Abstract: Disclosed is a free-standing porous separator including a plurality of inorganic particles and a binder polymer positioned on the whole or a part of the surface of the inorganic particles to connect the inorganic particles with one another and fix them, wherein the binder polymer comprises a polyvinylidene fluoride (PVdF)-based binder polymer modified with an ester (COO)- or carboxyl (COOH)-containing monomer. An electrochemical device including the free-standing porous separator is also disclosed. It is possible to provide a porous separator which has a reduced dimensional change in an electrolyte, while showing improved tensile strength and/or elongation at the same time.

Abstract: The present invention provides: a peptide having antibacterial activity; a composition for preventing or treating sepsis comprising same; and an antibacterial composition. More specifically, the peptide according to the present invention has the excellent effects of not only suppressing the growth of bacteria but removing endotoxins derived from bacteria, thus exhibiting an excellent therapeutic effect on sepsis, and thus can be usefully used to prevent or treat sepsis. In addition, the peptide according to the present invention has selectively excellent antibacterial activity against Gram positive/negative bacteria, and thus can be usefully used in an antibacterial composition for Gram-positive/negative bacteria, or to prevent or treat various infectious diseases caused by Gram-positive/negative bacteria.

Abstract: Proposed are a rinse solution composition for extreme ultraviolet photolithography and a pattern formation method using the same. The rinse solution composition includes 0.0001 to 0.01 wt % of a fluorine-based surfactant, 0.0001 to 0.5 wt % of a pattern reinforcing agent which is a compound of Formula (1), a compound of Formula (2), or a mixture thereof, 0.0001 to 0.5 wt % of a substance selected from the group consisting of a triol derivative, a tetraol derivative, and a mixture thereof, and a residual amount of water.

Abstract: The present invention relates to an activator, a method of forming a thin film using the activator, a semiconductor substrate fabricated using the method, and a semiconductor device including the semiconductor substrate. According to the present invention, by providing a compound having a predetermined structure as an activator, the reaction rate may be improved by effectively replacing the ligands of an adsorbed precursor, and the thin film growth rate may be appropriately reduced. Thus, even when forming a thin film on a substrate with a complex structure, step coverage and the thickness uniformity of a thin film may be greatly improved, and impurities may be reduced.

Abstract: The present invention relates to a thin film modification composition, a method of forming a thin film using the thin film modification composition, a semiconductor substrate including the thin film, and a semiconductor device including the semiconductor substrate. According to the present invention, by using a shielding material and a diffusion-improving agent in combination, the reaction speed may be improved and the thin film growth rate may be appropriately reduced. Thus, even when forming a thin film on a substrate with a complex structure under high-temperature conditions, step coverage and the thickness uniformity of a thin film may be greatly improved, impurities may be reduced, and film quality may be improved.

Abstract: The present invention relates to a thin film shielding agent, a thin film-forming composition including the thin film shielding agent, a method of forming a thin film using the thin film shielding agent, a semiconductor substrate including the thin film, and a semiconductor device including the semiconductor substrate. According to the present invention, by applying the thin film shielding agent, the reaction speed may be improved, and the thin film growth rate may be appropriately reduced. Accordingly, even when a thin film is formed on a substrate having a complex structure under high-temperature conditions, step coverage and the thickness uniformity of the thin film may be greatly improved, and a seamless thin film may be formed. In addition, by reducing impurities, film quality may be improved.

Abstract: The present invention relates to a thin film modification composition, a method of forming a thin film using the thin film modification composition, a semiconductor substrate including the thin film, and a semiconductor device including the semiconductor substrate. According to the present invention, by using a step coverage improver and a diffusion improver in combination, the reaction speed may be improved and the thin film growth rate may be appropriately reduced. Thus, even when forming a thin film on a substrate with a complex structure under high-temperature conditions, step coverage and the thickness uniformity of a thin film may be greatly improved, impurities may be reduced, and film quality may be improved.

Abstract: An electrode assembly includes: an electrode stack in which an electrode and a separator are alternately interposed; and an electrode lead extending from the electrode. A thickness of the electrode stack is 15 times or more a thickness of the electrode lead so as to prevent or suppress heat propagation to an adjacent secondary battery.

Abstract: The present invention relates to a thin film modification composition, a method of forming a thin film using the thin film modification composition, a semiconductor substrate including the thin film, and a semiconductor device including the semiconductor substrate. According to the present invention, by using a step coverage improver and an amine compound in combination, the reaction speed may be improved and the thin film growth rate may be appropriately reduced. Thus, even when forming a thin film on a substrate with a complex structure under high-temperature conditions, step coverage and the thickness uniformity of a thin film may be greatly improved, impurities may be reduced, and film quality may be improved.

Abstract: Disclosed is an electrochemical device separator including a porous polymer substrate and an organic/inorganic composite porous coating layer formed on at least one side of the polymer substrate, wherein the organic/inorganic composite porous coating layer comprises particulate binder resins and first inorganic particles, the particulate binder polymers include hybrid polymer particles of a fluorine-based polymer and an acrylic-based polymer and acrylic-based polymer particles, the acrylic polymer particles have a particle size D50 “a” in a range of 1 to 7.5 ?m, the first inorganic particles have a particle size D50 “b” in a range of 200 to 800 nm, a/b is 2 to 15, and the hybrid polymer particles have a particle size D50 smaller than that of the acrylic polymer particles.

