Abstract: ESD protection devices and methods are provided. In at least one embodiment, a device includes a first stack that forms a Zener diode. The first stack includes a substrate of a first conductivity type having a first region of a second conductivity type located therein. The first area is flush with a surface of the substrate. A second stack forms a diode and is located on and in contact with the surface of the substrate. The second stack includes a first layer of the second conductivity type having a second region of the first conductivity type located therein. The second area is flush, opposite the first stack, with the surface of the first layer. A third stack includes at least a second layer made of an oxygen-doped material, on and in contact with the second stack.

Abstract: ESD protection devices and methods are provided. In at least one embodiment, a device includes a first stack that forms a Zener diode. The first stack includes a substrate of a first conductivity type having a first region of a second conductivity type located therein. The first area is flush with a surface of the substrate. A second stack forms a diode and is located on and in contact with the surface of the substrate. The second stack includes a first layer of the second conductivity type having a second region of the first conductivity type located therein. The second area is flush, opposite the first stack, with the surface of the first layer. A third stack includes at least a second layer made of an oxygen-doped material, on and in contact with the second stack.

Abstract: The invention relates to a process for producing layers made of oxide ceramic that conform to substrates having features in relief comprising: a step of depositing on said substrate a layer of a sol-gel solution that is a precursor of said ceramic; a heat treatment step of said layer with a view to converting it to the ceramic; said steps being optionally repeated one or more times, characterized in that the sol-gel solution that is a precursor of said ceramic is prepared by a process successively comprising the following steps: a) preparing a first solution by bringing the molecular precursor or precursors of the metals intended to be incorporated into the composition of the ceramic into contact with a medium comprising a diol solvent and optionally an aliphatic monoalcohol; b) leaving the solution obtained in a) to stand for a sufficient time needed to obtain a solution that has a substantially constant viscosity; c) diluting the solution obtained in b) to a predetermined amount with a dial solvent o