Patents by Inventor Seunglo LEE

Seunglo LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF FABRICATING THE SAME
    Publication number: 20190157237
    Abstract: A semiconductor device includes a first device having a first pad; a second device having a second pad; and a bonding wire electrically connecting the first device and the second device to each other via the first pad and the second pad. The bonding wire includes: a first bonding structure provided at a first end of the bonding wire, electrically connected to the first device and includes: a first ball bonding region; and a first stitch bonding region; and a second bonding structure provided at a second end opposite of the first end of the bonding wire and electrically connected to the second device.
    Type: Application
    Filed: August 7, 2018
    Publication date: May 23, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Je LEE, Seunglo LEE, Sungil CHO, Hosoo HAN