Abstract: A vehicle frame assembly includes a battery at a lower portion of a vehicle and a rear floor panel extending in a transverse direction of the vehicle and located rearward of the battery. Opposite ends of the rear floor panel have second rear mounting parts extending outward and a center portion between the second rear mounting parts is depressed downward to provide a boarding space. The vehicle frame assembly includes frame rear side members extending in a longitudinal direction of the vehicle at opposite lateral sides of the battery. Each frame rear side member has a front end and a back end connected to each other to be inclined and each front end has the same height as the boarding space depressed downward, and each back end is coupled to the second rear mounting parts in one direction to support the rear floor panel from below.

Abstract: A semiconductor device includes: a base substrate; a first interlayer insulating layer disposed on the base substrate; a power rail disposed inside the first interlayer insulating layer; an active pattern extended in a first horizontal direction and disposed on the first interlayer insulating layer; a gate electrode extended in a second horizontal direction different from the first horizontal direction and disposed on the active pattern; a gate cut extended in the first horizontal direction and disposed on the power rail, wherein the gate cut separates the gate electrode; and a power rail via disposed inside the gate cut, wherein the power rail via is overlapped by the power rail.