Patents by Inventor Shaik Labeeb

Shaik Labeeb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked hybrid interposer through silicon via (TSV) package
    Publication number: 20100314730
    Abstract: An integrated circuit (IC) device is provided. The IC device includes a first die having a surface with a first pad formed thereon, a second die having a surface with a second pad formed thereon, and a substrate interposer that couples the first pad to the second pad. The substrate interposer is coupled to the surface of the first die and the surface of the second die.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 16, 2010
    Applicant: Broadcom Corporation
    Inventor: Shaik Labeeb