Abstract: The disclosed technology includes a thermal management hinge connecting at least two hinged components of a computing device. The thermal management hinge has at least two different thermal orientations for managing thermal conditions within each of the hinged components. For example, the thermal management hinge may have a thermally conductive orientation and the thermally insulating orientation.

Abstract: The disclosed technology includes a thermal management hinge connecting at least two hinged components of a computing device. The thermal management hinge has at least two different thermal orientations for managing thermal conditions within each of the hinged components. For example, the thermal management hinge may have a thermally conductive orientation and the thermally insulating orientation.

Abstract: Feet for a multi-position computing device are described. In one or more implementations, a multi-position computing device is configured to include a base and a display device connected to the base by a hinge mechanism. The hinge mechanism is operable to position the display device into multiple positions relative to the base including at least an upright position and a laid-down position. An arrangement of feet on the underside of the base is designed to facilitate dynamic movement of the device into the multiple positions. The arrangement of feet includes sliding feet that engage for sliding of the base across a surface when pressure is applied to the hinge mechanism for transitions between positions. The arrangement of feet also includes tacky feet that engage and resist sliding of the base across the surface in the absence of pressure applied to the hinge mechanism.