Abstract: A display device includes: a display panel including a folding area and a non-folding area on one side of the folding area; and an upper protective member on a first surface of the display panel and including a coating layer, wherein the coating layer includes: a first portion overlapping the folding area; and a second portion on one side of the first portion, wherein a contact angle of the first portion is different from a contact angle of the second portion.

Abstract: A coil component is disposed. The coil component according to an aspect of the present disclosure includes: a body; a coil portion disposed in the body; an external electrode portion including a first metal layer disposed on the body, and connected to the coil portion; and a surface insulating layer disposed on the body to cover a first region of the first metal layer and open a second region of the first metal layer. Surface roughness of an interface of the first region of the first metal layer with the surface insulating layer is higher than surface roughness of an outer surface of the second region of the first metal layer.

Abstract: A display device includes a circuit layer including emission pixel drivers, and data lines transferring data signals of the emission pixel drivers; a data driver generating the data signals of the emission pixel drivers; and a demultiplexer circuit electrically connected between the data driver and the data lines and including a first demultiplexer transistor turned on by a first demultiplexer control signal and a second demultiplexer transistor turned on by a second demultiplexer control signal. A first data line of the data lines is electrically connected to the data driver through the first demultiplexer transistor and a transfer path shorter than a first extension length. A second data line of the data lines is electrically connected to the data driver through the second demultiplexer transistor and a transfer path longer than or equal to the first extension length.

Abstract: A coil component includes a body having one surface and the other surface, opposing each other, both lateral surfaces respectively connecting the one surface and the other surface and opposing each other, and both end surfaces respectively connecting the both lateral surfaces and opposing each other; a coil unit disposed in the body; a first external electrode and a second external electrode, respectively connected to the coil unit and disposed to be spaced apart from each other on the one surface of the body; and a first insulating layer covering the other surface of the body, the both lateral surfaces of the body, and the both end surfaces of the body.

Abstract: According to an embodiment of the present disclosure, provided is a radiation element structure arranged on a reflective plate, comprising: a radiation unit including a dielectric portion made from plastic material and first to fourth radiation arms arranged in a four-sided symmetrical structure on one surface of the dielectric portion; and a plurality of balun units, including a balun body connecting the reflective plate and the radiation unit, a feed line disposed on the upper surface of the balun body to feed the radiation unit, and a ground disposed on the lower surface of the balun body.

Abstract: The present disclosure relates to an image encoding/decoding method for a machine and a device therefor. An image encoding method according to the present disclosure includes extracting an encoding method feature from an encoding input signal; determining an encoding method that is optimal for the encoding input signal based on the encoding method feature; transforming the encoding input signal based on the encoding method; and encoding an encoding target signal generated by transforming encoding method information and the encoding input signal.

Abstract: Provided are a novel organostannyl silicate compound, a method for preparing the same, a photoresist composition including the organostannyl silicate compound according to the present disclosure, and a method for forming a photoresist pattern using the composition. The organostannyl silicate compound of the present disclosure is industrially very useful, since the compound may implement a photoresist composition having excellent light sensitivity and etching resistance and a high-quality semiconductor device may be manufactured using the composition.

Abstract: Provided is a method for producing (alkyl)arene compounds represented by Formulae 3-1, 3-2, and 3-3 by the Friedel-Crafts alkylation reaction of alkyl halide compounds and arene compounds using organic phosphine compounds as a catalyst.

Abstract: Provided is a method for producing (alkyl)arene compounds represented by Formulae 3-1, 3-2, and 3-3 by the Friedel-Crafts alkylation reaction of alkyl halide compounds and arene compounds using organic phosphine compounds as a catalyst.

Abstract: A heating apparatus including a side wall heat insulator configured to provide an inner space for receiving a reaction tube, an upper wall heat insulator covering a top portion of the side wall heat insulator, a heat generation part in an inner surface of the side wall heat insulator, and a heat compensating part on a lower surface of the upper wall heat insulator, the heat compensating part including a reflection surface in a first region on the lower surface of the upper wall heat insulator, the first region having a first emissivity less than an emissivity of the upper wall heat insulator may be provided.

Abstract: A heating apparatus including a side wall heat insulator configured to provide an inner space for receiving a reaction tube, an upper wall heat insulator covering a top portion of the side wall heat insulator, a heat generation part in an inner surface of the side wall heat insulator, and a heat compensating part on a lower surface of the upper wall heat insulator, the heat compensating part including a reflection surface in a first region on the lower surface of the upper wall heat insulator, the first region having a first emissivity less than an emissivity of the upper wall heat insulator may be provided.