Abstract: Methods, apparatuses and systems to provide for technology to that includes a first power electronics module including a plurality of first transistors that are diagonally offset from each other, and a second power electronics module stacked on the first power electronics module. The second power electronics module includes second transistors that are diagonally offset from each other. The second transistors are staggered relative to the first transistors.

Abstract: A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

Abstract: A method of decomposing a cured aromatic epoxy resin uses a molten salt bath at less than about 350° C. The molten salt bath includes a plurality of alkali metal hydroxides. The cured aromatic epoxy resin can be in intimate physical contact with a metal or alloy. The cured aromatic epoxy resin can be patterned by a lithographic method. The lithographic method can be multibeam interference lithography to form a three-dimensional photonic crystal template on a conductive substrate for electrodeposition of metal. Contacting the three-dimensional photonic crystal template with the electrodeposited metal with the molten salt bath can form a metal matrix device displaying a periodic pattern that is the inverse of the periodic pattern of the decomposed three-dimensional photonic crystal template.

Abstract: A method to control the density of a three-dimensional photonic crystal template involves changing the irradiation time from at least four laser beams to yield a periodic percolating matrix of mass and voids free of condensed matter from a photoresist composition. The photoresist composition includes a photoinitiator at a concentration where the dose or irradiation is controlled by the irradiation time and is less than the irradiation time that would convert all photoinitiator to initiating species such that the density of the three-dimensional photonic crystal template differs for different irradiation times. A deposition of reflecting or absorbing particles can be patterned on the surface of the photoresist composition to form a template with varying densities above different areas of the substrate.

Abstract: A system for using an electrostatic force to cause an object to adhere to a surface of a vehicle can include an electrode and a device. The electrode can be configured to be disposed within a structure of the vehicle. The structure can define the surface. A shape of the electrode can define a shape of a region of the surface. The device can be configured to connect the electrode to a voltage source so that, at a time at which the electrode is connected to the voltage source, an electric charge is produced on the electrode to produce the electrostatic force capable of causing the object to adhere to the surface. For example, the surface can include a dashboard, a dashboard vent frame, a sunglasses holder cover, or the like. For example, the object can include a mobile device, a cup, a pair of sunglasses, or the like.

Abstract: A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

Abstract: Embodiments described herein generally relate a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core, a composite material pattern, and a surface coating pattern. The inner core is surrounded by an outer core having a thickness and an outer surface. The composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The surface coating pattern is on the outer surface and is changeable between a low emissivity state and a high emissivity state based on a surface temperature of the emitter device. In the low emissivity state, the emitter device transmits an omni-directional radiation and, in the high emissivity state, the emitter device transmits a focused radiation via the composite material pattern.

Abstract: A component with a reflective substrate, a photoresist layer disposed on the reflective substrate, and a light diffusing layer sandwiched between the reflective substrate and the photoresist layer is provided. The light diffusing layer includes an outer metal oxide layer with an outer rough surface configured to diffuse laser light during laser interference lithography of the photoresist layer. The outer metal oxide is also configured to be reduced to a conductive metallic layer during electroplating of the substrate. The outer metal oxide layer includes a plurality of elongated light diffusing elements extending in an outward direction from the substrate such that the outer rough surface diffuses at least 90% of laser light during the laser interference lithography of the photoresist layer.

Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.

Abstract: An aerial vehicle is provided. The aerial vehicle may include a battery, a receiver for wirelessly receiving power to charge the battery, a vehicle magnetic levitation module providing a repelling force between the aerial vehicle and a charging station, and a controller controlling the vehicle magnetic levitation module to adjust a level of the repelling force based on at least one of parameters indicative of charging efficiency.

Abstract: A louvre system controls a flow of cooling air to a heat-generating element mounting inside a wing of an aircraft. The louvre system includes a louvre operably connected to the wing and structured to be rotatable to control airflow through an air intake of the wing into an interior of the wing. A louvre actuation mechanism is operably connected to the louvre and configured to control rotation of the louvre. A memory is communicably coupled to a processor and stores a louvre control module configured to autonomously control operation of the louvre actuation mechanism to control rotation of the louvre responsive to a temperature of a heat-generating element mounted in the wing interior.

Abstract: A ram chute assembly is provided for directing a flow of cooling air into a hollow wing structure of an aircraft. The ram chute assembly includes a ram chute body defining an interior passage, and an air inlet enabling an airflow from an exterior of the ram chute body into the interior passage. The assembly is structured to be attachable to an exterior of an engine nacelle so as to receive propeller wash air through the air inlet into the interior passage when a propeller of the engine nacelle is rotating. The ram chute assembly is also structured to discharge the propeller wash air in a direction toward an air intake opening formed in an upper surface of a hollow wing structure on which the engine nacelle is mounted.

