Abstract: Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.

Abstract: Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.

Abstract: Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.

Abstract: An embodiment provides a deposition device including a magnet part that includes magnets; and a substrate support that faces the magnet part and that supports a substrate, the substrate support includes a support plate and patterns formed on a first surface of the support plate, and each of the patterns corresponds to a space between neighboring magnets among the magnets or corresponds to the magnets.

Abstract: Provided are a method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material, a unidirectionally aligned discontinuous fiber reinforcement composite material, and a sandwich structure. The method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material comprises discontinuously aligning short fibers on a polymer substrate in one direction by using an air-laid method.

Abstract: Provided is a porous single resin fiber composite material comprising: a first fibrous particle; a second fibrous particle; and a binder for binding the first fibrous particle and the second fibrous particle, wherein the first fibrous particles and the second fibrous particles are bound by the binder so as to form a random network structure including pores, the first fibrous particle is a polyester-based fiber including a first polyester-based resin, the second fibrous particle is a polyester-based fiber including a second polyester-based resin, the binder includes a third polyester-based resin, the first fibrous particle has an elongation rate higher than that of the second fibrous particle, and the melting point of the second polyester-based resin is higher than the melting point of the third polyester-based resin.

Abstract: Provided are a method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material, a unidirectionally aligned discontinuous fiber reinforcement composite material, and a sandwich structure. The method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material comprises discontinuously aligning short fibers on a polymer substrate in one direction by using an air-laid method.

Abstract: Provided is a porous single resin fiber composite material comprising: a first fibrous particle; a second fibrous particle; and a binder for binding the first fibrous particle and the second fibrous particle, wherein the first fibrous particles and the second fibrous particles are bound by the binder so as to form a random network structure including pores, the first fibrous particle is a polyester-based fiber including a first polyester-based resin, the second fibrous particle is a polyester-based fiber including a second polyester-based resin, the binder includes a third polyester-based resin, the first fibrous particle has an elongation rate higher than that of the second fibrous particle, and the melting point of the second polyester-based resin is higher than the melting point of the third polyester-based resin.

Abstract: A thinner composition including an acetate-based compound in an amount in a range of about 30 weight percent to about 70 weight percent, a lactate-based compound in an amount in a range of about 1 weight percent to about 20 weight percent, a propionate-based compound in an amount in a range of about 30 weight percent to about 60 weight percent, and an ether-based additive in an amount in a range of about 10 ppm to about 500 ppm, based on a total amount of the composition.

Abstract: A thinner composition including an acetate-based compound in an amount in a range of about 30 weight percent to about 70 weight percent, a lactate-based compound in an amount in a range of about 1 weight percent to about 20 weight percent, a propionate-based compound in an amount in a range of about 30 weight percent to about 60 weight percent, and an ether-based additive in an amount in a range of about 10 ppm to about 500 ppm, based on a total amount of the composition.

Abstract: In a thinner composition and a method of forming a photosensitive film, the thinner composition includes about 50 to about 90% by weight of propylene glycol monomethyl ether acetate, about 1 to about 20% by weight of propylene glycol monomethyl ether, about 1 to about 10% by weight of ?-butyrolactone, and about 1 to about 20% by weight of n-butyl acetate. The thinner composition may have a proper volatility and an improved ability to dissolve various types of photosensitive materials, and thus the thinner composition may be usefully employed in an edge bead rinse process, a rework process or a pre-wetting process.

Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.

Abstract: In a thinner composition and a method of forming a photosensitive film, the thinner composition includes about 50 to about 90% by weight of propylene glycol monomethyl ether acetate, about 1 to about 20% by weight of propylene glycol monomethyl ether, about 1 to about 10% by weight of ?-butyrolactone, and about 1 to about 20% by weight of n-butyl acetate. The thinner composition may have a proper volatility and an improved ability to dissolve various types of photosensitive materials, and thus the thinner composition may be usefully employed in an edge bead rinse process, a rework process or a pre-wetting process.

Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.

Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.

Abstract: A film (e.g., silicon polymer film, photoresist film) may be removed by applying a composition including a quaternary ammonium hydroxide, a sulfoxide compound, a dialkylene glycol alkyl ether, and/or water to the film. A silicon polymer film (e.g., hard mask layer) and a photoresist film, for example, may be removed by the composition using an in-situ process. Additionally, the composition may remove the silicon polymer film and the photoresist film while preventing or reducing damage to an underlying layer and the generation of particle-type etch residue.

Abstract: A metal-containing pattern structure is formed on a semiconductor substrate, and a cleaning composition is applied to the semiconductor substrate. The cleaning composition includes, based on a total weight of the cleaning composition, about 78 wt % to about 99.98 wt % of an acidic aqueous solution, about 0.01 wt % to about 11 wt % of a first chelating agent, and about 0.01 wt % to about 11 wt % of a second chelating agent. The metal-containing pattern structure includes an exposed first surface portion and a second surface portion covered with a polymer. Application of the cleaning solution forms a first corrosion-inhibition layer on the first surface portion of the metal-containing pattern structure, and removes the polymer from the second surface portion of the metal-containing pattern structure.

Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.

Abstract: A thinner composition is effective in removing a variety of photoresists, and includes propylene glycol mono-methyl ether acetate, ethyl 3-ethoxy propionate and at least one of &ggr;-butyro lactone and propylene glycol mono-methyl ether. The thinner composition can selectively strip a photoresist coated on a backside and at an edge portion of a substrate, as well as a photoresist coated on a whole front surface of the substrate.

Abstract: A thinner composition is effective in removing a variety of photoresists, and includes propylene glycol mono-methyl ether acetate, ethyl 3-ethoxy propionate and at least one of &ggr;-butyro lactone and propylene glycol mono-methyl ether. The thinner composition can selectively strip a photoresist coated on a backside and at an edge portion of a substrate, as well as a photoresist coated on a whole front surface of the substrate.