Patents by Inventor Sey-Ping Sung

Sey-Ping Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150221504
    Abstract: Semiconductor device manufacturing methods and methods of forming insulating material layers are disclosed. In one embodiment, a method of forming a composite insulating material layer of a semiconductor device includes providing a workpiece and forming a first sub-layer of the insulating material layer over the workpiece using a first plasma power level. A second sub-layer of the insulating material layer is formed over the first sub-layer of the insulating material layer using a second plasma power level, and the workpiece is annealed.
    Type: Application
    Filed: April 13, 2015
    Publication date: August 6, 2015
    Inventors: Gin-Chen Huang, Tsai-Fu Hsiao, Ching-Hong Jiang, Neng-Kuo Chen, Hongfa Luan, Sey-Ping Sung, Clement Hsingjen Wann