Abstract: A photonic chip includes an optical layer bonded, at a bonding interface, to an interconnection layer, the thickness of the optical layer being smaller than 15 ?m, a primary via that extends through the interconnection layer solely between a lower face and the bonding interface, an electrical terminal chosen from the group consisting of an electrical contact embedded in the interior of the optical layer and of an electrical track produced on an upper face, a second via that extends the primary via into the interior of the optical layer in order to electrically connect the primary via to the electrical terminal, this secondary via extending in the interior of the optical layer from the bonding interface to the electrical terminal, the maximum diameter of this secondary via being smaller than 3 ?m.

Abstract: A photonic chip includes an optical layer bonded, at a bonding interface, to an interconnection layer, the thickness of the optical layer being smaller than 15 ?m, a primary via that extends through the interconnection layer solely between a lower face and the bonding interface, an electrical terminal chosen from the group consisting of an electrical contact embedded in the interior of the optical layer and of an electrical track produced on an upper face, a second via that extends the primary via into the interior of the optical layer in order to electrically connect the primary via to the electrical terminal, this secondary via extending in the interior of the optical layer from the bonding interface to the electrical terminal, the maximum diameter of this secondary via being smaller than 3 ?m.

Abstract: This integrated circuit comprises: a substrate, a first electrical conductor comprising a first end, the first electrical conductor being electrically insulated from the substrate, a second electrical conductor comprising a second end, the second electrical conductor being electrically insulated from the substrate and electrically insulated from the first electrical conductor except at the second end which is mechanically and electrically directly in contact with the first end to form an electrical junction. The first and second ends are entirely buried to at least 5 ?m depth inside the substrate and produced, respectively, in different first and second materials chosen for the absolute value of the Seebeck coefficient of the junction to be greater than 1 ?V/K at 20° C. such that the combination of these first and second conductors forms a temperature probe.

Abstract: A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.

Abstract: This integrated circuit comprises: a substrate, a first electrical conductor comprising a first end, the first electrical conductor being electrically insulated from the substrate, a second electrical conductor comprising a second end, the second electrical conductor being electrically insulated from the substrate and electrically insulated from the first electrical conductor except at the second end which is mechanically and electrically directly in contact with the first end to form an electrical junction. The first and second ends are entirely buried to at least 5 ?m depth inside the substrate and produced, respectively, in different first and second materials chosen for the absolute value of the Seebeck coefficient of the junction to be greater than 1 ?V/K at 20° C. such that the combination of these first and second conductors forms a temperature probe.

Abstract: A document with a cover having a first cover part, a second cover part, at least one internal page located between the two cover parts when the document is closed, a radiofrequency microcontroller, an antenna electrically connected to the radiofrequency microcontroller, and an electromagnetic shield capable of disrupting, at least partially, the wireless communication with the radiofrequency microcontroller when the document is closed and not disrupting the wireless communication when the document is opened. The electromagnetic shield is a wire grid. The wire mesh distance between each two adjacent wires of the wire grid is smaller than a radio-frequency wavelength used for communicating with the radiofrequency microcontroller, and is at least 0.1 millimeters and at most 40 millimeters.

Abstract: A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.

Abstract: A document with a cover having a first cover part, a second cover part, at least one internal page located between the two cover parts when the document is closed, a radiofrequency microcontroller, an antenna electrically connected to the radiofrequency microcontroller, and an electromagnetic shield capable of disrupting, at least partially, the wireless communication with the radiofrequency microcontroller when the document is closed and not disrupting the wireless communication when the document is opened. The electromagnetic shield is a wire grid. The wire mesh distance between each two adjacent wires of the wire grid is smaller than a radio-frequency wavelength used for communicating with the radiofrequency microcontroller, and is at least 0.1 millimeters and at most 40 millimeters.

Abstract: A document which includes a cover, one or more internal pages, a radiofrequency microcontroller, an antenna electrically connected to the radiofrequency microcontroller, an electromagnetic shield capable of partially disrupting wireless communication with the radiofrequency microcontroller when the document is closed, and not disrupting the wireless communication when the document is opened is described. The electromagnetic shield included in the document is implemented using metal, conductive plastic, conductive ink or magnetic ink.

Abstract: A document which includes a cover, one or more internal pages, a radiofrequency microcontroller, an antenna electrically connected to the radiofrequency microcontroller, an electromagnetic shield capable of partially disrupting wireless communication with the radiofrequency microcontroller when the document is closed, and not disrupting the wireless communication when the document is opened is described. The electromagnetic shield included in the document is implemented using metal, conductive plastic, conductive ink or magnetic ink.