Abstract: A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of the polishing table. A carrier having a first lateral and a second lateral opposite the first lateral, wherein the first lateral faces the polishing table, the wafer loading/unloading device or the measuring device. A guide ring is disposed on the first lateral of the carrier. A transfer device is disposed on the second lateral of the carrier and connected to the carrier, wherein the transfer device is used to move the carrier onto the polishing table, the wafer loading/unloading device or the measuring device. The measuring device is used to automatically and immediately measure the severity of scoring on the guide ring.

Abstract: A device used for detecting the clamping force of a processed object and a method thereof are proposed. The device comprises a detection unit, a basis component and a pressure detection component disposed on the basis component. The basis component having the pressure detection component is closely placed between pivotal rods so that the detection unit can detect variation of electric properties of the pressure detection component to adjust the spacing between the pivotal rods, hence facilitating adjustment of the clamping force.

Abstract: A device used for detecting the clamping force of a processed object and a method thereof are proposed. The device comprises a detection unit, a basis component and a pressure detection component disposed on the basis component. The basis component having the pressure detection component is closely placed between pivotal rods so that the detection unit can detect variation of electric properties of the pressure detection component to adjust the spacing between the pivotal rods, hence facilitating adjustment of the clamping force.

Abstract: A pumping system. The pumping system has a cylinder pump, a first group of switching devices, and a second group of switching devices. The first group of switching devices enable the cylinder pump to pump the liquid by feeding the gas provided by the gas source into the cylinder pump through a first ventilator according to a first enabling signal, and the second group of switching devices enable the cylinder to output the liquid by feeding the gas provided by the gas source into the cylinder pump through a second ventilator according to a second enable signal.

Abstract: An incremental offset measuring instrument is provided. The incremental offset measuring instrument includes a main base; a specimen seat mounted on the main base for resting a specimen; a measuring tool assembly for measuring the specimen; and a movable assembly mounted on the main base, wherein the movable assembly carries the measuring tool assembly, thereby achieving the goal of measuring the specimen.

Abstract: A chemical mechanical polish apparatus comprises a platen having a polishing pad thereon, a wafer carrier holding a wafer on the polishing pad, and a pusher. The pusher has a base disk and at least two guiding structures at the rim of the base disk. Each guiding structure has a shell with an opening, an elastic device and a pin moving through the opening, wherein the opening is non-linear.

Abstract: A guide ring removal device. The guide ring removal device includes a column press, a first disc, a second disc, and a plurality of fasteners. The first disc is disposed on the column press. The second disc is disposed on a point of the column press to exert force on a carrier. The plurality of fasteners is disposed on the first disc, the fasteners grasping the guide ring. As the second disc exerts the primary force on the carrier, the fasteners generate reciprocal force on the guide ring, thus separating the guide ring. Engagement of the column press alters the distance between the first disc and the second disc, and the primary force is exerted on the carrier.

Abstract: A guide ring removal device. The guide ring removal device includes a column press, a first disc, a second disc, and a plurality of fasteners. The first disc is disposed on the column press. The second disc is disposed on a point of the column press to exert force on a carrier. The plurality of fasteners is disposed on the first disc, the fasteners grasping the guide ring. As the second disc exerts the primary force on the carrier, the fasteners generate reciprocal force on the guide ring, thus separating the guide ring. Engagement of the column press alters the distance between the first disc and the second disc, and the primary force is exerted on the carrier.

Abstract: A cleaning roller. The roller comprises a shaft, a sponge sleeve, and an inflatable chamber. The sponge sleeve encloses the shaft, and the inflatable chamber is disposed between the shaft and the sponge sleeve. A central portion of the inflatable chamber is thicker than the ends of the inflatable chamber. The inflatable chamber is of elastic materials. By introducing a working flow into the inflatable chamber, the thickness of the central portion of the inflatable chamber can be adjusted.

Abstract: An incremental offset measuring instrument is provided. The incremental offset measuring instrument includes a main base; a specimen seat mounted on the main base for resting a specimen; a measuring tool assembly for measuring the specimen; and a movable assembly mounted on the main base, wherein the movable assembly carries the measuring tool assembly, thereby achieving the goal of measuring the specimen.

Abstract: A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of the polishing table. A carrier having a first lateral and a second lateral opposite the first lateral, wherein the first lateral faces the polishing table, the wafer loading/unloading device or the measuring device. A guide ring is disposed on the first lateral of the carrier. A transfer device is disposed on the second lateral of the carrier and connected to the carrier, wherein the transfer device is used to move the carrier onto the polishing table, the wafer loading/unloading device or the measuring device. The measuring device is used to automatically and immediately measure the severity of scoring on the guide ring.

Abstract: A wafer holder in a robot blade. A holder plate having a front end is provided. At least one sensor is disposed at the front end of the holder plate. A sensing circuit is connected to the sensor, wherein the sensing circuit determines the presence or absence of an obstruction positioned immediately ahead of the holder plate. Thus, the wafer holder is capable of avoiding contact with obstructions, thereby preventing system crash during semiconductor manufacturing process.

Abstract: A pumping system. The pumping system has a cylinder pump, a first group of switching devices, and a second group of switching devices. The first group of switching devices enable the cylinder pump to pump the liquid by feeding the gas provided by the gas source into the cylinder pump through a first ventilator according to a first enabling signal, and the second group of switching devices enable the cylinder to output the liquid by feeding the gas provided by the gas source into the cylinder pump through a second ventilator according to a second enable signal.

Abstract: A chemical mechanical polish apparatus comprises a platen having a polishing pad thereon, a wafer carrier holding a wafer on the polishing pad, and a pusher. The pusher has a base disk and at least two guiding structures at the rim of the base disk. Each guiding structure has a shell with an opening, an elastic device and a pin moving through the opening, wherein the opening is non-linear.