Abstract: A method for deblurring a blurred image includes dividing the blurred image into overlapping regions each having a size and an offset from neighboring overlapping regions along a first direction as determined by a period of a ringing artifact in the blurred image, or by obtained blur characteristics relating to the blurred image and/or attributable to the optical system, or by a detected cause capable of producing the blur characteristics, stacking the overlapping regions to produce a stacked output, wherein the overlapping regions are sequentially organized along the first direction, convolving the stacked output through a first convolutional neural network (CNN) to produce a first CNN output having reduced blur as compared to the stacked output, and assembling the first CNN output into a re-assembled image, and processing the re-assembled image through a second CNN to produce a deblurred image having reduced residual artifacts as compared to the re-assembled image.

Abstract: A method includes, receiving a first digital image (FDI) to-be printed by a digital printing system (DPS) (10). In a in training phase: for first selected regions (111) in the FDI, a first set of synthetic images (SIs) (112A, 112B, 114A, 114B, 116A, 116B) having a defect caused by a defective part (DP) (99) in the first selected regions, is produced; a neural network (NN) (150) is trained to detect the defect using the first set SIs. In a subsequent detection phase: the NN is applied for identifying, in a second digital image (SDI) (136, 146) acquired from an image produced by the DPS, suspected second regions (135, 145); for each of the second regions, a second set (137, 147) of SIs having DPs that form the defects, is produced; and the DP is identified by comparing, in each of the second regions, between the SDI and the second set SIs.

Abstract: A system and method for performing quality control in a digital printing system (DPS) is provided. The DPS includes an impression station for transferring an ink image from a surface of an intermediate transfer member to a substrate. The impression station includes an impression cylinder housing one or more grippers operable to grasp and hold a leading edge of the substrate as it passes through the DPS, for conveying the substrate along the impression cylinder during the transfer of the ink image. An imaging device is operable, during advancement of the substrate on the impression cylinder, to capture a digital image including a region of interest (ROI) that is associated with at least a portion of the grippers and at least a portion of the substrate. A controller is configured, based on the digital image, to indicate an error in a position of the substrate relative to the grippers.

Abstract: The present disclosure provides a meat analogue that comprises a protein-based component and a fat-based component separately distributed within the meat analogue; wherein the meat analogue comprises at least one segment that consists essentially of the protein based component which is chemically distinct from at least one other segment that consists essentially of the fat-based component; and wherein at least one of the following is fulfilled (i) a cubic sample of the meat analogue exhibits an anisotropic physical property and (ii) the meat analogue comprises a non-homogenous distribution of the protein based component and the fat-based component. Also disclosed herein is a method of producing the meat analogue, the method preferably involved digital printing of the meat analogue.

Abstract: Systems and methods for detecting objects from a moving platform are provided. The method includes receiving, from a camera coupled to the moving platform, first and second image frames, wherein the second image frame is subsequent in time to the first image frame. Within the first image frame, a first target is defined characterizing the location of an object detected in the first image frame. A first score associated with the first target and a second score associated with the second target are determined, and a first predicted target is determined based on a tracking process applied to the first target. A third score associated with the first predicted target is determined. The method determines a merged target corresponding to the second target when the second score is greater than the third score and a proximity measure between the second target and the first predicted target is above a threshold.

Abstract: Systems and methods for detecting objects from a moving platform are provided. The method includes receiving, from a camera coupled to the moving platform, first and second image frames, wherein the second image frame is subsequent in time to the first image frame. Within the first image frame, a first target is defined characterizing the location of an object detected in the first image frame. A first score associated with the first target and a second score associated with the second target are determined, and a first predicted target is determined based on a tracking process applied to the first target. A third score associated with the first predicted target is determined. The method determines a merged target corresponding to the second target when the second score is greater than the third score and a proximity measure between the second target and the first predicted target is above a threshold.

Abstract: A multi-mode digital photography method including generating an output image of a location L at a specific time t which is identified as a function of a user-selected photography task, the method including generating an output image of a particular scene which is built up from a plurality of images thereof, as another function of a user-selected photography task.

Abstract: A multi-mode digital photography method including generating an output image of a location L at a specific time t which is identified as a function of a user-selected photography task, the method including generating an output image of a particular scene which is built up from a plurality of images thereof, as another function of a user-selected photography task.

