Patents by Inventor Seung-Hyun Park

Seung-Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240144871
    Abstract: A display device, includes: a display area and a non-display area; a plurality of signal lines over the display area; and a plurality of connection lines in the display area and connected to the signal lines, wherein the plurality of connection lines includes a plurality of first connection lines connected to the signal lines, respectively, a plurality of third connection lines on a same layer as the first connection lines, and a plurality of second connection lines connecting the first connection lines to the third connection lines.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Seung Hwan CHO, Jong Hyun CHOI, Ju Chan PARK, Seung Min SONG, Min Seong YI
  • Patent number: 11972839
    Abstract: A memory system includes a memory device including an interface circuit and a semiconductor memory, and a controller to generate a command for controlling the memory device. The interface circuit receives the command from the controller; determines whether the command is for the semiconductor memory or the interface circuit; and when it is determined that the command is for the interface circuit, performs a blocking operation to block transfer of the command between the interface circuit and the semiconductor memory and performs an internal operation of the interface circuit. The internal operation includes a signal controlling operation, a training operation, a read operation, an on-die termination operation, a ZQ calibration operation, or a driving force control operation.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 30, 2024
    Assignee: SK hynix Inc.
    Inventors: Chang Kyun Park, Young Sik Koh, Seung Jin Park, Dong Hyun Lee
  • Patent number: 11969285
    Abstract: The present invention relates to the dose adjustment device mountable to diagnostic radiation equipment and the dose adjustment system which allows radiation exposure in each portion of in the irradiation area to be prevented, and are configured as modules that are attachable to diagnostic radiation equipment, thus having the effect of allowing a radiation shielding function to be easily added to existing equipment without changing the structure thereof.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: April 30, 2024
    Assignee: KOREA INSTITUTE OF RADIOLOGICAL & MEDICAL SCIENCES
    Inventors: Seung Woo Park, Jong Hyun Back
  • Publication number: 20240130670
    Abstract: The present invention relates to a wearable pressure ulcer detection sensor, and the wearable pressure ulcer detection sensor according to the present invention includes a pressure sensor measuring pressure based on a change in capacitance caused by physical force, a temperature sensor measuring temperature based on a change in electrical conductivity due to electron hopping, and an impedance sensor including two electrodes spaced apart from each other and in contact with skin.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 25, 2024
    Inventors: Jin-Woo Park, Seung-Rok KIM, Hye-Jun Kil, Jin-Hoon KIM, Soyeon LEE, Ju-Hyun Yoo, Je-Heon Oh, Ey-In Lee
  • Publication number: 20240131576
    Abstract: Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.
    Type: Application
    Filed: February 21, 2022
    Publication date: April 25, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Patent number: 11968485
    Abstract: The present specification discloses a method for monitoring a mobile asset by using a sensing terminal which comprises: a coupling unit for coupling an object of interest to the housing; a sensor unit for generating sensing data for the object of interest; a processor for generating, on the basis of the sensing data, transmission unit data to be transmitted to a server; and a communication unit for transmitting the transmission unit data to the server.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: April 23, 2024
    Assignee: C&TECHCO., LTD.
    Inventors: Ki Duk Kim, Seung Hyun Park, Jeong Ho Lee
  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Publication number: 20240130111
    Abstract: A semiconductor device may comprise: a plurality of lower electrodes which are on a substrate; a first electrode support which is between adjacent lower electrodes and comprises a metallic material; a dielectric layer which is on the lower electrodes and the first electrode support to extend along profiles of the first electrode support and each of the lower electrodes; and an upper electrode which is on the dielectric layer.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yoon Young CHOI, Seung Jin KIM, Byung-Hyun LEE, Sang Jae PARK
  • Publication number: 20240128260
    Abstract: Disclosed are a semiconductor device (1) including a MOSPET region and an integrated diode region, and a manufacturing method thereof. More particularly, a semiconductor device (1) including a silicon carbide (SiC) MOSPET region and an integrated Schottky bather diode that reduce forward voltage drop (Vf), device area, and switching oscillation resulting from parasitic inductance are disclosed.
    Type: Application
    Filed: April 17, 2023
    Publication date: April 18, 2024
    Inventors: Seung Hyun KIM, Hee Bae LEE, Jae Yuhn MOON, Soon Jong PARK
  • Patent number: 11963403
    Abstract: A display device includes a first substrate. A transistor is disposed on the first substrate. A light-emitting element is connected to the transistor. An insulating layer is disposed between the transistor and the light-emitting element. A second substrate at least partially overlaps the first substrate. A color conversion layer is disposed on the second substrate. The insulating layer includes a first insulating layer and a second insulating layer. A distance between the first insulating layer and the first substrate is less than a distance between the second insulating layer and the first substrate. The first insulating layer includes a light blocking material.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung Hyun Park, Joo Sun Yoon, Woo Sik Jun, Yun-Mo Chung
  • Publication number: 20240120465
    Abstract: An anode active material for a secondary battery includes a carbon-based active material, and silicon-based active material particles doped with magnesium. At least some of the silicon-based active material particles include pores, and a volume ratio of pores having a diameter of 50 nm or less among the pores is 2% or less based on a total volume of the silicon-based active material particles.
