Abstract: A method includes monitoring a use of a cable assembly that includes a communication cable terminated by a termination module. Data indicative of the use is written to a writeable non-volatile memory in the termination module. The use of the cable assembly is acted upon by reading the data from the non-volatile memory.

Abstract: A method includes monitoring a use of a cable assembly that includes a communication cable terminated by a termination module. Data indicative of the use is written to a writeable non-volatile memory in the termination module. The use of the cable assembly is acted upon by reading the data from the non-volatile memory.

Abstract: A method includes monitoring a use of a cable assembly that includes a communication cable terminated by a termination module. Data indicative of the use is written to a writeable non-volatile memory in the termination module. The use of the cable assembly is acted upon by reading the data from the non-volatile memory.

Abstract: A method for fabricating an optical interconnect includes producing a semiconductor wafer that includes multiple first dies. Each first die includes circuitry disposed over a surface of the wafer and connected to conductive vias arranged in rows. The multiple first dies are diced by cutting the wafer across the rows of the vias, such that, in each first die, the cut vias form respective contact pads on a side face of the first die that is perpendicular to the surface. A second semiconductor die including one or more optoelectronic transducers is attached to the contact pads, so as to connect the transducers to the circuitry.

Abstract: An apparatus includes a connector that connects to optical fibers for connecting first and second optical signals to the apparatus. A first optical ferrule is mounted perpendicularly to the connector, and transfers the first optical signals between the connector and first optical transducers mounted on a first substrate, via first holes formed in the first substrate. A second optical ferrule is mounted perpendicularly to the connector, and transfers the second optical signals between the connector and second optical transducers mounted on a second substrate, via second holes formed in the second substrate. A light rotation module bends and transfers the first and second optical signals between the connector and the first and second ferrules. One or more lenses are mounted between the first ferrule and the first holes, so as to couple the first optical signals via the first holes between the first ferrule and the first optical transducers.

Abstract: An optical interface module includes a single flexible Printed Circuit Board (PCB) including conductive traces. An electrical connector, one or more opto-electronic transducers and ancillary circuitry are disposed on the flexible PCB. The electrical connector is configured to mate with a corresponding connector on a substrate. The opto-electronic transducers are configured to be coupled to optical fibers carrying optical signals. The ancillary circuitry is coupled by the traces to the opto-electronic transducers and the electrical connector so as to convey electrical signals corresponding to the optical signals between the opto-electronic transducers and the electrical connector.

Abstract: A method for fabricating an integrated optical interconnect includes disposing a layer over a substrate on which at least one optoelectronic transducer has been formed. A groove is formed in the layer in alignment with the optoelectronic transducer. A slanted mirror is formed in the layer at an end of the groove adjacent to the optoelectronic transducer to direct light between the optoelectronic transducer and an optical fiber placed in the groove.

Abstract: An apparatus includes an optically opaque substrate, which includes first and second opposite surfaces and has one or more openings traversing through the substrate between the first and second surfaces. One or more optical transducers are attached to the first surface of the substrate so as to emit or detect light via the respective openings. One or more lenses are positioned against the respective openings on the second surface of the substrate, and are configured to couple the light between the optical transducers and respective optical fibers.

Abstract: An apparatus includes an optically opaque substrate, which includes first and second opposite surfaces and has one or more openings traversing through the substrate between the first and second surfaces. One or more optical transducers are attached to the first surface of the substrate so as to emit or detect light via the respective openings. One or more lenses are positioned against the respective openings on the second surface of the substrate, and are configured to couple the light between the optical transducers and respective optical fibers.

Abstract: An apparatus includes an optical Input/Output (I/O) connector, which has a central axis that is mounted in a plane and which is configured to connect to external optical fibers for transferring input optical signals to the apparatus and output optical signals from the apparatus. A first optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the input optical signals from the optical I/O connector to respective optical detectors. A second optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the output optical signals from respective optical emitters to the optical connector. A light rotation module is configured to bend and transfer the input and output optical signals between the optical I/O connector and the perpendicularly-mounted first and second optical ferrules.

