Abstract: A substrate processing method is provided. The substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first DC pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first DC pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first DC pulse signal has a first level during the first section, and the first DC pulse signal has a second level different from the first level during the second section.

Abstract: Provided is a composition including an alicyclic acrylate derivative. A composition including an alicyclic acrylate derivative according to one embodiment of the present invention includes an alicyclic acrylate compound but does not include an amine derivative by-product.

Abstract: A molding apparatus for semiconductor package fabrication includes a bottom mold on which a molding object can be mounted, a top mold on the bottom mold including the molding object that is mounted on the bottom mold, and a side mold on one side of the bottom mold and the top mold. The side mold has a plurality of air vent holes. A cavity into which a molding material can be injected and made to flow is provided between the bottom mold and the top mold.

Abstract: A solder ball attachment apparatus including an open ball box configured to accommodate a plurality of solder balls, the open ball box including, a pocket portion at a bottom thereof, the pocket portion configured to accommodate the solder balls, and an inclined portion extending from the pocket portion toward an outer surface of the open ball box, a solder ball attachment tool configured to apply suction pressure to a lower surface thereof, the lower surface configured to face the open ball box, the lower surface configured to adsorb the solder balls accommodated in the ball box by moving between a first position and a second position, the first position being a standby position, the second position being a position for adsorbing the solder balls, and a vibration member connected to the open ball box may be provided.

Abstract: An apparatus for fabricating semiconductor packages may include a thickness measurer configured to measure the thickness of a printed circuit board (PCB); mold dies, clamped to the top and the bottom of the PCB, through which a molding compound may be injected; and a pressure controller configured to control a clamp pressure of the mold die in response to the thickness of the PCB. The thickness of the PCB may be measured before molding the PCB, and a clamp pressure corresponding to the measured thickness may be decided. Therefore, it is possible to adjust the thickness variation of a PCB in real time, as they are being produced, to decrease the number of bad packages.

Abstract: An apparatus for fabricating semiconductor packages may include a thickness measurer configured to measure the thickness of a printed circuit board (PCB); mold dies, clamped to the top and the bottom of the PCB, through which a molding compound may be injected; and a pressure controller configured to control a clamp pressure of the mold die in response to the thickness of the PCB. The thickness of the PCB may be measured before molding the PCB, and a clamp pressure corresponding to the measured thickness may be decided. Therefore, it is possible to adjust the thickness variation of a PCB in real time, as they are being produced, to decrease the number of bad packages.