Patents by Inventor Se Won Park

Se Won Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12590921
    Abstract: Disclosed are an RF bio-sensor and a method for manufacturing the same, in which DNA may be detected in real time, which may greatly improve detection efficiency, and a relatively simple manufacturing method and detection method are used, and signal media materials can be reused, thus making it excellent in terms of economic efficiency, and the bio-sensor does not rely on enzymes or chemical reactions, but uses only high-frequency electrical signal analysis, thus not requiring labels and thus significantly reducing contamination problems.
    Type: Grant
    Filed: March 14, 2024
    Date of Patent: March 31, 2026
    Assignee: UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY
    Inventors: Seong Chan Jun, Ji Sang Ha, Chae Kwang Im, Se Won Park, Tae Jong Hwang, Chan Woo Mun, Tae Wook Lee, Yun Ji Hwang, Shu De Liu
  • Publication number: 20240403386
    Abstract: A method for an anomaly detection is provided. The method may include acquiring a score predictor trained using normal time-series data, wherein the score predictor is a deep learning model configured to output a conditional score for previous time-series data and the conditional score represents a gradient of data density, extracting data for a specific time and data segments corresponding to a period before the specific time from target time-series data, and predicting a conditional score for the data segments through the trained score predictor and conducting an anomaly determination for the data for the specific time using the predicted conditional score.
    Type: Application
    Filed: May 30, 2024
    Publication date: December 5, 2024
    Applicants: SAMSUNG SDS CO, LTD., UIF (University Industry Foundation), Yonsei University
    Inventors: Hak Soo LIM, Min-Jung KIM, Se Won PARK, No Seong PARK
  • Publication number: 20240310316
    Abstract: Disclosed are an RF bio-sensor and a method for manufacturing the same, in which DNA may be detected in real time, which may greatly improve detection efficiency, and a relatively simple manufacturing method and detection method are used, and signal media materials can be reused, thus making it excellent in terms of economic efficiency, and the bio-sensor does not rely on enzymes or chemical reactions, but uses only high-frequency electrical signal analysis, thus not requiring labels and thus significantly reducing contamination problems.
    Type: Application
    Filed: March 14, 2024
    Publication date: September 19, 2024
    Applicant: UIF (University Industry Foundation), Yonsei University
    Inventors: Seong Chan JUN, Ji Sang HA, Chae Kwang IM, Se Won PARK, Tae Jong HWANG, Chan Woo MUN, Tae Wook LEE, Yun Ji HWANG, Shu De LIU
  • Publication number: 20240185037
    Abstract: Provided are a method for generating time series data and system therefor. The method according to some embodiments may include obtaining an autoencoder trained using original time series data, wherein the autoencoder includes an encoder and a decoder, obtaining a score predictor trained using latent vectors of original time series data generated through the encoder, extracting a plurality of noise vectors from a prior distribution, generating a plurality of synthetic latent vectors by updating the plurality of noise vectors using scores of the plurality of noise vectors predicted through the score predictor, and reconstructing the plurality of synthetic latent vectors into a plurality of synthetic time series samples through the decoder and outputting them.
    Type: Application
    Filed: November 29, 2023
    Publication date: June 6, 2024
    Applicants: SAMSUNG SDS CO., LTD., UIF (University Industry Foundation), Yonsei University
    Inventors: Se Won PARK, Min Jung KIM, No Seong PARK
  • Publication number: 20240016229
    Abstract: Embodiments relate to an aerosol generating device authenticated by a signal, and more particularly, to an aerosol generating device which is unlocked upon receiving, through a certain signal, an authentication result of an age authentication, a region authentication, and a cartridge genuine product authentication which is performed by an external device.
