Patents by Inventor Shan Hua

Shan Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12281394
    Abstract: Provided in one embodiment of the present disclosure is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 MPa on the basis of the absolute value thereof, wherein the copper layer comprises copper and carbon (C), the amount of carbon (C) in the copper layer is 2-20 ppm, the copper layer has a plane (111), a plane (200), a plane (220) and a plane (311) including crystalline particles, the ratio of the diffraction intensity of the plane (220) to the sum of the diffraction intensities of the plane (111), the plane (200), the plane (220) and the plane (311) is 10-40%, and the crystalline particles of the plane (220) have an average particle size of 70-120 nm at room temperature.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: April 22, 2025
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Shan Hua Jin, An Na Lee, Seung Min Kim
  • Publication number: 20250087302
    Abstract: Methods for facilitating selection of cell lines for production of recombinant proteins are disclosed. In particular, disclosed is the use of machine learning models trained on multiomics data to predict one or more values indicative of the titre and/or quality of a recombinant protein expressed by different cell lines, enabling ranking the cell lines based on the predicted values and selecting those predicted to produce the recombinant protein with higher titre and/or higher quality.
    Type: Application
    Filed: September 11, 2024
    Publication date: March 13, 2025
    Applicant: Hoffmann-La Roche Inc.
    Inventors: Shan-Hua CHUNG, Daniel Tobias GROSSKOPF, Styliani PAPADAKI, Oliver Helmut POPP, Tom Kamran QUAISER, Laura Susanne STOECKL, Styliani TOURNAVITI
  • Publication number: 20250026820
    Abstract: The present invention relates to an anti-TGF? antibody, such as B2G8, comprising CDR1, CDR2 and CDR3 contained in a sequence shown in SEQ ID NO: 7, preferably according to the Kabat and IMGT numbering system, comprising CDR1 as shown in SEQ ID NO: 49, CDR2 as shown in SEQ ID NO: 50 and CDR3 as shown in SEQ ID NO: 51, and an application of said anti-TGF? antibody.
    Type: Application
    Filed: August 19, 2021
    Publication date: January 23, 2025
    Inventors: Jian SHI, Lijuan FANG, Yongxiang YAN, Jing ZHANG, Shan HUA, Pengfei ZHOU
  • Publication number: 20250002605
    Abstract: Provided in the present invention are a bispecific antibody and the use thereof. The bispecific antibody comprises an antigen-binding domain specifically binding to EpCAM and an antigen-binding domain specifically binding to CD3.
    Type: Application
    Filed: November 19, 2021
    Publication date: January 2, 2025
    Inventors: Lijuan Fang, Jing Zhang, Shan Hua, Pengfei Zhou
  • Publication number: 20240425575
    Abstract: The present invention relates to an anti-ANG2 heavy-chain single-domain antibody, and an application thereof.
    Type: Application
    Filed: September 10, 2021
    Publication date: December 26, 2024
    Inventors: Jian SHI, Lijuan FANG, Yongxiang YAN, Jing ZHANG, Shan HUA, Pengfei ZHOU
  • Publication number: 20240289081
    Abstract: A screen sharing system and a screen sharing method for a video conference are provided. The screen sharing method includes the following. An identifier is transmitted and video data matching the identifier is transmitted by a first terminal device. Status information corresponding to a second terminal device is received by the first terminal device in response to transmitting the video data. A prompt message is output by the first terminal device according to the status information. The first terminal device determines whether screen sharing with the second terminal device is successful according to the prompt message.
    Type: Application
    Filed: April 13, 2023
    Publication date: August 29, 2024
    Applicant: Wistron Corporation
    Inventors: Shan-Hua Yeh, Tao Chen
  • Publication number: 20240222640
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a first weight retention rate of 0.1% or less, and a second weight retention rate of 0.3% or less.
    Type: Application
    Filed: December 21, 2023
    Publication date: July 4, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213492
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a room temperature MIT 1 of 280 or more, a high-temperature MIT 1 of 130 or more, a room temperature MIT 2 of 14 or more, and a high-temperature MIT 2 of 25 or more. The room temperature MIT 1 refers to an MIT number when a bending radius (R) is 0.38 mm at room temperature, the high-temperature MIT 1 refers to an MIT number when a bending radius (R) is 0.38 mm after heat treatment at 190° C. for one hour, the room temperature MIT 2 refers to an MIT number when a bending radius (R) is 0.1 mm at room temperature, and the high-temperature MIT 2 refers to an MIT number when a bending radius (R) is 0.1 mm after heat treatment at 190° C. for one hour.