Abstract: A component with a reflective substrate, a photoresist layer disposed on the reflective substrate, and a light diffusing layer sandwiched between the reflective substrate and the photoresist layer is provided. The light diffusing layer includes an outer metal oxide layer with an outer rough surface configured to diffuse laser light during laser interference lithography of the photoresist layer. The outer metal oxide is also configured to be reduced to a conductive metallic layer during electroplating of the substrate. The outer metal oxide layer includes a plurality of elongated light diffusing elements extending in an outward direction from the substrate such that the outer rough surface diffuses at least 90% of laser light during the laser interference lithography of the photoresist layer.

Abstract: An auxiliary fan based hybrid cooling system of an electric machine is contemplated. The hybrid cooling system comprises a propeller positioned on an exterior portion of an enclosure and mechanically coupled to a rotor, at least one electronic component, a stator, the rotor, and an auxiliary fan disposed within the enclosure, and wherein: in a single cooling mode, the propeller rotates to generate air that is channeled into the enclosure, in a dual cooling mode: the propeller rotates to generate the air that is channeled into the enclosure, a coupling mechanism simultaneously engages the rotor and the auxiliary fan and links the propeller to the auxiliary fan by the engaging of the rotor with the auxiliary fan, and the auxiliary fan, rotates responsive to the rotation of the propeller in the dual cooling mode.

Abstract: Aspects of the disclosure provide a method including determining a measurement configuration for one or more piezoelectric devices in an electronic apparatus. The electronic apparatus includes an electronic device mounted on a substrate block using a bonding layer. The one or more piezoelectric devices including a first subset and a second subset are attached to one of the electronic device and the bonding layer. The method includes performing, based on the measurement configuration, a defect measurement on the electronic apparatus by causing the first subset to transmit and the second subset to receive one or more acoustic signals. The method includes determining whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) interfaces of the electronic device, the bonding layer, and the substrate block based on the received one or more acoustic signals.

Abstract: A system includes a power device unit coupled to a substrate. An upper cooling assembly is thermally coupled to an upper side of the substrate. A lower cooling assembly is thermally coupled to a lower side of the substrate. A gate driver unit is coupled to the upper cooling assembly. At least one upper via is formed through the upper cooling electrically coupling the gate driver unit to the power device unit. A capacitor unit is coupled to the lower cooling assembly. At least one lower via formed through the lower cooling assembly electrically coupling the capacitor unit to the power device unit.

Abstract: In various embodiments, a cooling assembly includes a heat-generating device, a metal inverse opal (MIO) layer, a shared coolant reservoir, a passive heat exchange circuit, and an active heat exchange circuit. The MIO layer is bonded to the heat-generating device. The shared coolant reservoir contains a coolant fluid. The passive heat exchange circuit directs coolant fluid from the shared coolant reservoir through the MIO layer and back to the shared coolant reservoir. The active heat exchange circuit includes a pump and a heat exchanger, wherein the active heat exchange circuit draws the coolant fluid from the shared coolant reservoir through the heat exchanger and returns the coolant fluid to the shared coolant reservoir.

Abstract: A hybrid cooling system of an electric machine is contemplated. The hybrid cooling system includes a propeller assembly comprising a propeller, a housing comprising a stator and a rotor coupled to the propeller, and one or more capacitors, a gate drive electronics board, a cold plate, a substrate, power electronics coupled to substrate and the cold plate, a pump for pumping liquid coolant, and a heat exchanger.

Abstract: Apparatuses, systems, and methods relate to technology to identify that a focal length of an adjustable lens is to be modified, where the adjustable lens is supported by a frame. The technology controls a light source to emit light towards the adjustable lens, wherein the light source is supported by the frame and adjusts a curvature of the adjustable lens with the light to modify the focal length of the adjustable lens.

Abstract: Embodiments of the disclosure relate to an electronic assembly including a substrate having a first surface and a second surface opposite to the first surface and one or more electronic devices bonded to the first surface of the substrate. A first heat-storing region is embedded within the substrate and proximate to the second surface. The first heat-storing region comprises a phase change material encapsulated by an encapsulating layer. A melting temperature of the encapsulating layer is higher than a melting temperature of the phase change material and a maximum operating temperature of the one or more electronic devices. A heat transfer layer is embedded within the substrate and thermally connects the first heat-storing region to the one or more electronic devices.