Patents by Inventor Sezi Recai

Sezi Recai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Material and additive for highly crosslinked chemically and thermally stable polyhydroxyamide polymers
    Patent number: 6750317
    Abstract: Polyhydroxyamides are polymerized to form highly-crosslinked, temperature-stable polymers. The polyhydroxyamides include as their central, parent structure a benzenetricarboxylic acid to which side chains containing a terminal reactive group are attached by an amide bond. By way of this reactive group, highly crosslinked polymers can be formed. In addition, the polyhydroxyamide can be added as an additive to polymers in order to bring about three-dimensional crosslinking.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: June 15, 2004
    Assignee: Infineon Technologies AG
    Inventors: Marcus Halik, Holger Hösch, Sezi Recai, Andreas Walter
  • Material and additive for highly crosslinked chemically and thermally stable polyhydroxyamide polymers
    Publication number: 20030050431
    Abstract: Polyhydroxyamides are polymerized to form highly-crosslinked, temperature-stable polymers. The polyhydroxyamides include as their central, parent structure a benzenetricarboxylic acid to which side chains containing a terminal reactive group are attached by an amide bond. By way of this reactive group, highly crosslinked polymers can be formed. In addition, the polyhydroxyamide can be added as an additive to polymers in order to bring about three-dimensional crosslinking.
    Type: Application
    Filed: May 31, 2002
    Publication date: March 13, 2003
    Inventors: Marcus Halik, Holger Hosch, Sezi Recai, Andreas Walter