Patents by Inventor Seyun HWANG

Seyun HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10558833
    Abstract: A key module includes a first bracket, a second bracket coupled to the first bracket to form an internal space and including an opening region, and a sensor bracket allowing a fingerprint sensor unit and a press key unit to be mounted therein, and mounted to be movable in the internal space such that one region of the fingerprint sensor unit is exposed through the opening region, wherein one surface of the fingerprint sensor unit is exposed, the press key unit is disposed on the other surface of the fingerprint sensor unit, and the press key unit includes a circuit board and a dome switch disposed on the circuit board to face the first bracket.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: February 11, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Yongho Lee, Wonjin Choi, Minho Park, Changbai Won, Myoungku Lee, Seyun Hwang
  • Publication number: 20180218194
    Abstract: A key module includes a first bracket, a second bracket coupled to the first bracket to form an internal space and including an opening region, and a sensor bracket allowing a fingerprint sensor unit and a press key unit to be mounted therein, and mounted to be movable in the internal space such that one region of the fingerprint sensor unit is exposed through the opening region, wherein one surface of the fingerprint sensor unit is exposed, the press key unit is disposed on the other surface of the fingerprint sensor unit, and the press key unit includes a circuit board and a dome switch disposed on the circuit board to face the first bracket.
    Type: Application
    Filed: July 28, 2017
    Publication date: August 2, 2018
    Applicant: LG ELECTRONICS INC.
    Inventors: Yongho LEE, Wonjin CHOI, Minho PARK, Changbai WON, Myoungku LEE, Seyun HWANG
  • Patent number: 9854077
    Abstract: The present invention relates to a mobile terminal and a method of fabricating the same. The mobile terminal includes a frame made of a metal and provided within a terminal body, a printed circuit board spaced apart from one surface of the frame and having various electronic components mounted thereon, and a shield can disposed on the printed circuit board in a manner of facing the frame, and capable of shielding electromagnetic waves by covering the electronic components, wherein the shield can is provided with a ground unit that is formed at least one region and protruding toward the frame so as to be electrically connected to the frame.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: December 26, 2017
    Assignee: LG ELECTRONICS INC.
    Inventors: Hoseok Chung, Seyun Hwang, Wonseok Na, Kyungji Lee, Hyunju Yi
  • Publication number: 20170054836
    Abstract: The present invention relates to a mobile terminal and a method of fabricating the same. The mobile terminal includes a frame made of a metal and provided within a terminal body, a printed circuit board spaced apart from one surface of the frame and having various electronic components mounted thereon, and a shield can disposed on the printed circuit board in a manner of facing the frame, and capable of shielding electromagnetic waves by covering the electronic components, wherein the shield can is provided with a ground unit that is formed at at least one region and protruding toward the frame so as to be electrically connected to the frame.
    Type: Application
    Filed: February 10, 2016
    Publication date: February 23, 2017
    Inventors: Hoseok CHUNG, Seyun HWANG, Wonseok NA, Kyungji LEE, Hyunju YI