Abstract: Improved puddle processes and methods are provided herein for retaining a processing liquid on a surface of a semiconductor substrate. More specifically, improved methods are provided herein for retaining a puddle within a center region of a semiconductor substrate while the substrate is stationary, or rotating at relatively low rotational speeds. In the disclosed embodiments, a puddle is retained within a center region of the semiconductor substrate by a thin film, which is deposited within a peripheral edge region of the substrate before a processing liquid is dispensed within the center region of the substrate to form the puddle.

Abstract: In general, disclosed herein are methods for producing a chemoselectively modified biomolecule. The method may include providing a biomolecule, which may include a bioconjugation warhead at a specific site of the biomolecule. Also, the method may include selectively oxidizing the halogen donor compound of the bioconjugation warhead at an electrochemically efficient voltage to generate a halogen radical. Also, the method may include contacting the halogen radical with the bioconjugation warhead at a constant voltage to form an electrophilic warhead. Also, the method may include reacting the electrophilic warhead with a coupling partner comprising a nucleophilic group of the biomolecule to conjugate the electrophilic warhead to the biomolecule.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A semiconductor device arrangement structure includes a carrier, semiconductor devices, and an adhesive layer. The semiconductor devices are separately disposed on the carrier, and each of the semiconductor devices includes an electrode. The adhesive layer is disposed between the carrier and the semiconductor devices, and the semiconductor devices are attached to the adhesive layer which is a continuous distributed single-layered structure. The adhesive layer includes unselected regions and a selected region, wherein the unselected regions are covered by the semiconductor devices respectively, and the selected region is not covered by the semiconductor devices. The adhesive layer further includes an indentation disposed on a surface of the selected region, and in a cross-sectional view or a top view, the contour of the indentation is a scaled copy of a contour of and the electrode, and the indentation has a depth less than that of the electrode.

Abstract: A video processing method is provided. In the method, a video bit stream is obtained. Configuration information of the video bit stream is determined. The configuration information includes reference image information. The reference image information indicates (i) whether a video track corresponding to the video bit stream includes a reference image and (ii) whether the video track requires reference to the reference image. The video bit stream and the configuration information are encapsulated to obtain the video track.

Abstract: Embodiments of a wet etch process and methods are disclosed herein to provide uniform wet etching of material within high aspect ratio features. In the present disclosure, a wet etch process is used to etch material within high aspect ratio features, such as deep trenches and holes, provided on a patterned substrate. Uniform wet etching is provided in the present disclosure by ensuring that wall surfaces of the material being etched (or wall surfaces adjacent to the material being etched) exhibit a neutral surface charge when exposed to the etch solution used to etch the material.

Abstract: Chip moving device is provided. The chip moving device includes a base, including a mounting portion that includes an end surface and an assembly cavity extending in a horizontal direction and penetrating through the end surface, the end surface being arranged with a limiting component; an adsorption part, extending in a vertical direction and confined by the limiting component; and a clamping component, arranged in the assembly cavity and including an end extending out of the end surface of the mounting portion, the clamping component being configured to be telescopic in the horizontal direction, and provide the adsorption part with a clamping force in the horizontal direction when the clamping component is extended or contracted.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a first holder, a fixed portion, a first driving assembly, and a first stopping assembly. The first holder is used for connecting to an optical element. The first holder is movable relative to the fixed portion. The first driving assembly is used for driving the first holder to move relative to the fixed portion. The first stopping assembly is used for restricting the movable range of the first holder relative to the fixed portion.

Abstract: The present disclosure includes an adaptive die test socket and a formation method. The die test socket includes an upper test socket and a lower test socket disposed directly below the upper test socket. The upper test socket is connected to a support frame; a strip-shaped through hole is formed on an upper surface of the support frame; a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each of upper portions of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs.

Abstract: The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below the pressing-down block. The pressing-down block is connected to the support frame through an installation plate; a strip-shaped through hole is formed at an upper surface of the support frame; a first protruding strip is at each lower portion of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each upper portion of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block is connected to the second protruding strip through at least two springs.

