Patents by Inventor Shailesh N. Joshi

Shailesh N. Joshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220192060
    Abstract: A two-phase cold plate that includes a manifold body having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway housed within the manifold body and a vaporization structure housed within the manifold body such that the fluid pathway is disposed over the vaporization structure. The vaporization structure includes a cavity cover, a porous surface, a vapor cavity disposed between the cavity cover and the porous surface, and one or more porous feeding posts extending between the cavity cover and the porous surface. The one or more porous feeding posts fluidly coupled the fluid pathway with the porous surface of the vaporization structure and the porous surface includes a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the vaporization structure.
    Type: Application
    Filed: February 3, 2021
    Publication date: June 16, 2022
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Danny J. Lohan
  • Patent number: 11353861
    Abstract: A method, system, and non-transitory computer readable medium describing an autoencoder that creates a reduced feature space from healthy power electronics devices for training. Devices under test are then encoded and compared to the encoded features of the healthy devices to determine health of the other devices. Contextual information is used to build multiple models that compare power electronics devices from similarly operated vehicles with one another.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: June 7, 2022
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., UNIVERSITY OF CONNECTICUT
    Inventors: Shailesh N. Joshi, Donald Mcmenemy, John Kaminski, Ravi Rajamani, Muhamed Farooq, Krishna Pattipati, Ali Bazzi
  • Publication number: 20220168680
    Abstract: Disclosed is a vehicle comprising a wheel with an associated air-cooled motor, and a ventilation path for passing outside air from outside the vehicle into the motor. An electrostatic device is disposed proximate to the ventilation path. When the electrostatic device is energized, particles or debris in the outside air are attracted toward or repelled from the electrostatic device, such that the particles or debris are removed from the outside air before the outside air enters the motor.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 2, 2022
    Inventors: Shailesh N. Joshi, Ryohei Tsuruta, Umesh Gandhi
  • Publication number: 20220167528
    Abstract: A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 26, 2022
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Danny Lohan, Hitoshi Fujioka, Feng Zhou
  • Publication number: 20220167524
    Abstract: An integrated power electronic assembly includes a power electronic device, a cooling assembly offset from and thermally coupled to a second edge of the power electronic device, and a thermal spreader offset from and thermally coupled to a first edge of the power electronic device. The first edge of the power electronic device is opposite the second edge of the power electronic device, and the thermal spreader is thermally coupled to the cooling assembly.
    Type: Application
    Filed: February 1, 2021
    Publication date: May 26, 2022
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Hitoshi Fujioka, Shailesh N. Joshi, Hiroshi Ukegawa
  • Publication number: 20220142017
    Abstract: A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 5, 2022
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Feng Zhou, Shohei Nagai, Shailesh N. Joshi, Hitoshi Fujioka, Danny J. Lohan, Hiroshi Ukegawa, Ercan Mehmet Dede
  • Publication number: 20220140706
    Abstract: Methods, apparatuses and systems provide technology that includes a first transistor, a second transistor stacked on the first transistor, at least one electrical conductor that is positioned between the first and second transistors and electrically connected to the first and second transistors, and a busbar that is electrically connected to the first and second transistors through the at least one electrical conductor.
    Type: Application
    Filed: November 5, 2020
    Publication date: May 5, 2022
    Applicant: Toyota Motor Engineering and Manufacturing North America, Inc.
    Inventors: Hitoshi Fujioka, Shailesh N. Joshi, Danny J. Lohan
  • Publication number: 20220141991
    Abstract: Methods, apparatuses and systems to provide for technology to that includes a plurality of transistors including first transistors and second transistors. The first transistors are disposed opposite the second transistors in a lateral direction with a first space between the first transistors and the second transistors in the lateral direction. A gate driver is electrically connected to the plurality of transistors to operate the plurality of transistors. The gate driver has a first portion disposed between the first transistors and the second transistors in the first space.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Applicant: Toyota Motor Engineering and Manufacturing North America, Inc.
    Inventors: Hitoshi Fujioka, Shailesh N. Joshi, Feng Zhou, Danny J. Lohan
  • Publication number: 20220134889
    Abstract: Methods, apparatuses and systems to provide for technology to that includes a first power electronics module including a plurality of first transistors that are diagonally offset from each other, and a second power electronics module stacked on the first power electronics module. The second power electronics module includes second transistors that are diagonally offset from each other. The second transistors are staggered relative to the first transistors.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc
    Inventors: Hitoshi Fujioka, Shailesh N. Joshi, Danny J. Lohan
  • Patent number: 11319639
    Abstract: Embodiments of the disclosure relate to methods for forming a flat surface MIO structure for bonding and cooling electronic assemblies. In one embodiment, the method includes providing a plurality of particles on a surface of a base substrate. A metal is then deposited onto the plurality of particles up to a desired level to form a metal layer such that the plurality of particles is partially covered by the metal layer. An adhesive member is then applied to the plurality of particles exposed above the metal layer. Finally the adhesive member is pulled to remove individual particles of the plurality of particles that are exposed above the metal layer.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: May 3, 2022
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Paul Braun, Gaurav Singhal
  • Patent number: 11309230
    Abstract: In one or more embodiments of the present disclosure, a power electronic module may be described. The power electronic module may comprise a power semiconductor device, a substrate coupled to the power semiconductor device, and a base plate coupled to the substrate. The substrate may include from 50 weight percent (wt. %) to 99.9 wt. % of a poly(dicyclopentadiene) polymer. In one or more other embodiments of the present disclosure, a method for manufacturing a power electronic module may be described. The method may include disposing a solution on a base plate. The solution may include dicyclopentadiene monomer, a ruthenium-based catalyst, and a trialkyl phosphite initiator. The method may further include initiating a polymerization front within the solution to produce a substrate formed directly on the base plate. Furthermore, the method may include coupling a power semiconductor device on the substrate to produce the power electronic module.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: April 19, 2022
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventor: Shailesh N. Joshi
  • Publication number: 20220115305
    Abstract: Methods, apparatuses and systems provide for technology that includes a transistor assembly for a power electronics apparatus having a plurality of transistor pairs arranged in a common plane, where for each pair of transistors one transistor is flipped relative to the other transistor. The technology further includes a first lead frame arranged parallel to and electrically coupled to the first transistor in each transistor pair, a second lead frame coplanar to the first lead frame and arranged parallel to and electrically coupled to the second transistor in each transistor pair, and a plurality of output lead frames arranged coplanar to each other, where each respective output lead frame is arranged parallel to and electrically coupled to a respective one pair of the plurality of transistor pairs.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 14, 2022
    Applicant: Toyota Motor Engineering and Manufacturing North America, Inc.
