Abstract: The present invention relates to a hydroxylphenyl-terminated polysiloxane, a polysiloxane-polycarbonate copolymer comprising the same as repeating unit, and a method for preparing the copolymer, and more specifically, a polysiloxane of a specific structure having terminal silane unit comprising optionally substituted hydroxylphenyl group, and a polysiloxane-polycarbonate copolymer which comprises the polysiloxane and a polycarbonate block as repeating units, and thereby shows the same or more excellent transparency and significantly further improved flame retardancy as compared with the level of conventional polysiloxane-polycarbonate copolymer, and a method for preparing the same.

Abstract: The present invention relates to a polysiloxane-polycarbonate copolymer using a hydroxyl terminated polysiloxane mixture, and a method for producing same, and more specifically, to: a polysiloxane-polycarbonate copolymer which includes hydroxy-terminated polysiloxanes of chemical formulae 1 and 2 in a specific weight ratio as repeating units, and thus exhibits excellent transmittance and low-temperature impact strength compared to the case of using either of the hydroxy-terminated polysiloxanes by itself, and in which the overall production yield of the raw material polysiloxane is improved, such that the polysiloxane-polycarbonate copolymer is excellent in terms of economics; and a method for producing same.

Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.

Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.

Abstract: Disclosed is a polycarbonate resin composition including (1) a polyester compound having a structure of chemical formula 1 as defined herein or a phenyl-arylene ether sulfone compound having a structure of chemical formula 2 as defined herein; (2) a polycarbonate block copolymer; and (3) a thermoplastic aromatic polycarbonate resin or a polysiloxane-polycarbonate resin; and a molded product including the same. The polycarbonate resin composition exhibits remarkably excellent heat resistance compared to existing high heat resistance polycarbonate resins, and has an excellent balance of physical properties such as fluidity.

Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

Abstract: The present invention relates to a polycarbonate resin composition having excellent heat resistance and fluidity, and a molded product including the same. More specifically, the present invention relates to a polycarbonate resin composition, and a molded product including the same, wherein the polycarbonate resin composition, by including a polycarbonate copolymer together with a compound having a specific structure and a specific resin, exhibits remarkably excellent heat resistance compared to existing high heat resistance polycarbonate resins, and has an excellent balance of physical properties such as fluidity.

Abstract: A communications apparatus includes: a communications IC including a first RF pin, a second RF pin, and a third RF pin; a first front-end module connected between the first RF pin and a first RF terminal to provide a first signal path for wireless Tx and Rx, a second signal path for a first wireless LAN Rx, and a third signal path for a first wireless LAN Tx; a second front-end module connected between the third RF pin and a second RF terminal to provide a fourth signal path for a second wireless LAN Tx and a fifth signal path for a second wireless LAN Rx; and a duplexer configured to provide a first wireless LAN Tx signal to the first front-end module through the second RF pin, and provide a second wireless LAN Tx signal to the second front-end module through the second RF pin.

Abstract: A communications apparatus includes: a communications IC including a first RF pin, a second RF pin, and a third RF pin; a first front-end module connected between the first RF pin and a first RF terminal to provide a first signal path for wireless Tx and Rx, a second signal path for a first wireless LAN Rx, and a third signal path for a first wireless LAN Tx; a second front-end module connected between the third RF pin and a second RF terminal to provide a fourth signal path for a second wireless LAN Tx and a fifth signal path for a second wireless LAN Rx; and a duplexer configured to provide a first wireless LAN Tx signal to the first front-end module through the second RF pin, and provide a second wireless LAN Tx signal to the second front-end module through the second RF pin.

Abstract: A communications module includes a front-end module including a common port configured to be connected to an antenna, a reception port configured to pass a reception signal, and a transmission port configured to pass a transmission signal, and a high frequency switch circuit connected to the reception port and/or the transmission port and configured to change signal routes for signals passing through the front-end module, wherein the front-end module is configured to amplify communications signals of different communications standards.

Abstract: A communications module includes a front-end module including a common port configured to be connected to an antenna, a reception port configured to pass a reception signal, and a transmission port configured to pass a transmission signal, and a high frequency switch circuit connected to the reception port and/or the transmission port and configured to change signal routes for signals passing through the front-end module, wherein the front-end module is configured to amplify communications signals of different communications standards.

Abstract: The electronic device module and method thereof includes a board, an electronic device, a sealing part, and a connection conductor. The board includes external connection electrodes. The electronic device is mounted on the board. The sealing part is configured to seal the electronic device. The connection conductor is configured to penetrate through the sealing part and including one end bonded to the external connection electrodes of the board. One of the external connection electrodes includes a reinforcing via disposed in the board.

Abstract: Disclosed herein is an optical access network system in which the transmission quality of an upstream signal is remarkably improved in an optical access network in which a Reflective Semiconductor Optical Amplifier (RSOA) is used as the light source for each subscriber. The most important characteristics of the present invention are that a Manchester modulation format is used as a modulation format for a downstream signal in an optical access network system in which an RSOA is used as the light source for each subscriber, so that the problem of deterioration of the transmission quality of a remodulated upstream signal, occurring when an RSOA is used as the light source for each subscriber, is solved, and thus the transmission performance of an upstream signal and the power budget performance of the entire system are improved.