Abstract: Apparatus, systems and methods for providing a four-part, virtual reality (VR) customer service interaction between a customer service avatar operating on a VR platform and a customer using both a mobile device and a VR device are provided. Methods may include activating a VR session between the customer service avatar and the customer. Methods may include validating the VR session between the customer service avatar and the customer. Methods may include processing a co-browsing VR session request. Methods may include initiating the VR session between the customer service avatar and the customer.

Abstract: Systems, apparatuses and methods may provide for technology that includes a Peltier module and a subsystem thermally coupled and electrically coupled to the Peltier module, the subsystem to monitor an operational state of the subsystem, place the Peltier module in a first power mode if the operational state indicates that a demand spike exists with respect to the subsystem, and place the Peltier module in a second power mode if the operational state indicates that the demand spike does not exist with respect to the subsystem, wherein the second power mode is associated with a lower level of system power consumption than the first power mode.

Abstract: Embodiments herein relate to a module which can be inserted into or removed from a computing device by a user. The module includes an input-output port which is configured for a desired specification, such as USB-A, USB-C, Thunderbolt, DisplayPort or HDMI. The port can be provided on an expansion card such as an M.2 card for communicating with a host platform. The host platform can communicate with different types of modules in a standardized way so that complexity and costs are reduced. In another aspect, with a dual port module, the host platform can concurrently send/receive power through one port and send/receive data from the other port.

Abstract: Techniques and mechanisms for improving an efficiency of power delivery resources. In one embodiment, switch circuitry is operated based on an indication from an integrated circuit (IC) die that circuitry of the IC die is ready to accommodate a low power state which disables a delivery of power to the IC die by a voltage regulator (VR). The switch circuitry is operated, based on a control signal is also used to disable said power delivery, to disable or otherwise prevent one or more conductive paths which are each between a respective two of a battery pack, a voltage regulator, or a battery charger. In another embodiment, the low power state enable a rail for circuitry which is to provide a real time clock signal to the IC die, but disables any other rails which power the IC die.

Abstract: Systems, apparatuses and methods may provide for power adapter technology that includes an adapter plug having a housing, a plurality of contacts positioned within the housing, wherein the plurality of contacts includes one or more configuration channel contacts, and a piezoelectric membrane positioned on an external surface of the housing, wherein the piezoelectric membrane is electrically connected to the one or more configuration channel contacts. Additionally, sink device technology may detect a signal from the piezoelectric membrane of the adapter plug via the configuration channel contact(s), wherein the signal indicates user contact with the adapter plug, and disconnect a bulk capacitor from a receptacle adjacent to the adapter plug in response to a disconnect condition associated with the user contact.

Abstract: Embodiments herein relate to a power monitor that can be used to dynamically change a power level of an electronic device and/or operational settings of a processor of the electronic device. Specifically, the power monitor may be configured to identify “droop” of power, and logic to update the power level and/or operational settings in accordance with identification of the droop. Other embodiments may be described and claimed.

Abstract: USB ports such as Type-C USB-C ports in a personal computer (PC) or other computing device may be configured in dual-role port (DRP) mode. The DRP mode may provide the ability for a port to switch between providing power to an external device and receiving power from an external power source to the into the computing device. The voltage level received from an external power source is typically higher than the voltage level provided to an external device. When a USB device fails, it may apply the higher voltage level to an external device, which may cause the external device to fail. A voltage sense and device detection circuit which may be used to detect an internal failure and prevent a higher internal voltage to be applied to a USB device.

Abstract: Systems, apparatuses and methods may provide for technology that configures a computing system to be a power sink from an external display, detects an alternating current (AC) power failure with respect to the external display, and configures the computing system to be a power source for the external display in response to the AC power failure. In one example, the technology places the external display in a low power state after the AC power failure is detected.

Abstract: Embodiments herein relate to avoiding damage to a transistor in a power-sinking device that receives power from an external power source via a Universal Serial Bus port. In one aspect, a controller of the device sets a current limit to a reduced level during a wait period after the external power source is connected to the power-sinking device. The wait period avoids damage to the transistor by allowing its input and output voltages to equalize before the current is increased. Upon expiration of the wait period, the current limit is increased to a level negotiated with the external power source. Other aspects involve considering a sleep or low/dead battery state of the power-sinking device. The current limit can be set by programming a current limit of a battery charger coupled to between the transistor and a power bus of the device.

Abstract: M.2 Universal Flash Storage (UFS) and combined UFS/PCIe cards are described herein. In one example, the same M.2 interface is reused on the main board of laptop for supporting both PCIe SSD and UFS storage. One M.2 socket can accommodate a UFS Add-In-Card, a combined PCIe/UFS card, and/or a PCIe SSD. In one example, an M.2 UFS card includes a printed circuit board (PCB), an edge to be received by an M.2 connector, conductive contacts at the edge to couple with contacts of the M.2 connector, a UFS storage device, and UFS signal lines between the conductive contacts and the UFS storage device.

