Abstract: Systems and apparatus for a Universal Serial Bus (USB) socket structure configured for duplex connection are provided. The USB socket structure includes a housing and a movable tongue disposed within the housing and configured to be moved between a default position, a first connected position, and a second connected position. The structure further includes a plurality of first contacts disposed on a first surface of the tongue and a plurality of second contacts disposed on a second surface of the tongue, wherein the second surface is opposite to the first surface. Moreover, the plurality of first contacts and the plurality of second contacts comprise a curved shape in accordance with USB standard specifications for a Type-A USB receptacle.

Abstract: An integrated circuit (IC) device test socket has an integrally formed IC picking mechanism for removing an IC device from the test socket after testing. The test socket has a base member and a cover member. The base member includes a recess that is configured to receive an IC device for testing. The cover member is configured to removably engage the base member to secure the IC device between the cover member and the base member. The cover member includes an IC picking mechanism configured to use suction to retain the IC device to the cover member.

Abstract: An electronics backplane assembly includes respective first and second floating backplane connector assemblies each having a backplane connector coupled to a corresponding backplane plate movably coupled with a chassis wall, and a pair of stepped stoppers coupled to the chassis wall and positioned on each side of each backplane plate. Each stepped stopper pair includes a step at a different distance from the chassis wall and positioned to provide a reactive force to the corresponding backplane plate for incrementally engaging respective backplane connectors of an electronics module with a corresponding floating backplane connector. Each floating backplane connector assembly may include a pair of guide stoppers having a stopper structure at respective positions, coupled to the chassis wall and protruding through holes in each backplane plate, where each backplane plate is positioned for connector engagement between the step structure of each stepped stopper and the stopper structure of each guide stopper.

Abstract: A multi-plane high density connector for an electronic device is an edge connector that extends from a body of the electronic device. The body of the electronic device includes a multi-layer printed circuit board (PCB) where the layers are stacked on top of each other. Two or more of the PCB layers have exposed surfaces at least at one end of the PCB, where the exposed surfaces define different planes. Further, each plane of the edge connector includes a row of pins. Signals may be routed from each row of pins in each plane. This reduces an overall number of vias required to route signals from each of the different rows of pins to respective components of the electronic device.

Abstract: Systems and methods are described for assembling multiple circuit boards using support elements to provide a stacked circuit board assembly. A support element is mounted to a first (e.g., main) circuit board, and a pair of additional circuit boards (e.g., daughter boards) are mounted to the support element on two opposite sides of the first circuit board to provide a stacked circuit board assembly.

Abstract: In one embodiment, an apparatus includes a module receivable in a modular electronic system, arms extending from a front panel of the module, and a cable support bracket connected to the arms. The cable support bracket is slidably connected to the arms to change a distance between the cable support bracket and the front panel of the module.

Abstract: In one embodiment, an apparatus includes a module receivable in a modular electronic system, arms extending from a front panel of the module, and a cable support bracket connected to the arms. The cable support bracket is slidably connected to the arms to change a distance between the cable support bracket and the front panel of the module.

Abstract: An integrated circuit (IC) device test socket has an integrally formed IC picking mechanism for removing an IC device from the test socket after testing. The test socket has a base member and a cover member. The base member includes a recess that is configured to receive an IC device for testing. The cover member is configured to removably engage the base member to secure the IC device between the cover member and the base member. The cover member includes an IC picking mechanism configured to use suction to retain the IC device to the cover member.

Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.

Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.

Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.

Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.

Abstract: In one embodiment, an apparatus includes a module receivable in a modular electronic system, arms extending from a front panel of the module, and a cable support bracket connected to the arms. The cable support bracket is slidably connected to the arms to change a distance between the cable support bracket and the front panel of the module.

Abstract: In one embodiment, a cable management bracket for managing cables connected to a modular electronic system mounted on a rack comprises a fixed portion and a rotatable portion extending from the fixed portion and comprising a support member for supporting the cables, the rotatable portion rotatable with the cables to allow for removal and insertion of a module of the modular electronic system.

Abstract: An expandable rack mountable computing device for use in a variety of telecommunications and computing racks comprises a computing device chassis, at least one expandable baffle, at least one biasing mechanism, and at least one expansion mechanism. During installation of the computing device into a rack, the biasing mechanism holds the at least one expandable baffle in a retracted position at least partially inside of the computing device chassis. After installation of the computing device into a rack, the expansion mechanism pushes the at least one expandable baffle into a retracted position at least partially outside of the computing device chassis.

Abstract: In one embodiment, an apparatus includes a frame for mounting in a rack in a position adjacent and external to a network device supported by the rack and a filter module for holding a filter for filtering air entering an air inlet of the network device. The frame includes an opening for receiving the filter module and positions the filter adjacent to the air inlet of the network device when installed on the rack.

Abstract: In one embodiment, a cable management bracket for managing cables connected to a modular electronic system mounted on a rack comprises a fixed portion and a rotatable portion extending from the fixed portion and comprising a support member for supporting the cables, the rotatable portion rotatable with the cables to allow for removal and insertion of a module of the modular electronic system.

Abstract: In one embodiment, an apparatus includes a frame comprising a top wall, a bottom wall, and sides defining an opening for receiving a plurality of removable electronic modules, a guide slidably insertable into the frame to partition an upper or lower portion of the opening when inserted into the frame, wherein the guide comprises a first edge for slidable engagement with the top wall or the bottom wall, and a lead screw extending from an opening in the guide spaced from a front end of the guide, to a back end of the guide for connecting the guide to the frame.

Abstract: In one embodiment, an apparatus includes a frame for mounting in a rack in a position adjacent and external to a network device supported by the rack and a filter module for holding a filter for filtering air entering an air inlet of the network device. The frame comprises an opening for receiving the filter module and positions the filter adjacent to the air inlet of the network device when installed on the rack.

Abstract: In one embodiment, an apparatus includes a frame comprising a top wall, a bottom wall, and sides defining an opening for receiving a plurality of removable electronic modules, a guide slidably insertable into the frame to partition an upper or lower portion of the opening when inserted into the frame, wherein the guide comprises a first edge for slidable engagement with the top wall or the bottom wall, and a lead screw extending from an opening in the guide spaced from a front end of the guide, to a back end of the guide for connecting the guide to the frame.