Abstract: A semiconductor device arrangement structure includes a carrier, a first semiconductor device, a second semiconductor device, a first adhesive part, and a second adhesive part. The first semiconductor device and the second semiconductor device are located on the carrier and separated from each other. The first adhesive part and the second adhesive part are separated from each other. The first adhesive part is located between the first semiconductor device and the carrier, and the second adhesive part is located between the second semiconductor device and the carrier. In a top view, the first adhesive part has a first outer contour surrounding the first semiconductor device. The first outer contour has at least one round corner.

Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, and a driving assembly. The movable part includes a holder, and a supporting element. The holder holds an optical element. The supporting element is connected to the holder. The driving assembly drives the movable part to move relative to the fixed part. The holder uses the supporting element as a fulcrum and moves relative to the fixed part around the first axis and the second axis. The first axis is not parallel to the second axis.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: The present disclosure provides an adaptive die testing apparatus and a formation method. The adaptive die testing apparatus includes a support frame capable of moving along a vertical direction; a movable panel capable of moving along a horizontal direction; an upper test socket installed on the support frame; and a lower test socket installed on the movable panel and capable of moving with the movable plate to directly below the upper test socket. A groove is formed on a lower surface of the upper test socket and/or an upper surface of the lower test socket. When the adaptive die testing apparatus is at a testing state, the lower surface of the upper test socket is in a close contact with the upper surface of the lower test socket, and a sealed chamber for placing a die to-be-tested is formed at a region of the groove.

Abstract: A pixel structure includes a first light-emitting diode for emitting a first light, wherein the first light-emitting diode has a first semiconductor layer, a first light-emitting surface, and a first electrode under the first semiconductor layer away from the first light-emitting surface; a second light-emitting diode for emitting a second light, wherein the second light-emitting diode has a second semiconductor layer, a second light-emitting surface, and a second electrode under the second semiconductor layer away from the second light-emitting surface; a dielectric layer surrounding and contacting the first semiconductor layer and the second light-emitting diode and exposing the first light-emitting surface, the first electrode, the second light-emitting surface and the second electrode; a common conductive structure having a semiconductor layer and a metal layer; and a light-transmitting conductive layer covering and electrical connecting the first light-emitting diode, the second light-emitting diode and

Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This semiconductor device arrangement includes a carrier, a first semiconductor device, a second semiconductor device, a first adhesive portion, and a second adhesive portion. The first semiconductor device and the second semiconductor device are separately arranged on the carrier. The first adhesive portion and the second adhesive portion are separately arranged on the carrier, the first adhesive portion is located between the first semiconductor device and the carrier, and the second adhesive portion is located between the second semiconductor device and the carrier. In the cross-sectional view, the first adhesive portion includes an inclined sidewall, and the inclined sidewall is adjacent to the carrier and forms an interior angle greater than 90 degrees to the carrier.

Abstract: A wavelength conversion unit arrangement includes a carrier and a wavelength conversion unit. The wavelength conversion unit includes a wavelength conversion layer and a filter layer, and the filter layer attaches the wavelength conversion unit to the carrier. The filter layer has a first surface facing the carrier and a second surface opposite the first surface, and the first surface and the second surface have different textures.

Abstract: Improved processing systems and methods are provided for wet and dry processing of a semiconductor wafer. Provided is an enclosed chamber for processing a semiconductor wafer within a processing space and a drainage system for directing processing fluids out of the processing space. The enclosed chamber includes a top plate and a bottom plate, which physically confine the processing fluids within a relatively small, enclosed processing space. This forces the processing fluids to flow radially across the wafer surface(s) without the need to rotate the wafer. The drainage system contains a conduit that is downstream from the processing space and configured to retain a portion of a processing fluid dispensed within the processing space. The portion retained within the conduit provides a pressure resistance against the processing fluid(s) dispensed within the processing space to improve wet and dry processing of the wafer surfaces.

Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This arrangement includes a substrate, an adhesive structure, and a first semiconductor device. The substrate includes an upper surface. The adhesive structure is located on the upper surface and includes a first concave region. The first semiconductor device includes a lower surface facing toward the adhesive structure and a conductive bump located under the lower surface and in the first concave region. The conductive bump includes a first portion and a second portion. Wherein the lower surface does not contact the adhesive structure, the first portion contacts the first concave region, and the second portion does not contact the first concave region.