Patents by Inventor Shahab Shervin

Shahab Shervin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OBJECT HOLDER, ELECTROSTATIC SHEET AND METHOD FOR MAKING AN ELECTROSTATIC SHEET
    Publication number: 20230236518
    Abstract: An object holder configured to support an object, the object holder comprising: a core body comprising a plurality of burls having distal ends in a support plane for supporting the object; an electrostatic sheet between the burls, the electrostatic sheet comprising an electrode sandwiched between dielectric layers; and a circumferential barrier for reducing outflow of gas escaping from space between the object and the core body.
    Type: Application
    Filed: June 9, 2021
    Publication date: July 27, 2023
    Applicant: ASML Netherlands B.V.
    Inventors: Bastiaan Lambertus Wilhelmus Marinus VAN DE VEN, Koos VAN BERKEL, Marcus Adrianus VAN DE KERKHOF, Roger Franciscus Mattheus Maria HAMELINCK, Shahab SHERVIN, Marinus Augustinus Christiaan VERSCHUREN, Johannes Bernardus Charles ENGELEN, Matthias KRUIZINGA, Tammo UITTERDIJK, Oleksiy Sergiyovich GALAKTIONOV, Kjeld Gertrudus Hendrikus JANSSEN, Johannes Adrianus Cornelis Maria PIJNENBURG, Peter VAN DELFT
  • Externally-strain-engineered semiconductor photonic and electronic devices and assemblies and methods of making same
    Patent number: 10897120
    Abstract: Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.
    Type: Grant
    Filed: September 29, 2018
    Date of Patent: January 19, 2021
    Assignee: UNIVERSITY OF HOUSTON SYSTEM
    Inventors: Jae-Hyun Ryou, Shahab Shervin, Seung Hwan Kim
  • Externally-strain-engineered semiconductor photonic and electronic devices and assemblies and methods of making same
    Patent number: 10476234
    Abstract: Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: November 12, 2019
    Assignee: UNIVERSITY OF HOUSTON SYSTEM
    Inventors: Jae-Hyun Ryou, Shahab Shervin, Seung Hwan Kim
  • Flexible Single-Crystal Semiconductor Heterostructures and Methods of Making Thereof
    Publication number: 20190198313
    Abstract: Discussed herein are systems and methods for fabrication of flexible electronic structures via direct growth of two-dimensional materials on metal foil and the direct growth of 2D materials on any substrate including polycrystalline, single crystal, and amorphous substrates, that may employ an adhesion layer of, for example, a Cu or Ni film, formed directly on the substrate prior to formation of subsequent layers.
    Type: Application
    Filed: September 8, 2017
    Publication date: June 27, 2019
    Applicant: University of Houston System
    Inventors: Jae-Hyun Ryou, Shahab Shervin
  • Externally-Strain-Engineered Semiconductor Photonic and Electronic Devices and Assemblies and Methods of Making Same
    Publication number: 20190044307
    Abstract: Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.
    Type: Application
    Filed: September 29, 2018
    Publication date: February 7, 2019
    Applicant: University of Houston System
    Inventors: Jae-Hyun Ryou, Shahab Shervin, Seung Hwan Kim
  • Externally-Strain-Engineered Semiconductor Photonic and Electronic Devices and Assemblies and Methods of Making Same
    Publication number: 20180090911
    Abstract: Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.
    Type: Application
    Filed: April 8, 2016
    Publication date: March 29, 2018
    Applicant: University of Houston System
    Inventors: Jae-Hyun Ryou, Shahab Shervin, Seung Hwan Kim