Abstract: A multi-mode digital photography method including generating an output image of a location L at a specific time t which is identified as a function of a user-selected photography task, the method including generating an output image of a particular scene which is built up from a plurality of images thereof, as another function of a user-selected photography task.

Abstract: A multi-mode digital photography method including generating an output image of a location L at a specific time t which is identified as a function of a user-selected photography task. the method including generating an output image of a particular scene which is built up from a plurality of images thereof, as another function of a user-selected photography task.

Abstract: An optical inspection tool can automatically perform analysis/operations after the tool has generated data identifying defects (e.g. a defect list) from an inspection run of an object such as a semiconductor wafer. The tool can decouple post-inspection tasks from performing inspection runs so that one or more post-inspection tasks are performed on defect data from a previous inspection run while another inspection run is in progress. This can significantly improve the throughput of the tool when multiple inspections are performed, since the inspection run time effectively is shortened to include only the time the tool is actually used to acquire defect data. One or more post-inspection tasks can be performed, including, but not limited to, merging inspection runs, removing duplicate defects, removing straight-line false alarms, and characterizing defects.

Abstract: A tester that evaluates the condition of a plurality of elongated hollow objects by emitting a signal into the objects and measuring the reflected signals at particular sample points, generating a statistically related base signal based on the values at each such sample point and creating an adjusted signal for each measures signal by modifying as a function of the base signal. Analyze the adjusted signals to look for anomalies within each object.

Abstract: An optical inspection tool can feature a double-speed and other modes whereby the inspection rate is increased by using pixel binning. For instance, the tool may include an array of pixels provided by one or more detectors. Some or all of the pixels in one or more of the detectors may be binned according to inspection requirements. Based on the reduction in effective pixels due to the binning, in some embodiments, the rate of imaging and scanning rate of the wafer (or other object) can be increased. Different portions of the array may be binned differently to provide for increased throughput during inspections; for instance, the binning arrangement across an array can be correlated to the features that will be imaged using the array.

Abstract: A spatial mask printer may be used in conjunction with an optical inspection tool. The tool can be used to obtain a Fourier image of an inspected object, and a filter mask image can be designed to block certain aspects of the object's image in the Fourier plane corresponding to repetitive aspects of the imaged object. The filter mask image can then be printed and used in the tool during the inspection process. The mask image may be designed by hand or by computer and may be stored for later use. Filters may be automatically placed into the optical path of the inspection tool by a filter wheel, or may be housed in other filter banks. The printer may be configured to operate in a clean room environment, and may be integrated into the optical inspection tool.

Abstract: An optical inspection system or tool can be configured to inspect objects using dynamic illumination where one or more characteristics of the illumination is/are adjusted to meet the inspection needs of different areas. For example, the illumination intensity may be increased or decreased as the tool inspects areas of memory and periphery features in a wafer die. In some embodiments, the adjustment can be based on data obtained during a pre-inspection setup sequence in which images taken based on illumination with varying characteristics are evaluated for suitability in the remainder of the inspection process.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: Inspection of objects, such as semiconductor wafers, can be performed using a diluted scan wherein not all of an inspected area is actually imaged. Instead, a dilution plan can be devised based on the desired amount of area to be skipped and the particular parameters of the inspection, such as the size of each unit area to be imaged or not imaged and the distribution features of the wafer. When the same area is inspected in multiple wafers, the wafers can be inspected in sets using a dilution plan whereby a wafer (or inspected area) can be statistically inspected using diluted scans of the set of wafers. Similarly a die or group of dies of a specified type can be statistically inspected using diluted scans of a set of dies (or group of dies). When statistical inspection is used, the end results of such inspections, such as defect densities and distributions, can be corrected to account for inaccuracies that may be introduced when certain portions are imaged more often than others due to the dilution plan.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: An inspection system can support operation in multiple states. For instance, when inspecting an article, such as a semiconductor wafer, the tool can switch between imaging multiple locations using respective detectors to another operating state wherein multiple detectors operating in multiple imaging modes inspect a single location. An inspection system may combine the use of multiple detectors for multiple locations and the use of multiple viewing angles or modes for the same locations and thereby achieve high throughput. The different imaging modes can comprise, for example, different collection angles, polarizations, different spectral bands, different attenuations, different focal positions relative to the wafer, and other different types of imaging.

Abstract: A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.