Patents by Inventor Severin Wattenhofer

Severin Wattenhofer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device housing for an electrical device
    Patent number: 10938146
    Abstract: Various embodiments include device housing for an electrical device comprising: an inner housing with a first lower shell and a first upper shell; and an outer housing with a second lower shell and a second upper shell. There is a cable insertion opening defined by a cable seating profile in the first lower shell and a flush cable cover profile in the first upper shell for a cable routed to the device; a clamping body retained by the inner housing; and a friction and/or form-fitting contact between the clamping body and the cable can be effected by means of the outer housing when the clamping body is pressed onto an outer surface of the cable by the upper shell of the outer housing.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: March 2, 2021
    Assignee: SIEMENS SCHWEIZ AG
    Inventors: Severin Wattenhofer, Hideki Ito, Felix Schilter
  • Device Housing for an Electrical Device
    Publication number: 20200220300
    Abstract: Various embodiments include device housing for an electrical device comprising: an inner housing with a first lower shell and a first upper shell; and an outer housing with a second lower shell and a second upper shell. There is a cable insertion opening defined by a cable seating profile in the first lower shell and a flush cable cover profile in the first upper shell for a cable routed to the device; a clamping body retained by the inner housing; and a friction and/or form-fitting contact between the clamping body and the cable can be effected by means of the outer housing when the clamping body is pressed onto an outer surface of the cable by the upper shell of the outer housing.
    Type: Application
    Filed: May 3, 2018
    Publication date: July 9, 2020
    Applicant: Siemens Schweiz AG
    Inventors: Severin Wattenhofer, Hideki Ito, Felix Schilter