Patents by Inventor SHA-SHA LIU
SHA-SHA LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10937806Abstract: Embodiments of interconnect structures of a three-dimensional (3D) memory device and method for forming the interconnect structures are disclosed. In an example, a 3D NAND memory device includes a semiconductor substrate, an alternating layer stack disposed on the semiconductor substrate, and a dielectric structure, which extends vertically through the alternating layer stack, on an isolation region of the substrate. Further, the alternating layer stack abuts a sidewall surface of the dielectric structure and the dielectric structure is formed of a dielectric material. The 3D memory device additionally includes one or more through array contacts that extend vertically through the dielectric structure and the isolation region, and one or more channel structures that extend vertically through the alternating layer stack.Type: GrantFiled: May 5, 2020Date of Patent: March 2, 2021Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: Qian Tao, Yushi Hu, Zhenyu Lu, Li Hong Xiao, Xiaowang Dai, Yu Ting Zhou, Zhao Hui Tang, Mei Lan Guo, ZhiWu Tang, Qinxiang Wei, Qianbing Xu, Sha Sha Liu, Jian Hua Sun, EnBo Wang
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Publication number: 20200266211Abstract: Embodiments of interconnect structures of a three-dimensional (3D) memory device and method for forming the interconnect structures are disclosed. In an example, a 3D NAND memory device includes a semiconductor substrate, an alternating layer stack disposed on the semiconductor substrate, and a dielectric structure, which extends vertically through the alternating layer stack, on an isolation region of the substrate. Further, the alternating layer stack abuts a sidewall surface of the dielectric structure and the dielectric structure is formed of a dielectric material. The 3D memory device additionally includes one or more through array contacts that extend vertically through the dielectric structure and the isolation region, and one or more channel structures that extend vertically through the alternating layer stack.Type: ApplicationFiled: May 5, 2020Publication date: August 20, 2020Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: Qian TAO, Yushi Hu, Zhenyu Lu, Li Hong Xiao, Xiaowang Dai, Yu Ting Zhou, Zhao Hui Tang, Mei Lan Guo, ZhiWu Tang, Qinxiang Wei, Qianbing Xu, Sha Sha Liu, Jian Hua Sun, EnBo Wang
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Publication number: 20200185270Abstract: Aspects of the disclosure provide a method for manufacturing a semiconductor device. A first structure of first stacked insulating layers including a first via over a contact region is formed. A second structure is formed by filling at least a top region of the first via with a sacrificial layer. A third structure including the second structure and second stacked insulating layers stacked above the second structure is formed. The third structure further includes a second via aligned with the first via and extending through the second stacked insulating layers. A fourth structure is formed by removing the sacrificial layer to form an extended via including the first via and the second via. A plurality of weights associated with the first structure, the second structure, the third structure, and the fourth structure is determined, and a quality of the extended via is determined based on the plurality of weights.Type: ApplicationFiled: March 13, 2019Publication date: June 11, 2020Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: Sha Sha Liu, EnBo Wang, Feng Lu, Li Hong Xiao, Haohao Yang, Zhaosong Li
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Patent number: 10665500Abstract: Aspects of the disclosure provide a method for manufacturing a semiconductor device. A first structure of first stacked insulating layers including a first via over a contact region is formed. A second structure is formed by filling at least a top region of the first via with a sacrificial layer. A third structure including the second structure and second stacked insulating layers stacked above the second structure is formed. The third structure further includes a second via aligned with the first via and extending through the second stacked insulating layers. A fourth structure is formed by removing the sacrificial layer to form an extended via including the first via and the second via. A plurality of weights associated with the first structure, the second structure, the third structure, and the fourth structure is determined, and a quality of the extended via is determined based on the plurality of weights.Type: GrantFiled: March 13, 2019Date of Patent: May 26, 2020Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: Sha Sha Liu, EnBo Wang, Feng Lu, Li Hong Xiao, Haohao Yang, Zhaosong Li
