Abstract: An operation method includes measuring figure of merit (FoM) values for a first group of presets having different preset types, based on equalized signals output from a transmission equalizer included in an external device adjusted based on the first group, identifying a preset type of a first preset corresponding to first FoM value which is a greatest value from among the FoM values for the first group, measuring FoM values for a second group of presets having the identified preset type, based on equalized signals output from the transmission equalizer adjusted based on the second group, determining a second preset corresponding to second FoM value which is a greatest value from among the first FoM value and the FoM values for the second group, and transmitting an equalizing setup request that controls the transmission equalizer to the external device, based on the determined second preset.

Abstract: A cooling member located in an upper part of a battery cell stack in which a plurality of battery cells are stacked includes an upper plate, a lower plate, and a coolant incorporated in an inner space between the upper plate and the lower plate. The lower plate includes a first part in which a fragile part is formed, and a second part in which the fragile part is not formed. A thickness value of the first part is smaller than a thickness value of the second part.

Abstract: A display device, includes: a display area and a non-display area; a plurality of signal lines over the display area; and a plurality of connection lines in the display area and connected to the signal lines, wherein the plurality of connection lines includes a plurality of first connection lines connected to the signal lines, respectively, a plurality of third connection lines on a same layer as the first connection lines, and a plurality of second connection lines connecting the first connection lines to the third connection lines.

Abstract: A battery pack includes a battery module assembly having at least one battery cell, a pack case configured to accommodate the battery module assembly, and a barrier unit provided on at least one side of the pack case, configured to discharge a vent gas in the pack case to the outside of the pack case and having at least one blocking baffle disposed obliquely to have a predetermined inclination angle.

Abstract: A polyimide precursor monomer having an E value of 2.0 or more calculated by Equation 1 is selected among polyimide raw materials. A polyimide includes a structural unit derived from the polyimide precursor monomer having the E value of 2.0 or more. Optical properties of a polyimide film formed from the polyimide can be improved, and the optical properties of a polyimide film can be predicted from the E value of the polyimide precursor monomer even before production of the polyimide film.

Abstract: A battery pack includes a plurality of battery modules each including one or more battery cells to store and release energy, each battery module further including an intake portion and an exhaust portion, an intake duct including an intake channel and communicating with the intake portion of each of the plurality of battery modules, and an exhaust duct including an exhaust channel and communicating with the exhaust portion of each of the plurality of battery modules. Each of the plurality of battery modules further includes an opening/closing member configured to close the intake portion when internal pressure increases.

Abstract: Disclosed herein is a method of printing a nanostructure including: preparing a template substrate on which a pattern is formed; forming a replica pattern having an inverse phase of the pattern by coating a polymer thin film on an upper portion of the template substrate, adhering a thermal release tape to an upper portion of the polymer thin film, and separating the polymer thin film from the template substrate; forming a nanostructure by depositing a functional material on the replica pattern; and printing the nanostructure deposited on the replica pattern to a substrate by positioning the nanostructure on the substrate, applying heat and pressure to the nanostructure, and weakening an adhesive force between the thermal release tape and the replica pattern by the heat.

Abstract: A chip-on-film package includes: a lower base film including a first surface and a second surface, which are opposite to each other; an upper base film including a third surface and a fourth surface, which are opposite to each other, and is disposed on the lower base film; a first semiconductor chip mounted on the second surface of the lower base film; a second semiconductor chip mounted on the third surface of the upper base film; and an interposer film interposed between the lower and upper base films, wherein the second and third surfaces face each other.

Abstract: Disclosed herein is a method of depositing a transition metal single-atom catalyst including preparing a carbon carrier, and depositing a transition metal single-atom catalyst on the carbon carrier, in which the carbon carrier is surface-treated by an oxidation process, and wherein the deposition is carried out by an arc plasma process.

Abstract: A battery rack includes a plurality of battery modules, each including at least one battery cell, wherein each battery module has at least one venting hole; a rack case accommodating the plurality of battery modules; and a plurality of support brackets disposed in the rack case such that each support bracket supports each battery module and is in communication with the at least one venting hole.

