Patents by Inventor Seyd Sobhani

Seyd Sobhani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method For Cooling A Semiconductor Device
    Publication number: 20080102564
    Abstract: A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compressive force. The first thermal element is held in contact with a portion of the first lead by a compressive force such that the first thermal element is capable of removing heat from the first lead and from the die. The second lead is held in contact with the second surface of the die by a compressive force. The second thermal element is held in contact with a portion of the second lead by a compressive force such that the second thermal element is capable of removing heat from the second lead and from the die.
    Type: Application
    Filed: January 2, 2008
    Publication date: May 1, 2008
    Applicant: The Boeing Company
    Inventor: Seyd Sobhani
  • Semiconductor device, cooling apparatus, and associated method
    Publication number: 20060261468
    Abstract: A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compressive force. The first thermal element is held in contact with a portion of the first lead by a compressive force such that the first thermal element is capable of removing heat from the first lead and from the die. The second lead is held in contact with the second surface of the die by a compressive force. The second thermal element is held in contact with a portion of the second lead by a compressive force such that the second thermal element is capable of removing heat from the second lead and from the die.
    Type: Application
    Filed: May 20, 2005
    Publication date: November 23, 2006
    Applicant: The Boeing Company
    Inventor: Seyd Sobhani