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Patent number: 10658378Abstract: Embodiments of interconnect structures of a three-dimensional (3D) memory device and method for forming the interconnect structures are disclosed. In an example, a 3D NAND memory device includes a semiconductor substrate, an alternating layer stack disposed on the semiconductor substrate, and a dielectric structure, which extends vertically through the alternating layer stack, on an isolation region of the substrate. Further, the alternating layer stack abuts a sidewall surface of the dielectric structure and the dielectric structure is formed of a dielectric material. The 3D memory device additionally includes one or more through array contacts that extend vertically through the dielectric structure and the isolation region, and one or more channel structures that extend vertically through the alternating layer stack.Type: GrantFiled: July 27, 2018Date of Patent: May 19, 2020Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: Qian Tao, Yushi Hu, Zhenyu Lu, Li Hong Xiao, Xiaowang Dai, Yu Ting Zhou, Zhao Hui Tang, Mei Lan Guo, ZhiWu Tang, Qinxiang Wei, Qianbing Xu, Sha Sha Liu, Jian Hua Sun, Enbo Wang
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Patent number: 10651193Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the memory device includes a first alternating conductor/dielectric stack disposed on the substrate and a layer of silicon carbide disposed over the first alternating conductor/dielectric stack. A second alternating conductor/dielectric stack is disposed on the silicon carbide layer. The memory device includes one or more first structures extending orthogonally with respect to the surface of the substrate through the first alternating conductor/dielectric stack and over the epitaxially-grown material disposed in the plurality of recesses, and one or more second structures extending orthogonally with respect to the surface of the substrate through the second alternating conductor/dielectric stack. The one or more second structures are substantially aligned over corresponding ones of the one or more first structures.Type: GrantFiled: July 27, 2018Date of Patent: May 12, 2020Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: Li Hong Xiao, EnBo Wang, Zhao Hui Tang, Qian Tao, Yu Ting Zhou, Sizhe Li, Zhaosong Li, Sha Sha Liu
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Publication number: 20190378853Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the memory device includes a first alternating conductor/dielectric stack disposed on the substrate and a layer of silicon carbide disposed over the first alternating conductor/dielectric stack. A second alternating conductor/dielectric stack is disposed on the silicon carbide layer. The memory device includes one or more first structures extending orthogonally with respect to the surface of the substrate through the first alternating conductor/dielectric stack and over the epitaxially-grown material disposed in the plurality of recesses, and one or more second structures extending orthogonally with respect to the surface of the substrate through the second alternating conductor/dielectric stack. The one or more second structures are substantially aligned over corresponding ones of the one or more first structures.Type: ApplicationFiled: July 27, 2018Publication date: December 12, 2019Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: Li Hong XIAO, EnBo WANG, Zhao Hui TANG, Qian TAO, Yu Ting ZHOU, Sizhe LI, Zhaosong LI, Sha Sha LIU
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Publication number: 20190341399Abstract: Embodiments of interconnect structures of a three-dimensional (3D) memory device and method for forming the interconnect structures are disclosed. In an example, a 3D NAND memory device includes a semiconductor substrate, an alternating layer stack disposed on the semiconductor substrate, and a dielectric structure, which extends vertically through the alternating layer stack, on an isolation region of the substrate. Further, the alternating layer stack abuts a sidewall surface of the dielectric structure and the dielectric structure is formed of a dielectric material. The 3D memory device additionally includes one or more through array contacts that extend vertically through the dielectric structure and the isolation region, and one or more channel structures that extend vertically through the alternating layer stack.Type: ApplicationFiled: July 27, 2018Publication date: November 7, 2019Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: Qian TAO, Yushi HU, Zhenyu LU, Li Hong XIAO, Xiaowang DAI, Yu Ting ZHOU, Zhao Hui TANG, Mei Lan GUO, ZhiWu TANG, Qinxiang WEI, Qianbing XU, Sha Sha LIU, Jian Hua SUN, Enbo WANG
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Patent number: 9921620Abstract: A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.Type: GrantFiled: November 10, 2016Date of Patent: March 20, 2018Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Shyan-Juh Liu, Kar-Wai Hon, Sha-Sha Liu
