Abstract: A quick-fold compact tow-bar which is especially suited to tow airplanes, such as single-engine Cessna airplanes. The disclosed foldable tow-bar can be unfolded to tow an airplane in an easy and safe manner and folded back to be stowed away in the luggage compartment of the airplane.

Abstract: A quick-fold compact tow-bar which is especially suited to tow airplanes, such as single-engine Cessna airplanes. The disclosed foldable tow-bar can be unfolded to tow an airplane in an easy and safe manner and folded back to be stowed away in the luggage compartment of the airplane.

Abstract: An ankle-pack device is disclosed which allows the user to utilize in-line skates as a means of transportation without the necessity for a shoe carrying device usually attached to the upper portions of the body such as a back pack or belt pack. Shoes can easily be carried directly next to the in-line skate utilizing the disclosed device while in motion as well. Thus, the ankle-pack system or device leaves the upper portions of the body uninhibited during skating. Also, ankle-pack is fitted with an expandable bottom to accommodate the larger in-line skate when they are to be carried after the conclusion of skating. An additional extension strap provides the length needed to carry the ankle-pack on the shoulder.

Abstract: A computer device, hereafter called PalmTrack, is provided having an oblong shape following the general outline of a human hand further comprising a finger portion, palm portion and thumb portion. The finger portion accommodates three levers which are operated by pressing with fingers. The palm portion fits the palm of a right or a left hand comfortably and has a track-ball judiciously placed so as to fit the cup of the hand ergonomically. Thus, the cursor placement and highlighting of objects on a computer screen is accomplished by moving the palm of the hand over the track-ball without moving the device itself and without the use of the thumb, which usually suffers most from pain and dysfunction after repeated use. Further, PalmTrack is provided with slidable finger portion so that the over-all size of the PalmTrack can be adjusted, and varied at will in situ while in operation so as to provide a personal, ergonomically suitable pointing device for computers.

Abstract: A heat pipe includes a heat input end including an evaporator an adiabatic section and an output end including a condenser, with the evaporator and the condenser joined by a hollow adiabatic section containing a wicking material and a coolant, a heat pipe including a plurality of heat pipe stages connected in cascade with the condenser of the preceding stage secured to the evaporator of the succeeding stage each of the stages having a larger internal cross-sectional area at the condenser than at the evaporator. The stages of heat pipes are interconnected to form an integral part of a unitary heat pipe, with the condenser and the evaporator screwed together, or individual heat pipes are interconnected by sleeves of variable lengths screwed one into the other. A heat pipe can be composed of flexible material, and more particularly the heat pipe is connected to the box containing the device as a heat sink.

Abstract: A bellows type heat pipe which conducts heat away from an electronic device to a heat sink. The heat pipe is a sealed bellows type container which has an evaporator section at one end and a condenser section at an opposite end. The evaporator section contains a saturated radial wick while the condenser section is lined with a radial wick and a circumferential wick. A corrugated slab wick is longitudinally disposed within the heat pipe interconnecting the evaporator and the condenser sections. The evaporator section is placed on the electronic device and the condenser section is enclosed in a housing which is connected to a heat sink. In operation, the electronic device generates heat energy which causes the fluid in the evaporator to vaporize building a vapor pressure in the heat pipe. The heat pipe expands in the direction of the condenser causing the condenser section to make intimate contact with the inside of the housing.

Abstract: A cooling structure for a semiconductor package wherein the cooling fluid is circulated over the cooling fins over short distances. The fluid flow is separated into multiple flow streams, passed over the fins for short distances and exhausted.

Abstract: A thermal tester for measuring the efficiency of a heat transfer device for cooling semiconductor chips is disclosed having a positioning means operable to position the heat transfer device in thermal contact with the chip. The positioning means is adjustable in at least 5 degrees of freedom. Temperature sensors are provided to sense the temperature of the chip, the chip support substrate and the positioning means adjacent the heat transfer device. Means is provided to dispose the chip and heat transfer device in a vacuum. Control means is also provided to adjust the temperature of the chip unitl it is the same as the substrate to thereby assure heat transfer occurs only from the chip to the positioning means by way of the heat transfer device. When this thermal balance is achieved the thermal resistance of the heat transfer device can be calculated.

Abstract: A cooling means for a circuit chip device employs a noneutectic metal alloy to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink. The alloy has a solidus-liquidus temperature range such that the solidus is slightly below the maximum operating temperature of the chip, and thus has the capability to reestablish and maintain the interface at a low thermal resistance if stressed during circuit operation, even with a low current load at the interface of the chip device and the heat sink. In addition to the chip interface, the above cooling means is also used at other interfacial regions of the heat sink, dependent on design, to achieve very low thermal resistance.

Abstract: An air cooled high density integrated circuit system wherein heat sink structures are located on one of the surfaces of the modules in the system. The heat sink is composed of a plurality of hollow or flat heat conductive bodies having an opening or openings extending from the module surface toward, but not reaching, the top of the hollow heat sink. Means are provided to direct air flow substantially perpendicular to the upper end of the body. The air flow will be from the top of the heat sink and out of the opening or openings to cool the heat sink and the module. The heat sink structure provides greater surface area and effects the breaking up of the boundary layer near the surface of the module for enhanced cooling.

Abstract: A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned so that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels.