Patents by Inventor Seyed Amir Farzadfar

Seyed Amir Farzadfar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970421
    Abstract: Glass articles including one or more 3D printed surface features attached to a surface of a substrate at a contact interface between the 3D printed surface feature and the surface. The 3D printed surface feature(s) include a glass or a glass-ceramic, a compressive stress region at an exterior perimeter surface of the 3D printed surface feature(s), and a central tension region interior of the compressive stress region. The 3D printed surface feature(s) may be formed of a contiguous preformed material 3D printed on a surface of a substrate. The compressive stress region of a 3D printed surface feature may be formed using an ion-exchange process.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 30, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Matthew John Dejneka, Seyed Amir Farzadfar, Michael Thomas Gallagher, Balamurugan Meenakshi Sundaram, Yawei Sun
  • Patent number: 11833604
    Abstract: Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: December 5, 2023
    Assignee: Corning Incorporated
    Inventors: Timothy Eugene Antesberger, Dana Craig Bookbinder, Dana Eugene Coots, Seyed Amir Farzadfar, Dominick John Forenz, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller, Richard Curwood Peterson, John Charles Rector
  • Publication number: 20220234108
    Abstract: Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.
    Type: Application
    Filed: May 21, 2020
    Publication date: July 28, 2022
    Inventors: Timothy Eugene Antesberger, Dana Craig Bookbinder, Dana Eugene Coots, Seyed Amir Farzadfar, Dominick John Forenz, Ryan Joseph Grohsmeyer, Mark Lee Humphrey, Zakariya Radwan Khayat, Kenneth Richard Miller, Richard Curwood Peterson, John Charles Rector
  • Publication number: 20220024817
    Abstract: Glass articles including one or more 3D printed surface features attached to a surface of a substrate at a contact interface between the 3D printed surface feature and the surface. The 3D printed surface feature(s) include a glass or a glass-ceramic, a compressive stress region at an exterior perimeter surface of the 3D printed surface feature(s), and a central tension region interior of the compressive stress region. The 3D printed surface feature(s) may be formed of a contiguous preformed material 3D printed on a surface of a substrate. The compressive stress region of a 3D printed surface feature may be formed using an ion-exchange process.
    Type: Application
    Filed: December 5, 2019
    Publication date: January 27, 2022
    Inventors: Matthew John Dejneka, Seyed Amir Farzadfar, Michael Thomas Gallagher, Balamurugan Meenakshi Sundaram, Yawei Sun