Abstract: Proposed is a chemically amplified positive photoresist composition for improving a pattern profile and enhancing adhesion, the photoresist composition being exposable by a light source having a wavelength of 248 nm and including, with respect to the total weight of the composition, 1 to 5 wt % of a polyhydric alcohol additive represented by Chemical Formulas 1 to 8 in order to implement a vertical profile without pattern collapse.

Abstract: Proposed is a photoresist composition that can be exposed by a light source having a wavelength of 248 nm, the photoresist composition being a chemically-amplified positive photoresist composition for pattern profile improvement and etch resistance enhancement and including a hydroxy group-containing phenolic polymer resin represented by Chemical Formula 4 prepared by selecting one from among compounds represented by Chemical Formulas 1 to 3 as a monomer that is effective in etch resistance and performing copolymerization. The photoresist composition can exhibit excellent etch resistance while a profile, which is more vertical than a conventional positive photoresist, is implemented.

Abstract: A separator for an electrochemical device including a porous polymer substrate and a porous coating layer on at least one side of the porous polymer substrate. The porous coating layer includes first binder particles, second binder particles, and inorganic particles. The inorganic particles are mostly dispersed in a first surface region of the porous coating layer, and the second binder particles are mostly dispersed in a second surface region of the porous polymer substrate, in which the first surface region faces the porous polymer substrate and the second surface region is an opposite surface region to the first surface region. The inorganic particles have a larger weight per particle than each respective weight per particle of the first and second binder particles.

Abstract: The present invention relates to a shielding compound, a method of forming a thin film using the shielding compound, a semiconductor substrate fabricated using the method, and a semiconductor device including the semiconductor substrate. According to the present invention, by providing a compound having a predetermined structure as a shielding agent, by forming a deposition layer with a uniform thickness as a shielded area on a substrate due to the difference in adsorption distribution of the shielding agent, the deposition rate of the thin film may be reduced, and the thin film growth rate may be appropriately reduced. In addition, even when forming a thin film on a substrate with a complex structure, step coverage and the thickness uniformity of a thin film may be greatly improved, and impurities may be reduced.

Abstract: The present invention relates to a method of forming a thin film, a semiconductor substrate fabricated using the method, and a semiconductor device including the semiconductor substrate. According to the present invention, by effectively replacing the ligand of an adsorption precursor by using a reaction surface pretreatment agent and a ligand substitution agent in combination, the reaction speed may be improved and the thin film growth rate may be appropriately reduced. In addition, even when forming a thin film on a substrate with a complex structure, step coverage and the thickness uniformity of a thin film may be greatly improved, impurities may be reduced, and film quality may be improved.

Abstract: The present invention relates to a step coverage improver, a method of forming a thin film using the step coverage improver, a semiconductor substrate including the thin film, and a semiconductor device including the semiconductor substrate. According to the present invention, by providing a compound with a predetermined structure as the step coverage improver, by forming a deposition layer with a uniform thickness as a shielded area on a substrate due to the difference in adsorption distribution of the compound, the deposition rate of the thin film may be reduced, and the thin film growth rate may be appropriately reduced. In addition, even when forming a thin film on a substrate with a complex structure, step coverage and the thickness uniformity of a thin film may be improved, and impurities may be greatly reduced.

Abstract: The present invention relates to a thin film modification composition, a method of forming a thin film using the thin film modification composition, a semiconductor substrate including the thin film, and a semiconductor device including the semiconductor substrate. According to the present invention, by using a thin film modification composition consisting of a film growth/film quality improvement compound having a predetermined structure and a solvent with a specific dielectric constant, the growth rate of a deposition film may be appropriately reduced in a vacuum-based thin film process. Thus, even when forming a thin film on a substrate with a complex structure, step coverage and the thickness uniformity of a thin film may be greatly improved, the efficiency of etching a film may be improved, and impurity contamination may be significantly reduced.

Abstract: A sensor cleaning device for a vehicle includes a housing mounted to an environment sensor of the vehicle. A compressed fluid may be selectively supplied into the housing. A rotor may be disposed in the housing and rotatable with respect to the environment sensor by the compressed fluid.

Abstract: Disclosed is a separator for an electrochemical device, a manufacturing method thereof, and an electrochemical device including the same. The separator improves the cohesive force between polymer binders and can prevent a coating layer from detaching from a polymer substrate by including in the coating layer a polymer binder mixture containing a plurality of polymer binders having different glass transition temperatures.

Abstract: Proposed is an electrochemical device separator including a porous polymer substrate and a porous organic/inorganic composite coating layer formed on at least one side of the polymer substrate. The porous organic/inorganic composite coating layer includes particulate binder polymers and inorganic particles. The particulate binder polymers include hybrid polymer particles of a fluorine-based polymer and an acrylic polymer and acrylic polymer particles. The porous organic/inorganic composite coating layer has the heterogeneity in composition morphology in a thickness direction, in which a content ratio of hybrid polymer particles/acrylic polymer particles present on a surface portion opposite to a surface in contact with the polymer substrate is greater than a content ratio of hybrid polymer particles/acrylic polymer particles present inside the porous organic/inorganic composite coating layer.