Abstract: An apparatus includes a connector that connects to optical fibers for connecting first and second optical signals to the apparatus. A first optical ferrule is mounted perpendicularly to the connector, and transfers the first optical signals between the connector and first optical transducers mounted on a first substrate, via first holes formed in the first substrate. A second optical ferrule is mounted perpendicularly to the connector, and transfers the second optical signals between the connector and second optical transducers mounted on a second substrate, via second holes formed in the second substrate. A light rotation module bends and transfers the first and second optical signals between the connector and the first and second ferrules. One or more lenses are mounted between the first ferrule and the first holes, so as to couple the first optical signals via the first holes between the first ferrule and the first optical transducers.

Abstract: An apparatus includes an optical Input/Output (I/O) connector, which has a central axis that is mounted in a plane and which is configured to connect to external optical fibers for transferring input optical signals to the apparatus and output optical signals from the apparatus. A first optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the input optical signals from the optical I/O connector to respective optical detectors. A second optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the output optical signals from respective optical emitters to the optical connector. A light rotation module is configured to bend and transfer the input and output optical signals between the optical I/O connector and the perpendicularly-mounted first and second optical ferrules.

Abstract: An apparatus includes an L-shaped fixture, a first semiconductor die and a second semiconductor die. The L-shaped fixture includes first and second perpendicular faces. The first semiconductor die includes an array of optoelectronic transducers and is attached onto the first face. The second semiconductor die, which is mounted parallel to the second face, includes ancillary circuitry connected to the optoelectronic transducers by electronic interconnects configured within the fixture.

Abstract: A method for fabricating an optical interconnect includes producing a semiconductor wafer that includes multiple first dies. Each first die includes circuitry disposed over a surface of the wafer and connected to conductive vias arranged in rows. The multiple first dies are diced by cutting the wafer across the rows of the vias, such that, in each first die, the cut vias form respective contact pads on a side face of the first die that is perpendicular to the surface. A second semiconductor die including one or more optoelectronic transducers is attached to the contact pads, so as to connect the transducers to the circuitry.

Abstract: A method for fabricating an integrated optical interconnect includes disposing a layer over a substrate on which at least one optoelectronic transducer has been formed. A groove is formed in the layer in alignment with the optoelectronic transducer. A slanted mirror is formed in the layer at an end of the groove adjacent to the optoelectronic transducer to direct light between the optoelectronic transducer and an optical fiber placed in the groove.

Abstract: An optical interface module includes a single flexible Printed Circuit Board (PCB) including conductive traces. An electrical connector, one or more opto-electronic transducers and ancillary circuitry are disposed on the flexible PCB. The electrical connector is configured to mate with a corresponding connector on a substrate. The opto-electronic transducers are configured to be coupled to optical fibers carrying optical signals. The ancillary circuitry is coupled by the traces to the opto-electronic transducers and the electrical connector so as to convey electrical signals corresponding to the optical signals between the opto-electronic transducers and the electrical connector.

Abstract: A method includes monitoring a use of a cable assembly that includes a communication cable terminated by a termination module. Data indicative of the use is written to a writeable non-volatile memory in the termination module. The use of the cable assembly is acted upon by reading the data from the non-volatile memory.

Abstract: An adapter includes a mechanical frame, which is configured to be inserted into a four-channel Small Form-Factor Pluggable (SFP) receptacle and to receive inside the frame a single-channel SFP cable connector. First electrical terminals, held by the mechanical frame, are configured to mate with respective first pins of the receptacle. Second electrical terminals, held within the mechanical frame, are configured to mate with respective second pins of the connector. Circuitry couples the first and second electrical terminals so as to enable communication between the connector and one channel of the receptacle while terminating the remaining channels of the receptacle.

Abstract: An adapter includes a mechanical frame, which is configured to be inserted into a four-channel Small Form-Factor Pluggable (SFP) receptacle and to receive inside the frame a single-channel SFP cable connector. First electrical terminals, held by the mechanical frame, are configured to mate with respective first pins of the receptacle. Second electrical terminals, held within the mechanical frame, are configured to mate with respective second pins of the connector. Circuitry couples the first and second electrical terminals so as to enable communication between the connector and one channel of the receptacle while terminating the remaining channels of the receptacle.