Abstract: The present invention relates to Rhodanobacter ginsenosidimutans KCTC22231T-derived ginsenoside glycosidase and use thereof. The polypeptide has an activity of converting PPD (protopanaxadiol)-type saponins into in vivo absorbable and highly active deglycosylated saponins, by selective hydrolysis of a bond at a particular position of ginsenoside. The present invention also relates an amino acid sequence constituting the polypeptide, a nucleic acid sequence encoding the protein, a recombinant vector comprising the nucleic acid sequence, and a transformant transformed with the vector. The invention further provides a method for preparing Rhodanobacter ginsenosidimutans KCTC22231T-derived ginsenoside glycosidase by culturing the transformant, a method for converting PPD (protopanaxadiol)-type major ginsenoside into a rare ginsenoside that is absorbable in vivo using the protein, and a composition for converting PPD-type saponins into in vivo absorbable saponins, having the protein as an active ingredient.

Abstract: The present invention relates to a novel ginsenoside glycosidase protein derived from the genus Terrabacter, the protein having an activity of converting protopanaxadiol (PPD)-type saponins into highly active substances, which can be absorbed inside the body, by selective hydrolysis of a particular bond of ginsenoside. More specifically, the present invention relates to an amino acid sequence of the protein, a nucleic acid sequence encoding the protein, a recombinant vector comprising the nucleic acid sequence, and a transformant transformed with the vector, and a method for producing ginsenoside glycosidase derived from the genus Terrabacter by culturing the transformant, a method for converting PPD-type major saponins into the minor saponin forms using the protein, and a composition for converting PPD-type saponins into soluble saponins, comprising the protein as an active component.

Abstract: The present invention relates to a novel ginsenoside glycosidase protein derived from the genus Terrabacter, the protein having an activity of converting protopanaxadiol (PPD)-type saponins into highly active substances, which can be absorbed inside the body, by selective hydrolysis of a particular bond of ginsenoside. More specifically, the present invention relates to an amino acid sequence of the protein, a nucleic acid sequence encoding the protein, a recombinant vector comprising the nucleic acid sequence, and a transformant transformed with the vector, and a method for producing ginsenoside glycosidase derived from the genus Terrabacter by culturing the transformant, a method for converting PPD-type major saponins into the minor saponin forms using the protein, and a composition for converting PPD-type saponins into soluble saponins, comprising the protein as an active component.

Abstract: The present invention relates to Rhodanobacter ginsenosidimutans KCTC22231T-derived ginsenoside glycosidase and use thereof, and this protein has an activity of converting PPD (protopanaxadiol)-type saponins into in vivo absorbable, highly active deglycosylated saponins by selective hydrolysis of a bond at a particular position of ginsenoside. More particularly, the present invention relates to an amino acid sequence constituting the protein, a nucleic acid sequence encoding the protein, a recombinant vector comprising the nucleic acid sequence, a transformant transformed with the vector, a method for preparing Rhodanobacter ginsenosidimutans KCTC22231T-derived ginsenoside glycosidase by culturing the transformant, a method for converting PPD (protopanaxadiol)-type major ginsenoside into a rare ginsenoside that is absorbable in vivo using the protein, and a composition for converting PPD-type saponins into in vivo absorbable saponins, comprising the protein as an active ingredient.

Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.

Abstract: A method and apparatus for the decapsulation of integrated circuit packages. The apparatus includes a support member, the support member having an open region and an adjustable device coupled to the support member. The adjustable device can be adapted to hold a BGA package such that a surface region of the BGA package is spatially disposed to face a decapsulation source and a plurality of balls on the BGA package remain free from contact from the decapsulation source and free from contact from a thermal source capable of causing damage to one or more of the balls. The decapsulation source is provided to subject a portion of the surface region of the BGA package for removal of the portion of the BGA package.

Abstract: The present invention provides a method for dynamically adjusting the transmission rate of a wireless communication system. The method comprises the steps of: setting an initial transmission rate; counting the number of successful or unsuccessful transmission; comparing the number with a predetermined threshold and obtaining a comparing result; and adjusting the transmission rate according to the comparing result. The present invention also provides a method that uses the strength of received signals to determine if the transmission rate needs adjusting.

Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.

Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.

