Patents by Inventor Seyfi Bazarjani

Seyfi Bazarjani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-power compute-in-memory bitcell
    Patent number: 11657238
    Abstract: A compute-in-memory bitcell is provided that includes a pair of cross-coupled inverter for storing a stored bit. The compute-in-memory bitcell includes a logic gate for multiplying the stored bit with an input vector bit. An output node for the logic gate connects to a second plate of a capacitor. A first plate of the capacitor connects to a read bit line.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: May 23, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Ankit Srivastava, Seyed Arash Mirhaj, Guoqing Miao, Seyfi Bazarjani
  • LOW-POWER COMPUTE-IN-MEMORY BITCELL
    Publication number: 20210240442
    Abstract: A compute-in-memory bitcell is provided that includes a pair of cross-coupled inverter for storing a stored bit. The compute-in-memory bitcell includes a logic gate for multiplying the stored bit with an input vector bit. An output node for the logic gate connects to a second plate of a capacitor. A first plate of the capacitor connects to a read bit line.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 5, 2021
    Inventors: Ankit SRIVASTAVA, Seyed Arash MIRHAJ, Guoqing MIAO, Seyfi BAZARJANI
  • Die-To-Die Power Consumption Optimization
    Publication number: 20100127359
    Abstract: Power consumption of electronic components is reduced, particularly in a multi-chip package. Embodiments reduce parasitic capacitance of a semiconductor chip by reducing ESD protection circuitry that is not needed during operation of the package. ESD protection circuitry would be operational during production and/or testing of the chip, but some circuitry would be disabled or removed prior to normal operation of the multi-chip package.
    Type: Application
    Filed: November 25, 2008
    Publication date: May 27, 2010
    Applicant: QUALCOMM INCORPORATED
    Inventors: Seyfi Bazarjani, Reza Jalilizeinali