Abstract: A passive heat exchanger includes an evaporator section including a heat exchange surface formed complementary to a surface of a gas turbine engine component to be cooled. The heat exchange surface is configured to be thermally coupled in conductive contact to the component surface. The heat exchanger further includes a condenser section coupled in passive convective flow communication with the evaporator section, and a working fluid contained within the evaporator section and the condenser section and configured to passively convect heat from the evaporator section to the condenser section.

Abstract: A transient cooling system includes a first phase change material (PCM) element and a second PCM element. The first PCM element includes a first PCM, a first surface, and a second surface, the first surface complementary to a surface to be cooled. The second PCM element includes a second PCM and a third surface in thermal contact with the second surface. The first PCM and the second PCM may have different thermal characteristics.

Abstract: A transient cooling system includes a first phase change material (PCM) element and a second PCM element. The first PCM element includes a first PCM, a first surface, and a second surface, the first surface complementary to a surface to be cooled. The second PCM element includes a second PCM and a third surface in thermal contact with the second surface. The first PCM and the second PCM may have different thermal characteristics.

Abstract: A passive heat exchanger includes an evaporator section including a heat exchange surface formed complementary to a surface of a gas turbine engine component to be cooled. The heat exchange surface is configured to be thermally coupled in conductive contact to the component surface. The heat exchanger further includes a condenser section coupled in passive convective flow communication with the evaporator section, and a working fluid contained within the evaporator section and the condenser section and configured to passively convect heat from the evaporator section to the condenser section.

Abstract: A gas turbine engine cooling system includes a gas turbine engine. The gas turbine engine includes a core engine, a cold sink, a core undercowl space, and a core cowl at least partially surrounding the core engine and defining a radially outer wall of the core undercowl space. The gas turbine engine cooling system includes an undercowl component positioned in the core undercowl space. The gas turbine engine cooling system also includes a heat pipe including a first end, a second end, and a conduit extending therebetween. The first end is thermally coupled to the undercowl component, and the second end is thermally coupled to the cold sink. The heat pipe facilitates transfer of a quantity of heat from the undercowl component to the cold sink.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing. In an exemplary embodiment, a thermally-conductive structure which comprises graphite may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally-conductive structure which comprises graphite.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing. In an exemplary embodiment, a thermally-conductive structure which comprises graphite may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally-conductive structure which comprises graphite.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.