    Type: Application
    Filed: July 14, 2023
    Publication date: January 18, 2024
    Inventors: Hyung Min Kim, Sung Min Cho, Se Won Park, Jong Hun You
  • Publication number: 20240016971
    Abstract: A phenol derivative-modified, tissue-derived extracellular matrix derivative for construction of artificial tissues. A hydrogel composition and a hydrogel prepared therefrom exhibit various effects such as hemostasis, blood coagulation acceleration, cell transplantation, drug delivery, cell differentiation promotion, etc. and thus can be applied to single or composite uses. Furthermore, the present invention is excellent in biocompatibility due to its biodegradability and being almost free of cytotoxicity, thus exhibiting very high applicability. In addition, a tissue structure including a single type or multiple types of cells can be formed through the cell-proliferating potential and adhesion of the hydrogel and can better simulate in-vivo microenvironments.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Inventors: Seung Woo CHO, Soo Hwan AN, Su Kyeom KIM, Yu Heun KIM, Su Ran KIM, Sung Jin MIN, Se Won PARK
  • Publication number: 20230374465
    Abstract: The present disclosure relates to a scaffold for culture and transplantation of an esophageal organoid by using a decellularized esophageal tissue (esophagus extracellular matrix; EEM).
    Type: Application
    Filed: November 17, 2021
    Publication date: November 23, 2023
    Inventors: Seung Woo CHO, Se Won PARK, Eun Je JEON
  • Publication number: 20230349927
    Abstract: Disclosed herein are an RF biosensing system, a method of manufacturing an RF biosensor used in the same, and a method of controlling the same. The RF biosensing system allows dementia screening without any painful or uncomfortable procedure through rapid detection of biomarkers for Alzheimer's disease present in a patient's bodily fluids. In addition, the RF biosensing system is very helpful for preventing Alzheimer's disease due to the ability to detect triggers for dementia long before onset of symptoms and easily monitor the progression of Alzheimer's disease using simple and inexpensive equipment.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 2, 2023
    Inventors: Seong Chan JUN, Chae Kwang IM, Ji Sang HA, Se Won PARK, Jae Kyeong LEE, Tae Wook LEE
  • Publication number: 20230340422
    Abstract: The present disclosure relates to a decellularized adipose tissue-derived scaffold and a method of preparing the same. The scaffold of the present disclosure can be applied to culture of various types of organoids and thus can be used in various fields due to its high versatility. Also, the scaffold of the present disclosure can be prepared from a human adipose tissue to be discarded and thus can create enormous added value. Further, the scaffold of the present disclosure can be widely used in the medical industry, such as new drug development, drug toxicity and efficacy evaluation, and patient-specific drug selection, in substitution for conventional Matrigel.
    Type: Application
    Filed: July 6, 2023
    Publication date: October 26, 2023
    Inventors: Seung Woo CHO, In Sik YUN, Yi Sun CHOI, Su Ran KIM, Sung Jin MIN, Su Kyeom KIM, Yu Heun KIM, Se Won PARK
  • Publication number: 20230334341
    Abstract: A method for augmenting data according to some embodiments of the present disclosure includes obtaining a score prediction model learned using a first noisy sample of a first class, generating a second noisy sample by adding the noise with the specified distribution to a sample of a second class, and generating a fake sample of the first class from the second noisy sample using a score for the second noisy sample predicted through the score prediction model.
    Type: Application
    Filed: January 27, 2023
    Publication date: October 19, 2023
    Applicants: SAMSUNG SDS CO., LTD., INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Min Jung KIM, Se Won PARK, No Seong PARK, Ja Young KIM, Chae Jeong LEE, Yeh Jin SHIN, Chang Joon LEE, Ji Hoon CHOI
  • Patent number: 11312349
    Abstract: An electric brake device that including a pedal, a master cylinder unit including a cylinder storing hydraulic pressure therein, and a piston moved according to a pedal force of the pedal to generate the hydraulic pressure and provide a restoring force, and a pedal force adjustment unit operatively connected to the master cylinder unit to adjust the pedal force of the pedal by the hydraulic pressure, which is capable of adjusting a brake pedal feel.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: April 26, 2022
    Assignee: HYUNDAI MOBIS Co., Ltd.
