Patents by Inventor Seung-Ok Hong

Seung-Ok Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication of multifilament intermetallic superconductor using strengthened tin
    Patent number: 4860431
    Abstract: The centers of a plurality of copper tubes are filled with an alloy of tin with a minor amount of aluminum and drawn to form Cu-Sn wires which are cabled around a core Nb wire; a plurality of these strands are provided in a copper tube, or a copper foil or finely wound copper wire and drawn to produce a multifilament wire; heat treatment is applied to cause the tin to diffuse and form the intermetalic Nb.sub.3 Sn at the surface of the Nb filaments to produce the ultimate superconducting wire product. The addition of a small quantity of Al to the Sn facilitates processing and improves the final product properties.
    Type: Grant
    Filed: February 17, 1988
    Date of Patent: August 29, 1989
    Assignee: Oxford Superconducting Technology
    Inventors: William G. Marancik, Seung-Ok Hong
  • Method of fabricating multifilament intermetallic superconductor
    Patent number: 4646428
    Abstract: The centers of a plurality of copper tubes are filled with tin and drawn to form Cu-Sn wires which are cabled around a core Nb wire; a plurality of these strands are provided in a copper tube, or a copper foil or finely wound copper wire; and a plurality of said tubes are packed into a copper can to form a billet which is drawn to produce a multifilament wire; and heat treatment is applied to cause the tin to diffuse and form the intermetallic Nb.sub.3 Sn at the surface of the Nb filaments to produce the ultimate superconducting wire product.
    Type: Grant
    Filed: November 21, 1985
    Date of Patent: March 3, 1987
    Assignee: Oxford Superconducting Technology
    Inventors: William G. Marancik, Seung-Ok Hong