    Inventors: Hitoshi Fujioka, Shailesh N. Joshi, Feng Zhou, Danny J. Lohan
  • Patent number: 11293981
    Abstract: Systems and methods of testing the health of vehicular power devices are disclosed herein. A method may include producing operating points as a function of cycling current (Ids) and voltage drain to source (Vds) when a subject device is conducting current. The method may further include determining a mean of moving distribution to adapt a center of the moving distribution contrasted with a plurality of known healthy devices. The method may also include indicating an imminent fault in the subject device based upon a discontinuity among operating points above a threshold.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: April 5, 2022
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., University of Connecticut
    Inventors: Donald McMenemy, John Kaminski, Shailesh N. Joshi, Ali M. Bazzi, Krishna Pattipati
  • Publication number: 20220102620
    Abstract: Aspects of the disclosure provide a method including determining a measurement configuration for one or more piezoelectric devices in an electronic apparatus. The electronic apparatus includes an electronic device mounted on a substrate block using a bonding layer. The one or more piezoelectric devices including a first subset and a second subset are attached to one of the electronic device and the bonding layer. The method includes performing, based on the measurement configuration, a defect measurement on the electronic apparatus by causing the first subset to transmit and the second subset to receive one or more acoustic signals. The method includes determining whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) interfaces of the electronic device, the bonding layer, and the substrate block based on the received one or more acoustic signals.
    Type: Application
    Filed: September 29, 2020
    Publication date: March 31, 2022
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Ohio State Innovation Foundation
    Inventors: Shailesh N. JOSHI, Vishnu Baba SUNDARESAN, Vijay VENKATESH, Srivatsava KRISHNAN
  • Publication number: 20220102241
    Abstract: In one or more embodiments of the present disclosure, a power electronic module may be described. The power electronic module may comprise a power semiconductor device, a substrate coupled to the power semiconductor device, and a base plate coupled to the substrate. The substrate may include from 50 weight percent (wt. %) to 99.9 wt. % of a poly(dicyclopentadiene) polymer. In one or more other embodiments of the present disclosure, a method for manufacturing a power electronic module may be described. The method may include disposing a solution on a base plate. The solution may include dicyclopentadiene monomer, a ruthenium-based catalyst, and a trialkyl phosphite initiator. The method may further include initiating a polymerization front within the solution to produce a substrate formed directly on the base plate. Furthermore, the method may include coupling a power semiconductor device on the substrate to produce the power electronic module.
    Type: Application
    Filed: September 29, 2020
    Publication date: March 31, 2022
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Shailesh N. Joshi
  • Publication number: 20220065549
    Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.
    Type: Application
    Filed: September 1, 2020
    Publication date: March 3, 2022
    Applicants: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Feng ZHOU, Danny J. LOHAN, Shailesh N. JOSHI, Hitoshi FUJIOKA, Shohei NAGAI, Hiroshi UKEGAWA
  • Patent number: 11247529
    Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: February 15, 2022
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Feng Zhou, Tianzhu Fan, Shailesh N. Joshi, Ercan Mehmet Dede
  • Patent number: 11220426
    Abstract: A method for forming a flow channel in a MIO structure includes positioning a plurality of sacrificial spheres along a base substrate, heating a region of the plurality of sacrificial spheres above a melting point of the plurality of sacrificial spheres, thereby fusing the plurality of sacrificial spheres together and forming a solid channel, electrodepositing material between the plurality of sacrificial spheres and around the solid channel, removing the plurality of sacrificial spheres to form the MIO structure, and removing the solid channel to form the flow channel extending through the MIO structure.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: January 11, 2022
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: Shailesh N. Joshi, Paul Braun, Julia Kohanek, Gaurav Singhal
  • Publication number: 20210381110
    Abstract: A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature.
    Type: Application
    Filed: August 25, 2021
    Publication date: December 9, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Yanghe Liu
  • Patent number: 11193913
    Abstract: A method of detecting sub-surface voids in a sample comprises positioning a probe adjacent to a first point on the sample, emitting an ultrasonic wave from the probe towards the sample, moving the probe towards the sample, measuring a shear force amplitude of a reflection of the ultrasonic wave at the probe as the probe moves towards the sample, creating an approach curve by plotting the measured shear force amplitude of the reflection of the ultrasonic wave as a function of a distance between the probe and the sample, and determining whether a sub-surface void exists at the first point on the sample based on a slope of the approach curve.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: December 7, 2021
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., THE OHIO STATE UNIVERSITY
    Inventors: Shailesh N. Joshi, Vishnu Baba Sundaresan, Vijay Venkatesh