Abstract: A chip on film (COF) package includes a film substrate including a base film having a mounting region, a main line pattern extending on the base film, and a branch line pattern extending on the base film and electrically connected to the main line pattern, a semiconductor chip vertically overlapping the mounting region, a first bump structure disposed between the semiconductor chip and the film substrate and electrically connected to the main line pattern, and a second bump structure disposed between the semiconductor chip and the film substrate and electrically connected to the branch line pattern, the branch line pattern extends so as not to overlap a first edge of the first bump structure facing a first edge of the mounting region and a first edge of the second bump structure facing the first edge of the mounting region.

Abstract: The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.

Abstract: A volumetric microfluidic injector for capillary electrophoresis (CE) for highly repeatable sample injection has been designed and built to eliminate known injection bias in hydrodynamic injection. A defined volume from 1-10 nL or 0.1-100 nL of sample is confined in a defined region of a micro-valve PDMS microfluidic injector chip and electrophoretic potential is applied to drive sample into a separation device such as an embedded fused silica capillary for separation and detection. Using a 75 ?m ID capillary, the RSD of an absorbance peak area as low as 1.32% (n=11) is obtained. As a comparison, the time-dependent injection was tested using the same chip which resulted in an inferior repeatability.

Abstract: The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.

Abstract: A volumetric microfluidic injector for capillary electrophoresis (CE) for highly repeatable sample injection has been designed and built to eliminate known injection bias in hydrodynamic injection. A defined volume from 1-10 nL or 0.1-100 nL of sample is confined in a defined region of a micro-valve PDMS microfluidic injector chip and electrophoretic potential is applied to drive sample into a separation device such as an embedded fused silica capillary for separation and detection. Using a 75 ?m ID capillary, the RSD of an absorbance peak area as low as 1.32% (n=11) is obtained. As a comparison, the time-dependent injection was tested using the same chip which resulted in an inferior repeatability.

Abstract: The present invention is directed to devices formed from three-dimensional (3D) structures composed of metallic, ceramic or polymeric wires or bundles and yarns of wires that are either solid or hollow like a tube. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, in some cases using a topology optimization routine that includes the 3D manufacturing constraints. The properties can be optimized in different directions. The 3D structures of the present invention include multiple properties that are optimized for a range of different applications, including heat transfer. The present invention also includes the methods for optimization of the 3D structures as well as methods of use of the 3D structures in heat transfer applications.

Abstract: The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.

Abstract: The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.