Patents by Inventor SeungJoo Kwak

SeungJoo Kwak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with interconnects and method of manufacture thereof
    Patent number: 8609525
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: December 17, 2013
    Assignee: STATS ChipPAC Ltd.
    Inventors: BongHwan Han, Tae Kyu Choi, SeungJoo Kwak, DongWon Son, Gyung Sik Yun
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20120241964
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.
    Type: Application
    Filed: March 21, 2011
    Publication date: September 27, 2012
    Inventors: BongHwan Han, Tae Kyu Choi, SeungJoo Kwak, DongWon Son, Gyung Sik Yun