Patents by Inventor Shakti S. Chauhan
Shakti S. Chauhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10631410Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.Type: GrantFiled: September 20, 2017Date of Patent: April 21, 2020Assignee: Apple Inc.Inventors: Corey S. Provencher, Meng Chi Lee, Derek J. Walters, Ian A. Spraggs, Flynn P. Carson, Shakti S. Chauhan, Daniel W. Jarvis, David A. Pakula, Jun Zhai, Michael V. Yeh, Alex J. Crumlin, Dennis R. Pyper, Amir Salehi, Vu T. Vo, Gregory N. Stephens
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Patent number: 10535611Abstract: Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.Type: GrantFiled: February 12, 2016Date of Patent: January 14, 2020Assignee: Apple Inc.Inventors: Flynn P. Carson, Jun Chung Hsu, Meng Chi Lee, Shakti S. Chauhan
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Patent number: 10522475Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.Type: GrantFiled: September 26, 2018Date of Patent: December 31, 2019Assignee: Apple Inc.Inventors: Meng Chi Lee, Shakti S. Chauhan, Flynn P. Carson, Jun Chung Hsu, Tha-An Lin
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Publication number: 20190027445Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.Type: ApplicationFiled: September 26, 2018Publication date: January 24, 2019Inventors: Meng Chi Lee, Shakti S. Chauhan, Flynn P. Carson, Jun Chung Hsu, Tha-An Lin
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Patent number: 10147685Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.Type: GrantFiled: January 10, 2017Date of Patent: December 4, 2018Assignee: Apple Inc.Inventors: Phillip R. Sommer, Shankar Pennathur, Meng Chi Lee, Shakti S. Chauhan, Yanfeng Chen
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Patent number: 10115677Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.Type: GrantFiled: June 22, 2017Date of Patent: October 30, 2018Assignee: Apple Inc.Inventors: Meng Chi Lee, Shakti S. Chauhan, Flynn P. Carson, Jun Chung Hsu, Tha-An Lin
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Patent number: 10109593Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed over the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The substrate of the SiP may include at least some metallization along vertical walls in the end portions of the substrate. The metallization may provide a large contact area for coupling the metal shield to a ground ring coupled to the ground layer in the PCB. The metallization along the vertical walls in the end portions of the substrate may be formed as through-metal vias in a common substrate before singulation to form the SiP.Type: GrantFiled: November 20, 2015Date of Patent: October 23, 2018Assignee: Apple Inc.Inventors: Meng Chi Lee, Shakti S. Chauhan, Flynn P. Carson, Jun Chung Hsu, Tha-An Lin
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Publication number: 20180092213Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.Type: ApplicationFiled: September 20, 2017Publication date: March 29, 2018Inventors: Corey S. Provencher, Meng Chi Lee, Derek J. Walters, Ian A. Spraggs, Flynn P. Carson, Shakti S. Chauhan, Daniel W. Jarvis, David A. Pakula, Jun Zhai, Michael V. Yeh, Alex J. Crumlin, Dennis R. Pyper, Amir Salehi, Vu T. Vo, Gregory N. Stephens
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Publication number: 20170301631Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.Type: ApplicationFiled: June 22, 2017Publication date: October 19, 2017Inventors: Meng Chi Lee, Shakti S. Chauhan, Flynn P. Carson, Jun Chung Hsu, Tha-An Lin
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Publication number: 20170263569Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.Type: ApplicationFiled: January 10, 2017Publication date: September 14, 2017Inventors: Phillip R. Sommer, Shankar Pennathur, Meng Chi Lee, Shakti S. Chauhan, Yanfeng Chen
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Patent number: 9721903Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.Type: GrantFiled: December 21, 2015Date of Patent: August 1, 2017Assignee: Apple Inc.Inventors: Meng Chi Lee, Shakti S. Chauhan, Flynn P. Carson, Jun Chung Hsu, Tha-An Lin
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Publication number: 20170179039Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.Type: ApplicationFiled: December 21, 2015Publication date: June 22, 2017Inventors: Meng Chi Lee, Shakti S. Chauhan, Flynn P. Carson, Jun Chung Hsu, Tha-An Lin
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Publication number: 20170148744Abstract: Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.Type: ApplicationFiled: February 12, 2016Publication date: May 25, 2017Inventors: Flynn P. Carson, Jun Chung Hsu, Meng Chi Lee, Shakti S. Chauhan
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Publication number: 20170025361Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed over the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The substrate of the SiP may include at least some metallization along vertical walls in the end portions of the substrate. The metallization may provide a large contact area for coupling the metal shield to a ground ring coupled to the ground layer in the PCB. The metallization along the vertical walls in the end portions of the substrate may be formed as through-metal vias in a common substrate before singulation to form the SiP.Type: ApplicationFiled: November 20, 2015Publication date: January 26, 2017Inventors: Meng Chi Lee, Shakti S. Chauhan, Flynn P. Carson, Jun Chung Hsu, Tha-An Lin