Abstract: A method and apparatus for the decapsulation of integrated circuit packages. The apparatus includes a support member, the support member having an open region and an adjustable device coupled to the support member. The adjustable device can be adapted to hold a BGA package such that a surface region of the BGA package is spatially disposed to face a decapsulation source and a plurality of balls on the BGA package remain free from contact from the decapsulation source and free from contact from a thermal source capable of causing damage to one or more of the balls. The decapsulation source is provided to subject a portion of the surface region of the BGA package for removal of the portion of the BGA package.

Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.

Abstract: A method includes amplifying the plurality of received signals, generating a plurality of time domain samples of the amplified signals with at least an analog-to-digital converter (ADC), determining at least a candidate power according to root-mean-square (RMS) powers of a first group of symbols received at the receiver antennas, and setting the gain of the amplifier according to a selected candidate power with the processor. The received RMS power for one antenna is determined as the square root of the averaged product of each received symbol and its complex conjugate for all symbols of the first group. The candidate power can be determined considering a subgroup of antennas using an RMS value, an arithmetical mean value, or a geometric mean value of this subgroup.

Abstract: An RF receiver includes a plurality of OFDM modules. The OFDM modules include receiver antennas for substantially simultaneously receiving a plurality of transmission signals transmitted via a single frequency band having a plurality of sub-channels. Further included is a channel estimation module connected to the plurality of OFDM modules, and a channel compensation module connected to the channel estimation module and the plurality of OFDM modules. For each sub-channel, the channel estimation module is capable of estimating channel frequency responses affecting the transmission signals, and the channel compensation module is capable of compensating the transmission signals according to the estimated channel frequency responses. The receiver allows an improved transfer rate per frequency band.

Abstract: A method includes amplifying the plurality of received signals, generating a plurality of time domain samples of the amplified signals with at least an analog-to-digital converter (ADC), determining at least a candidate power according to root-mean-square (RMS) powers of a first group of symbols received at the receiver antennas, and setting the gain of the amplifier according to a selected candidate power with the processor. The received RMS power for one antenna is determined as the square root of the averaged product of each received symbol and its complex conjugate for all symbols of the first group. The candidate power can be determined considering a subgroup of antennas using an RMS value, an arithmetical mean value, or a geometric mean value of this sub-group.

Abstract: An RF receiver includes a plurality of OFDM modules. The OFDM modules include receiver antennas for substantially simultaneously receiving a plurality of transmission signals transmitted via a single frequency band having a plurality of sub-channels. Further included is a channel estimation module connected to the plurality of OFDM modules, and a channel compensation module connected to the channel estimation module and the plurality of OFDM modules. For each sub-channel, the channel estimation module is capable of estimating channel frequency responses affecting the transmission signals, and the channel compensation module is capable of compensating the transmission signals according to the estimated channel frequency responses. The receiver allows an improved transfer rate per frequency band.

Abstract: The present invention provides a method for dynamically adjusting the transmission rate of a wireless communication system. The method comprises the steps of: setting an initial transmission rate; counting the number of successful or unsuccessful transmission; comparing the number with a predetermined threshold and obtaining a comparing result; and adjusting the transmission rate according to the comparing result. The present invention also provides a method that uses the strength of received signals to determine if the transmission rate needs adjusting.

Abstract: The present invention relates to a method for determining rapidly and accurately the polishing time of a chemical mechanical polishing process for polishing target wafers to avoid any problems of under-polishing or over-polishing. An aspect of the present invention is directed to a method for determining a chemical mechanical polishing time for removing a target polishing thickness H from an uneven surface of a target wafer. The method comprises polishing a control wafer by a chemical mechanical polishing to obtain a progressive relationship of polishing thickness and respective polishing time therefor. A first polishing time T1 is determined for removing a first thickness H1 from the target wafer, in which the first thickness H1 with substantially the uneven surface removed is smaller than the target polishing thickness H of the target wafer to be removed.

Abstract: The present invention relates to a method for determining rapidly and accurately the polishing time of a chemical mechanical polishing process for polishing target wafers to avoid any problems of under-polishing or over-polishing. An aspect of the present invention is directed to a method for determining a chemical mechanical polishing time for removing a target polishing thickness H from an uneven surface of a target wafer. The method comprises polishing a control wafer by a chemical mechanical polishing to obtain a progressive relationship of polishing thickness and respective polishing time therefor. A first polishing time T1 is determined for removing a first thickness H1 from the target wafer, in which the first thickness H1 with substantially the uneven surface removed is smaller than the target polishing thickness H of the target wafer to be removed.