    Type: Application
    Filed: December 18, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213493
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper film has an A-value in a range of 1.1 to 1.6. “A” is calculated by Equation 1 below, A = P / Q [ Equation ? 1 ] wherein “P” in Equation 1 is a peak intensity at 1650 cm?1 of the copper film, “Q” in Equation 1 is a peak intensity at 1460 cm?1 of the copper film, and the peak intensity is measured by Fourier-transform infrared spectroscopy (FT-IR).
    Type: Application
    Filed: December 18, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213490
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a first stress factor in a range of 2.8 to 3.2, a second stress factor in a range of 2.5 to 3.0, and a third stress factor in a range of 3.5 to 4.5, and a method for manufacturing the copper foil.
    Type: Application
    Filed: December 21, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Patent number: 12022163
    Abstract: Embodiments of the present disclosure disclose a video playing method and apparatus, an electronic device, and a computer readable medium. A specific implementation manner of the method includes: displaying a video playing page, where the video playing page includes video information and a user interaction control; in response to detecting a first user operation of a user on the video playing page, hiding the video information, adjusting opacity of the user interaction control from initial opacity to target opacity, and adjusting a display position of the user interaction control from an initial position to a target position, where obstructed area of a video displayed on the video playing page when the user interaction control is at the target position is smaller than obstructed area of the video displayed on the video playing page when the user interaction control is at the initial position.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: June 25, 2024
    Assignee: BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
    Inventors: Fengbo Yuan, Shan Hua
  • Publication number: 20240204167
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper film has a room temperature loss factor of 0.05 or less, wherein the room temperature loss factor is calculated by Equation 1 below, room temperature loss factor=room temperature loss modulus/room temperature storage modulus.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 20, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240194890
    Abstract: According one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a tensile strength index of 3.0 kgf/mm2 or less, and an elongation index of 2.1% or less.
    Type: Application
    Filed: November 22, 2023
    Publication date: June 13, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240194891
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature puncture strength in a range of 5.0 N to 7.0 N, and a high-temperature puncture strength in a range of 8.0 N to 12.5 N. At this time, the high-temperature puncture strength is a puncture strength measured after heat treatment at 190° C. for one hour.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 13, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240186527
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film having 99.9 wt % or more of copper, wherein the copper foil has a color difference coefficient in a range of 0.38 to 0.7 based on the Lab color system.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 6, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240186526
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature water contact angle in a range of 60° to 70°, and a room temperature surface resistivity in a range of 2.4 m?/cm to 2.7 m?/cm.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 6, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240178404
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and having an R value in a range of 2.0 to 3.5.
    Type: Application
    Filed: November 22, 2023
    Publication date: May 30, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240150699
    Abstract: An electroporation system including one or more of a pipette, a pipette tip, a pipette docking assembly, and a pulse generator. The pipette docking assembly includes a pipette station, a pipette station guard, and a reservoir (e.g., a buffer tube). A method for transfecting a cell with a payload including providing an electroporation system, providing the cell, providing the payload, introducing the cell and the payload into a pipette tip, and electroporating the cell within the pipette tip by operating the electroporation system.
    Type: Application
    Filed: September 15, 2023
    Publication date: May 9, 2024
    Inventors: Han WEI, Chee Wai CHAN, Wui Khen LIAW, Shan Hua DONG, See Chen GOH, Huei Steven YEO, Harmon Cosme SICAT, JR., Mio Xiu Lu LING, Josh M. MEAD, Mikko MAKINEN, Beng Heng LIM, Kuan Moon BOO, Justina Linkai BONG, Chye Sin NG, Wee Liam LIM, Li Yang LIM, Way Xuang LEE
  • Publication number: 20240117061
    Abstract: An anti-BCMA antibody or an antigen-binding fragment thereof, and an application thereof in the treatment or prevention of tumor.
    Type: Application
    Filed: December 16, 2020
    Publication date: April 11, 2024
    Inventors: Lijuan FANG, Jian SHI, Shan HUA, Jing ZHANG, Kaili ZHANG, Pengfei ZHOU
  • Publication number: 20230323421
    Abstract: The invention relates to antisense oligonucleotides which alter the splicing of XBP1 pre-mRNA. The antisense oligonucleotides have applications in enhancing the level and/or quality of protein expression in cells and in mammalian protein expression systems, such as heterologous protein expression systems, such as enhancing antibody expression in CHO cells. The antisense oligonucleotides also have applications in therapy, such as for the treatment or prevention of proteopathological diseases.
    Type: Application
    Filed: June 22, 2023
    Publication date: October 12, 2023
    Applicant: Roche Innovation Center Copenhagen A/S
    Inventors: Styliani TOURNAVITI, Jonas VIKESAA, Shan-Hua CHUNG