Patents by Inventor Seung-Wan Woo
Seung-Wan Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9504169Abstract: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.Type: GrantFiled: October 22, 2013Date of Patent: November 22, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Nam Hwang, Ju Wan Nam, Seung Wan Woo, Yee Na Shin
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Patent number: 9470635Abstract: Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement.Type: GrantFiled: October 8, 2013Date of Patent: October 18, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wan Woo, Young Nam Hwang, Po Chul Kim, Kyung Ho Lee, Suk Jin Ham
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Publication number: 20150380276Abstract: Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.Type: ApplicationFiled: September 9, 2015Publication date: December 31, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yee Na SHIN, Young Nam HWANG, Hyun Bok KWON, Seung Wan WOO
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Patent number: 9171780Abstract: Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.Type: GrantFiled: October 29, 2014Date of Patent: October 27, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yee Na Shin, Young Nam Hwang, Hyun Bok Kwon, Seung Wan Woo
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Patent number: 9155192Abstract: Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.Type: GrantFiled: October 10, 2013Date of Patent: October 6, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kyung Ho Lee, Seung Wan Woo, Po Chul Kim, Young Nam Hwang, Suk Jin Ham
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Publication number: 20150147849Abstract: Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.Type: ApplicationFiled: October 29, 2014Publication date: May 28, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yee Na SHIN, Young Nam Hwang, Hyun Bok Kwon, Seung Wan Woo
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Publication number: 20150014034Abstract: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.Type: ApplicationFiled: October 22, 2013Publication date: January 15, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Nam Hwang, Ju Wan Nam, Seung Wan Woo, Yee Na Shin
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Publication number: 20140374870Abstract: Disclosed herein are an image sensor module and a method of manufacturing the same. The image sensor includes: a base substrate having an image sensor mounted groove including a first groove and a second groove having a stepped shape; and an image sensor mounted in a groove of the base substrate.Type: ApplicationFiled: January 31, 2014Publication date: December 25, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Ho Lee, Suk Jin Ham, Seung Wan Woo, Yee Na Shin
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Publication number: 20140354797Abstract: Disclosed herein are a calibration block for measuring warpage, a warpage measuring apparatus using the same, and a method thereof. The calibration block includes a substrate having one planar surface; and a stepped part forming a step at the center of the other surface of the substrate.Type: ApplicationFiled: February 17, 2014Publication date: December 4, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Wan Woo, Ju Wan Nam, Young Nam Hwang, Kyung Ho Lee, Suk Jin Ham
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Publication number: 20140184782Abstract: Disclosed herein are a system for measuring a warpage and a method for measuring a warpage. The system for measuring a warpage includes: a heating plate portion heating the sample; and a reference gating portion disposed between the sample and the camera so as to be spaced apart from the sample by a predetermined distance, wherein the reference grating portion includes a plurality of wires that are each spaced apart from each other by a predetermined interval, thereby accurately measuring the warpage without being affected by the fume generated from the sample.Type: ApplicationFiled: December 27, 2013Publication date: July 3, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Wan WOO, Po Chul KIM, Young Nam HWANG, Kyung Ho LEE, Suk Jin HAM
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Publication number: 20140145323Abstract: Disclosed herein is a lamination layer type semiconductor package, and more particularly, a lamination layer type semiconductor package capable of maintaining a thickness of a package on package structure at a minimum and minimizing a warpage defect by mounting two chips so as to correspond to each other. The lamination layer type semiconductor package includes: an upper package having an upper flip chip mounted on an upper substrate; a lower package having a lower flip chip mounted on a lower substrate and disposed so as to closely adhere the upper flip chip and the lower flip chip to each other; a heat dissipation adhesive member adhesively fixing the upper flip chip and the lower flip chip and dissipating heat generated from the upper flip chip and the lower flip chip; and a molding member molding between the upper substrate and the lower substrate.Type: ApplicationFiled: November 25, 2013Publication date: May 29, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Ho LEE, Hyun Bok KWON, Seung Wan WOO, Young Nam HWANG, Suk Jin HAM, Po Chul KIM, So Hyang EUN, Se Jun PARK