Abstract: An electronic system has a printed circuit board and a substrate. The substrate has two sides, a top and bottom. At least one memory unit is connected to the bottom side of the substrate and at least one processor is connected to the top side of the substrate. The memory is connected to the processor with interconnects that pass through the substrate.

Abstract: An apparatus can include universal serial bus type C (USB-C) connection circuitry. The apparatus can also include input/output (I/O) circuitry coupled to the USB-C connection circuitry. The I/O circuitry can receive a power signal over the USB-C connection circuitry. The apparatus can include baseband circuitry to initiate wireless wide area network (WWAN) communication responsive to receiving a wake signal from the I/O circuitry. The WWAN communication can include messages received from the USB-C connection circuitry. Other apparatuses, systems, and methods are described.

Abstract: An apparatus comprises a circuit board comprising a connector in or on the circuit board. The apparatus is to be coupled to a bus via the connector. The apparatus comprises first circuitry to communicate with a processor via the connector and bus, second circuitry to detect a utilization state of the first circuitry, determine, based on the detected utilization state of the first circuitry, a level of current to be conducted with the connector; and generate a signal indicating of whether the level of current exceeds a threshold current capacity of the connector, and third circuitry to select a first operational mode from among multiple operational modes. The first circuitry is to operate in any of the multiple operational modes responsive to the third circuitry. Additional circuitry may be provided to identify a voltage level capability of the apparatus and to configure voltage level shifting circuitry connected to the bus.

Abstract: A battery-powered device includes a baseband modem, configured to receive or send data according to a first operational mode, wherein the data correspond to a software application being executed on the battery-powered device; and a processor, configured to determine a resource requirement of the software application; and send a signal representing the determined resource requirement to the baseband modem; wherein the baseband modem is further configured to change from the first operational mode to a second operational mode based on the signal.

Abstract: An interface card includes a circuit board, a device mounted on the circuit board, and a PMIC mounted on the circuit board. The PMIC includes a PMIC processor communicatively coupled to a host processor of a host system. The PMIC processor is configured to receive an input voltage signal from a power supply that is external to the interface card. The PMIC processor generates at least one output voltage signal based on the input voltage signal. The at least one output voltage signal is supplied to the device. A power enable signal originating from the host processor is detected. The power enable signal is detected at a GPIO connector of the PMIC. The PMIC processor deactivates generation of the at least one output voltage signal based on the power enable signal.

Abstract: Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by applying a downward force to the module PCB. A novel clip assembly is provided to apply the downward force, while also aligning the module PCB (and its LGA) to the motherboard or system board PCB. A heat shield is provided that is configured to be disposed over the module PCB to facilitate enhanced thermal spreading and lowering thermal resistance both towards the heat shield and the PCBs. Example modules include a WWAN module and an NVMe SSD module. The module PCB may employ an M.2 form factor or other form factors.

Abstract: A wireless device includes a voltage regulator circuit configured to generate a voltage signal of a first input voltage, and a wireless baseband processing circuitry (WBPC) coupled to the voltage regulator circuit to receive the voltage signal. The WBPC is configured to process signals for transmission or reception using wireless technology. The WBPC includes a sub-system processor circuit configured to detect a wireless bandwidth of an application executing on an application processor of the wireless device; determine a second input voltage based on the wireless bandwidth of the application and a maximum voltage supported by the WBPC; and encode a feedback signal for communication to the voltage regulator circuit. The feedback signal causes adjustment of the voltage signal to the second input voltage.

Abstract: A computing device includes a plurality of baseband processing circuitries. Each baseband processing circuitry of the plurality of baseband processing circuitries is configured to process signals for reception or transmission using a communication standard of a corresponding plurality of communication standards. The computing device further includes an application processor coupled to the plurality of baseband processing circuitries. The application processor is configured to determine a bandwidth of an application executing on the application processor of the computing device, determine a plurality of latencies associated with each baseband processing circuitry of the plurality of baseband processing circuitries, and select a baseband processing circuitry of the plurality of baseband processing circuitries to process transmit or receive data of the application based on the bandwidth and the plurality of latencies.

Abstract: Techniques for wireless audio device selection are disclosed. In the illustrative embodiment, a compute device uses visual training to recognize headphones worn by a user. When the user puts on the headphones, the compute device may recognize the headphones and automatically route audio output to the headphones. In some embodiments, when selecting from several possible wireless audio output devices, the compute device may determine a distance to each of the wireless audio output devices and select one of the wireless audio output devices based on the distance to the wireless audio output device.

Abstract: A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.