Abstract: A battery pack is configured to improve safety by effectively suppressing heat transfer between battery modules in the present disclosure. A battery pack includes a plurality of battery modules each having one or more battery cells, configured to store and release energy, and stacked in at least one direction; a pack case provided on at least one side of the plurality of battery modules, covering at least a portion of the outside of the plurality of battery modules, and having one or more openings formed therein; and a melting member provided in the opening of the pack case to seal the opening and configured to open the opening by being melted by heat generated from one or more battery modules among the plurality of battery modules.

Abstract: An integrated circuit device includes a lower electrode, an upper electrode, and a dielectric layer structure between the lower electrode and the upper electrode, the dielectric layer structure including a first surface facing the lower electrode and a second surface facing the upper electrode. The dielectric layer structure includes a first dielectric layer including a first dielectric material and a plurality of grains extending from the first surface to the second surface and a second dielectric layer including a second dielectric material and surrounding a portion of a sidewall of each of the plurality of grains of the first dielectric layer in a level lower than the second surface. The second dielectric material includes a material having bandgap energy which is higher than bandgap energy of the first dielectric material.

Abstract: A semiconductor package includes a film substrate; a wiring layer provided on the film substrate; and a semiconductor chip provided on the wiring layer and electrically connected to the wiring layer. The film substrate includes a first layer, wherein the first layer is an insulating layer having the wiring layer thereon. The film substrate further includes a second layer, wherein the second layer is attached to a bottom of the first layer and comprises a gas. The second layer is configured to be peeled off of the first layer.

Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.

Abstract: An ion detection sensor fabrication method includes: preparing an ion-sensitive film preparation solution; preparing an ion-sensitive mixed layer preparation solution by mixing the ion-sensitive film preparation solution with graphene powder; and forming an ion-sensitive mixed layer sensitive to a target ion by applying the ion-sensitive mixed layer preparation solution to fill a gap between a source and a drain spaced apart from each other and to cover at least a portion of an upper surface of each of the source and the drain.

Abstract: A graphene manufacturing apparatus includes a gas supplying unit supplying a gas including carbon; a gas heating unit heating the gas supplied from the gas supplying unit; a deposition chamber in which a substrate having a catalyst layer is disposed; and an inlet pipe introducing the gas of the gas heating unit into the deposition chamber. A temperature of the deposition chamber is set at a temperature lower than a temperature of the gas heating unit so that a selection range with respect to a catalyst metal to be used in the catalyst layer may be expanded, and damage of the substrate due to a high temperature heat may be minimized.

Abstract: Provided is a method of post treating graphene including providing graphene on a metal thin film, providing a carrier on the graphene, hardening the carrier, and removing the metal thin film from the graphene.

Abstract: Provided is a method of post treating graphene including providing graphene on a metal thin film, providing a carrier on the graphene, hardening the carrier, and removing the metal thin film from the graphene.

Abstract: A graphene manufacturing apparatus includes a gas supplying unit supplying a gas including carbon; a gas heating unit heating the gas supplied from the gas supplying unit; a deposition chamber in which a substrate having a catalyst layer is disposed; and an inlet pipe introducing the gas of the gas heating unit into the deposition chamber. A temperature of the deposition chamber is set at a temperature lower than a temperature of the gas heating unit so that a selection range with respect to a catalyst metal to be used in the catalyst layer may be expanded, and damage of the substrate due to a high temperature heat may be minimized.

Abstract: Provided are a method and apparatus of manufacturing high quality large area graphene in large quantities. The method includes placing a supporting belt, on which a catalyst layer is loaded, into a chamber; increasing a temperature of the catalyst layer by injecting a carbon source into the chamber; forming graphene on the catalyst layer by cooling the catalyst layer; and taking out the supporting belt, on which the catalyst layer, on which the graphene is formed, is loaded, from the chamber to an outside, wherein a ratio between a melting point of the supporting belt and a maximum temperature Tmax of the catalyst metal layer that the catalyst layer is heated in the chamber is equal to or less than 0.6.