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Patent number: 9610717Abstract: A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member while the resist layer is removed. Then the heterogeneous member is inserted in an injection mold, and molten crystalline thermoplastic resin is injected into the mold, thus the resin embedded into the holes and bonding with the shaped piece. The method is environmentally friendly and suitable for mass production.Type: GrantFiled: October 14, 2014Date of Patent: April 4, 2017Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Shyan-Juh Liu, Kar-Wai Hon, Sha-Sha Liu
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Publication number: 20170060200Abstract: A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.Type: ApplicationFiled: November 10, 2016Publication date: March 2, 2017Inventors: SHYAN-JUH LIU, KAR-WAI HON, SHA-SHA LIU
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Patent number: 9538673Abstract: An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.Type: GrantFiled: July 30, 2014Date of Patent: January 3, 2017Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Shyan-Juh Liu, Kar-Wai Hon, Sha-Sha Liu
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Publication number: 20160168742Abstract: A method for surface treating an aluminum alloy workpiece having zinc and magnesium includes: providing the aluminum alloy workpiece; polishing the aluminum alloy to achieve a mirror effect; degreasing the aluminum alloy workpiece; stripping a black film formed on the aluminum alloy workpiece; anodizing the aluminum alloy workpiece in an anodizing solution which includes acidic solution and an additive with a concentration of 0.5 mg/L to 25 g/L to form an oxidation film on the surface of the aluminum alloy workpiece, wherein the additive including at least one compound selected from a group consisting of adipic acid, 1,2,3-Benzotriazole, oxalic acid, sodium malate, and glycerin; and sealing the aluminum alloy workpiece. This disclosure further provides an anodizing solution applied in the method for surface treating an aluminum alloy workpiece and a method for anodizing the aluminum alloy workpiece using the same.Type: ApplicationFiled: June 29, 2015Publication date: June 16, 2016Inventors: SHYAN-JUH LIU, SHA-SHA LIU
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Publication number: 20150111002Abstract: A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member while the resist layer is removed. Then the heterogeneous member is inserted in an injection mold, and molten crystalline thermoplastic resin is injected into the mold, thus the resin embedded into the holes and bonding with the shaped piece. The method is environmentally friendly and suitable for mass production.Type: ApplicationFiled: October 14, 2014Publication date: April 23, 2015Inventors: SHYAN-JUH LIU, KAR-WAI HON, SHA-SHA LIU
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Publication number: 20150036295Abstract: An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.Type: ApplicationFiled: July 30, 2014Publication date: February 5, 2015Inventors: SHYAN-JUH LIU, KAR-WAI HON, SHA-SHA LIU
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Publication number: 20120177244Abstract: A speaker includes a holder forming a hollow space, a magnetic system received in the hollow space, a suspension assembled with the holder and defining a supporting portion, a pair of fixing portions far away from the supporting portion and fixed on the holder, and a plurality of arm portions connecting the supporting portion and the fixing portions, respectively. The arm portions defines a pair of outer arm portions protruded outwardly from the circumference of two ends of the supporting portion and a pair of inner arm portions extending from the circumference of said two ends of the supporting portion and set in space with respect to the inner arm portions, respectively.Type: ApplicationFiled: December 13, 2011Publication date: July 12, 2012Applicants: AMERICAN AUDIO COMPONENTS INC., AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.Inventors: Sha-sha Liu, Wei Song
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Publication number: 20120032566Abstract: A housing includes a main body having an interface and a plastic portion molded on the interface. The main body defines a nanostructure in the interface. The nanostructure includes a plurality of regular, repeating units. A pitch between the adjacent units is in the range from 10 nanometers to 500 nanometers. A height of each unit is in the range from 10 nanometers to 100 nanometers. A surface roughness of the nanostructure is in the range from 1 nanometer to 10 nanometers.Type: ApplicationFiled: October 28, 2010Publication date: February 9, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.Inventors: SHYAN-JUH LIU, YEN-TAI LIN, SHA-SHA LIU