Patents by Inventor Severine Dieu-Gomont

Severine Dieu-Gomont has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a printed circuit, printed circuit obtained by this method and electronic module comprising such a printed circuit
    Patent number: 9583459
    Abstract: The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: February 28, 2017
    Assignee: Linxens Holding
    Inventors: Severine Dieu-Gomont, Bertrand Hoveman
  • Method of producing an electronic circuit with protection of the conductive layer
    Patent number: 9572265
    Abstract: The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: February 14, 2017
    Assignee: Linxens Holding
    Inventors: Séverine Dieu-Gomont, Francois Lechleiter, Yannick De Maquillé
  • Method for Producing a Printed Circuit, Printed Circuit Obtained by This Method and Electronic Module Comprising Such a Printed Circuit
    Publication number: 20160105961
    Abstract: The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit.
    Type: Application
    Filed: May 27, 2014
    Publication date: April 14, 2016
    Inventors: Severine DIEU-GOMONT, Bertrand HOVEMAN
  • Method of Producing an Electronic Circuit with Protection of the Conductive Layer
    Publication number: 20150181723
    Abstract: The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.
    Type: Application
    Filed: June 12, 2013
    Publication date: June 25, 2015
    Inventors: Severine Dieu-Gomont, Francois Lechleiter, Yannick Maquille