    Inventor: Se Won Park
  • Publication number: 20200331445
    Abstract: An electric brake device that including a pedal, a master cylinder unit including a cylinder storing hydraulic pressure therein, and a piston moved according to a pedal force of the pedal to generate the hydraulic pressure and provide a restoring force, and a pedal force adjustment unit operatively connected to the master cylinder unit to adjust the pedal force of the pedal by the hydraulic pressure, which is capable of adjusting a brake pedal feel.
    Type: Application
    Filed: April 2, 2020
    Publication date: October 22, 2020
    Inventor: Se Won PARK
  • Publication number: 20140175047
    Abstract: A method of manufacturing a printed circuit board, according to one embodiment, includes forming a circuit pattern and a via pad, which is disposed by being spaced apart from the circuit pattern and has concavo-convex patterns, on a first insulating layer; forming a second insulating layer on the circuit pattern and the via pad having the concavo-convex patterns formed thereon; forming a via hole by etching a portion of the second insulating layer on the via pad; and forming a copper foil layer on the second insulating layer having the via hole formed therein.
    Type: Application
    Filed: February 27, 2014
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Watanabe RYOICHI, Se Won Park
  • Patent number: 8680404
    Abstract: The present invention provides a printed circuit board including: a circuit pattern formed on a first insulating layer; a via pad disposed on the first insulating layer by being spaced apart from the circuit pattern, formed on a lower surface, where a via hole is formed, to have a cross section larger than that of the via hole, and having concavo-convex patterns; a second insulating layer formed on the via pad where the via hole is not formed and on the circuit pattern; and a copper foil layer formed on the second insulating layer and the via hole, and a method of manufacturing the same.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: March 25, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Watanabe Ryoichi, Se Won Park
  • Publication number: 20120217043
    Abstract: Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.
    Type: Application
    Filed: May 8, 2012
    Publication date: August 30, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Se Won PARK
  • Patent number: 8191249
    Abstract: Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: June 5, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Se Won Park
  • Publication number: 20110100686
    Abstract: The present invention provides a printed circuit board including: a circuit pattern formed on a first insulating layer; a via pad disposed on the first insulating layer by being spaced apart from the circuit pattern, formed on a lower surface, where a via hole is formed, to have a cross section larger than that of the via hole, and having concavo-convex patterns; a second insulating layer formed on the via pad where the via hole is not formed and on the circuit pattern; and a copper foil layer formed on the second insulating layer and the via hole, and a method of manufacturing the same.
    Type: Application
    Filed: February 5, 2010
    Publication date: May 5, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Watanabe Ryoichi, Se Won Park
  • Publication number: 20110089138
    Abstract: Disclosed is a method of manufacturing a printed circuit board, including (A) forming a first circuit layer on a base substrate and forming a first insulating layer thereon, (B) forming trenches including dummy trenches and wiring trenches on the first insulating layer and plating the trenches, thus providing a trench circuit layer including a dummy circuit pattern and a wiring circuit pattern, (C) removing the dummy circuit pattern of the trench circuit layer, and (D) forming a second insulating layer on the trench circuit layer from which the dummy circuit pattern was removed. The method reduces deviation of plating thickness and thus realizes the design density of a trench circuit layer.
    Type: Application
    Filed: December 9, 2009
    Publication date: April 21, 2011
    Inventors: Young Gwan Ko, Ryoichi Watanabe, Sang Soo Lee, Hee Bum Shin, Se Won Park, Chil Woo Kwon
  • Publication number: 20110079421
    Abstract: Disclosed herein is a printed circuit board, including: a base substrate; insulation layers which are formed on both sides of the base substrate and in which trenches are formed; and circuit layers including circuit patterns and vias formed in the trenches using a plating process. The printed circuit board is advantageous in that trenches are formed in both sides of a base substrate, so that a fine circuit pattern can be simultaneously formed on both sides thereof, thereby simplifying the manufacturing process thereof.
    Type: Application
    Filed: December 9, 2009
    Publication date: April 7, 2011
    Inventors: Young Gwan KO, Ryoichi Watanabe, Sang Soo Lee, Se Won Park
  • Publication number: 20100126761
    Abstract: Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.
    Type: Application
    Filed: March 6, 2009
    Publication date: May 27, 2010
    Inventor: Se Won Park