Abstract: A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compressive force. The first thermal element is held in contact with a portion of the first lead by a compressive force such that the first thermal element is capable of removing heat from the first lead and from the die. The second lead is held in contact with the second surface of the die by a compressive force. The second thermal element is held in contact with a portion of the second lead by a compressive force such that the second thermal element is capable of removing heat from the second lead and from the die.

Abstract: A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compressive force. The first thermal element is held in contact with a portion of the first lead by a compressive force such that the first thermal element is capable of removing heat from the first lead and from the die. The second lead is held in contact with the second surface of the die by a compressive force. The second thermal element is held in contact with a portion of the second lead by a compressive force such that the second thermal element is capable of removing heat from the second lead and from the die.

Abstract: An electronic circuit breaker has a switching transistor for controlling current flow in a circuit. The switching transistor is controlled by a pair of complementary field-effect transistors to achieve very fast switching action. The electronic breaker is capable of sensing an overcurrent condition and interrupting current flow in less than a microsecond. The electronic circuit breaker also has an inductor for limiting the rate at which current can increase during the time delay between sensing an overcurrent and interrupting current flow.

Abstract: A modular power supply system in which a plurality of power supply modules connected in parallel to a load contribute equal currents, even if one or more of the power supply modules fails. A first order fault tolerant modular power supply system includes three power supply modules (38, 40 and 42) connected in parallel to a load (32). The output current from each of the power supply modules is separately compared to the output current from one of the other power supply modules in a loop arrangement, using three control circuits (64, 66 and 68). A signal indicative of the current contributed by each pair of the power supply modules is input to the control circuit, producing a differential output signal used as a reference to control the output current from each of the power supply modules.