Patents by Inventor Shamik GHOSHAL

Shamik GHOSHAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SINTERING COMPOSITION
    Publication number: 20220371089
    Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.
    Type: Application
    Filed: September 24, 2020
    Publication date: November 24, 2022
    Inventors: Shamik GHOSHAL, Nirmalya Kumar CHAKI, Remya CHANDRAN, Manoharan VENODH, Bawa SINGH, Barun DAS, Niveditha NAGARAJAN, Rahul RAUT, Oscar KHASELEV, Ranjit PANDHER, Supriya DEVARAJAN, Anubhav RUSTOGI
  • Sintering materials and attachment methods using same
    Patent number: 11389865
    Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: July 19, 2022
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghoshal, V. Sathish Kumar, Pavan Vishwanath, Ranjit S. Pandher, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Ravindra Mohan Bhatkal
  • LOW PRESSURE SINTERING POWDER
    Publication number: 20210249376
    Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 ?m.
    Type: Application
    Filed: April 30, 2021
    Publication date: August 12, 2021
    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Anubhav Rustogi
  • MULTILAYERED METAL NANO AND MICRON PARTICLES
    Publication number: 20210205935
    Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 8, 2021
    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
  • Low pressure sintering powder
    Patent number: 10998284
    Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 ?m.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: May 4, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Anubhav Rustogi
  • Multilayered metal nano and micron particles
    Patent number: 10894302
    Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: January 19, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
  • Sintering Materials and Attachment Methods Using Same
    Publication number: 20170144221
    Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
    Type: Application
    Filed: June 12, 2015
    Publication date: May 25, 2017
    Inventors: Shamik GHOSHAL, V. Sathish KUMAR, Pavan VISHWANATH, Ranjit S. PANDHER, Remya CHANDRAN, Sutapa MUKHERJEE, Siuli SARKAR, Bawa SINGH, Ravindra Mohan BHATKAL
  • Multilayered Metal Nano and Micron Particles
    Publication number: 20170113306
    Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.
    Type: Application
    Filed: June 22, 2015
    Publication date: April 27, 2017
    Inventors: Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
  • Low Pressure Sintering Powder
    Publication number: 20170033073
    Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 ?m.
    Type: Application
    Filed: April 10, 2015
    Publication date: February 2, 2017
    Inventors: Shamik GHOSHAL, Nirmalya Kumar CHAKI, Poulami Sengupta ROY, Siuli SARKAR, Anubhav RUSTOGI