighting unit which includes a transparent film and a casing plate which are disposed on a front surface and a back surface of an OLED lighting sheet, respectively; and a back housing which is attached to a back surface of the casing plate, and accommodates therein a circuit part and a battery for operating the OLED lighting sheet, thereby minimizing a thickness and providing light having improved brightness, by adopting an OLED as a light source.

Abstract: A scanning electron microscope capable of controlling the spot of an electron beam and a measurement method using the same. The scanning electron microscope includes electron magnets disposed in a path in which an electron beam irradiated to a sample moves from the electron beam source of the scanning electron microscope to a sample and configured to control and irradiate the spot of the electron beam in a linear electron beam having a different horizontal to vertical ratio. A control unit controls a ratio and direction of the spot of the electron beam by controlling a supply voltage of the electron magnets.