    Type: Application
    Filed: September 7, 2023
    Publication date: April 11, 2024
    Inventors: Hwan Ho JANG, Moon Sung KIM, Hyo Mi KIM, Sang Baek RYU, Da Hye PARK, Eun Jun PARK, Seung Hyun YOOK, Da Bin CHUNG, Jun Hee HAN
  • Publication number: 20240118337
    Abstract: Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 11, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240120211
    Abstract: A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.
    Type: Application
    Filed: September 15, 2023
    Publication date: April 11, 2024
    Inventors: Jin Young Kim, Doo Hyun Park, Seung Jae Lee
  • Patent number: 11951890
    Abstract: Proposed are a seat side bolster apparatus and a control method thereof. The seat side bolster apparatus of the disclosure includes a driving unit, which is provided under a foam pad of a seat cushion, is moved upwards and downwards by operation of an actuator, and presses the foam pad upwards when moving upwards, and a covering bracket, which is connected to the driving unit so as to be moved upwards and downwards together with the driving unit and to which an end of a covering enveloping the foam pad of the seat cushion is fixed.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: April 9, 2024
    Assignee: HYUNDAI TRANSYS INCORPORATED
    Inventors: Jae Keun Park, Do Hyun Kim, Sung Hyun Jo, Seung Joon Lee, Jae Sang Lim
  • Publication number: 20240112968
    Abstract: Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.
    Type: Application
    Filed: March 23, 2022
    Publication date: April 4, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Patent number: 11949885
    Abstract: An intra prediction method and a device using the intra prediction method are provided. The intra prediction method includes the steps of: deriving a current prediction mode as a prediction mode of a current block; constructing neighboring samples of the current block with available reference samples; filtering the available reference samples; and generating predicted samples of the current block on the basis of the filtered available reference samples. The filtering step includes performing the filtering using the available reference sample located in the prediction direction of the current prediction mode and a predetermined number of available reference samples neighboring to the prediction direction of the current prediction mode.
    Type: Grant
    Filed: May 2, 2023
    Date of Patent: April 2, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Yong Joon Jeon, Seung Wook Park, Jung Sun Kim, Joon Young Park, Byeong Moon Jeon, Jae Hyun Lim
  • Publication number: 20240102611
    Abstract: A low profile flat bombe for Liquefied Petroleum Gas (LPG) storage and method for manufacturing the same, may include a flat bombe body including an upper plate having a plurality of first piercing holes and a pump installation hole formed therethrough, a lower plate having a plurality of second piercing holes formed therethrough at positions vertically coinciding with the plurality of first piercing holes, and side plates integrally connecting first and second side end portions of the upper and lower plates, end plates mounted at front and rear openings in the flat bombe body, and support pipes, wherein upper end portions of the support pipes are welded to internal circumferential portions of the plurality of first piercing holes and lower end portions thereof are welded to internal circumferential portions of the plurality of second piercing holes to maintain a vertical distance between the upper and lower plates.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAE HUNG PRECISION IND'L CO., LTD.
    Inventors: Seong Cheol Cho, Sung Won Lee, Ju Tae Song, Seung Hyun Yeo, Duk Hee Park
  • Publication number: 20240106551
    Abstract: A radio frequency (RF) test device such as a spectrum analyzer may include an RF attenuator to attenuate a received RF signal; a mixer to down-convert the attenuated RF signal; an IF attenuator to attenuate the down-converted signal; an analog-to-digital converter (ADC) to digitize the attenuated, down-converted signal; and a processor, which may select attenuation values for one or more of the RF attenuator and the IF attenuator based on an error magnitude vector (EVM) analysis, an RF signal type, and/or a signal level at an input of the ADC. The processor may use a look-up table for the selection. Initial attenuation values may be selected based on an expected RF signal type, RF signal frequency, and/or RF signal bandwidth. The attenuation values may also be selected in an iterative manner stepping the attenuation values up or down.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: VIAVI SOLUTIONS INC.
    Inventors: Bon-Jin KU, Seung-Gon HONG, Chang-Hyun PARK
  • Patent number: 11938232
    Abstract: The present invention relates to an X-ray irradiator for single blood bags, comprising: an X-ray irradiator main body provided with a chamber configured to safely hold a single blood bag therein and an X-ray tube configured to irradiate the chamber with X-rays; a loading part configured to load the blood bag; and a transfer part configured to transfer the blood bag between the loading part and the chamber to which X-rays are to be emitted. The X-ray irradiator for single blood bags according to the present invention can treat a single blood bag with X-rays, such that treatment optimized for a small amount of a blood bag can be performed, and a system configuration can be simplified by using an X-ray tube.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 26, 2024
    Assignee: KOREA INSTITUTE OF RADIOLOGICAL & MEDICAL SCIENCES
    Inventors: Seung Woo Park, Mun Sik Choi, Su Chul Han, Jong Hyun Back
  • Patent number: 11940837
    Abstract: A display that includes a display panel and a window laminated with the display panel is presented. The display panel may include: a main panel region including a first side extending in a first direction and a second side extending in a second direction crossing the first direction; a first sub-panel region that is in contact with the first side and is bent; and a second sub-panel region that is in contact with the second side and is bent. A panel corner part of the main panel region adjacent to the first sub-panel region and the second sub-panel region is rounded.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: March 26, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung-Hwan Cho, Jong Hyun Choi, Ju Chan Park, Joo Sun Yoon, Jong Hyuk Lee