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Publication number: 20140146498Abstract: Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.Type: ApplicationFiled: October 10, 2013Publication date: May 29, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Ho Lee, Seung Wan Woo, Po Chul Kim, Young Nam Hwang, Suk Jin Ham
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Publication number: 20140145322Abstract: Disclosed herein are an electronic component package and a method of manufacturing the same. The electronic component package includes: a substrate; a connection member provided on at least one surface of the substrate; an active element coupled to the substrate by the connection member; and a molding part covering an exposed surface of the active element, wherein the molding part is formed of a first material having a coefficient of thermal expansion of 8 to 15 ppm/° C. and thermal conductivity of 1 to 5 W/m° C. Therefore, warpage may be significantly decreased and heat radiation performance of the active element may be improved, as compared with the case of implementing the molding part using an EMC according to the related art.Type: ApplicationFiled: November 1, 2013Publication date: May 29, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Nam HWANG, Suk Jin HAM, Seung Wan WOO, Po Chul KIM, Kyung Ho LEE
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Publication number: 20140104417Abstract: Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement.Type: ApplicationFiled: October 8, 2013Publication date: April 17, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Wan WOO, Young Nam HWANG, Po Chul KIM, Kyung Ho LEE, Suk Jin HAM
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Publication number: 20140061891Abstract: Disclosed herein are a semiconductor chip package and a manufacturing method thereof. The manufacturing method of the semiconductor chip package includes: a) mounting a semiconductor chip on a printed circuit board (PCB); b) inserting a warpage suppressing reinforcement member into an inner ceiling of a mold manufactured in order to package the PCB having the semiconductor chip mounted thereon; c) combining the mold having the warpage suppressing reinforcement member inserted into the ceiling thereof with the upper surface of the PCB so as to surround the PCB having the semiconductor chip mounted thereon; d) injection-molding and filling a molding material in the mold, and hardening the molding material by applying heat, and e) hardening the molding material and then removing the mold to complete the semiconductor chip package.Type: ApplicationFiled: March 13, 2013Publication date: March 6, 2014Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Po Chul KIM, Kyung Ho Lee, Seung Wan Woo, Young Nam Hwang, Suk Jin Ham
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Publication number: 20130100460Abstract: There is provided an apparatus for measuring a warpage characteristic of a specimen, the apparatus including: a light irradiating unit irradiating light toward the specimen; alight transmitting member transmitting the light irradiated by the light irradiating unit therethrough and including a reference lattice pattern to allow a shadow to be formed on the specimen; a sensing unit sensing the shadow formed on the specimen by the reference lattice pattern; and a heating plate disposed under the light transmitting member and heating the specimen mounted thereon, wherein the reference lattice pattern formed on the light transmitting member is formed of a conductive material and is connected to a power supplying unit to thereby generate heat when power is supplied.Type: ApplicationFiled: March 2, 2012Publication date: April 25, 2013Inventors: Seung Wan WOO, Suk Jin Ham, Kum Young Ji, Chae Hyun Na, Chang Yun Lee
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Patent number: 7981540Abstract: A rechargeable battery including an electrode assembly, a casing which stores the electrode assembly and which includes a support to support the electrode assembly that protrudes inwardly from in an inner surface thereof, and a cap assembly which is combined with the casing and which has an electrode terminal electrically connected to the electrode assembly.Type: GrantFiled: August 23, 2007Date of Patent: July 19, 2011Assignee: Samsung SDI Co., Ltd.Inventors: Dong-Ho Jeong, Hyung-Sik Kim, Dai-Hoe Lee, Taek Kim, Seung-Wan Woo
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Publication number: 20080107961Abstract: A rechargeable battery including an electrode assembly, a casing which stores the electrode assembly and which includes a support to support the electrode assembly that protrudes inwardly from in an inner surface thereof, and a cap assembly which is combined with the casing and which has an electrode terminal electrically connected to the electrode assembly.Type: ApplicationFiled: August 23, 2007Publication date: May 8, 2008Applicant: Samsung SDI Co., Ltd.Inventors: Dong-Ho Jeong, Hyung-Sik Kim, Dai-Hoe Lee, Taek Kim, Seung-Wan Woo