Patents by Inventor Seung Min Ahn
Seung Min Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240184318Abstract: An internal reference voltage generation device may include a cell array including a plurality of cells which provide reference voltages of different levels. Each of the plurality of cells may include one of a plurality of divider resistors included in a resistor string; a transmission gate configured to output a voltage of a divider node which is connected to the one divider resistor, in response to a select signal; and a unit decoder configured to provide the select signal to the transmission gate.Type: ApplicationFiled: May 12, 2023Publication date: June 6, 2024Inventors: Jae Hyeong HONG, Jung Yeop LEE, Bon Kwang KOO, Heon Ki KIM, Young Seok NAM, Young Jo PARK, Keun Seon AHN, Soon Sung AN, Sung Hwa OK, Se Min LEE, Seung Yeop LEE, Nam Hea JANG, Jun Seo JANG, Ji Eun JOO
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Publication number: 20240098885Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: KMW INC.Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Duk Yong KIM
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Publication number: 20240098880Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: KMW INC.Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Jun Woo YANG
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Publication number: 20230282422Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: ApplicationFiled: May 11, 2023Publication date: September 7, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Patent number: 11749460Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: GrantFiled: May 28, 2021Date of Patent: September 5, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Patent number: 11728095Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.Type: GrantFiled: August 30, 2021Date of Patent: August 15, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon Cho, Seung Min Ahn, Mi Na Hyun
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Patent number: 11515096Abstract: An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.Type: GrantFiled: April 23, 2021Date of Patent: November 29, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Min Ahn, Beom Joon Cho, Ki Young Kim
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Publication number: 20220181086Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.Type: ApplicationFiled: August 30, 2021Publication date: June 9, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon CHO, Seung Min AHN, Mi Na HYUN
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Publication number: 20220130614Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: ApplicationFiled: May 28, 2021Publication date: April 28, 2022Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Publication number: 20220084751Abstract: An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.Type: ApplicationFiled: April 23, 2021Publication date: March 17, 2022Inventors: Seung Min Ahn, Beom Joon Cho, Ki Young Kim