Patents by Inventor Shan Hua JIN

Shan Hua JIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11591706
    Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|?(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|?PD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: February 28, 2023
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Seung Min Kim, Shan Hua Jin
  • Patent number: 11505873
    Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: November 22, 2022
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Shan Hua Jin, An Na Lee, Seung Min Kim
  • Publication number: 20220228268
    Abstract: Provided in one embodiment of the present disclosure is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 MPa on the basis of the absolute value thereof, wherein the copper layer comprises copper and carbon (C), the amount of carbon (C) in the copper layer is 2-20 ppm, the copper layer has a plane (111), a plane (200), a plane (220) and a plane (311) including crystalline particles, the ratio of the diffraction intensity of the plane (220) to the sum of the diffraction intensities of the plane (111), the plane (200), the plane (220) and the plane (311) is 10-40%, and the crystalline particles of the plane (220) have an average particle size of 70-120 nm at room temperature.
    Type: Application
    Filed: November 13, 2020
    Publication date: July 21, 2022
    Inventors: Shan Hua JIN, An Na LEE, Seung Min KIM
  • Patent number: 11352707
    Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra??[Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: June 7, 2022
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Seung Min Kim, An Na Lee, Ho Gun Kim, Shan Hua Jin
  • Patent number: 11346015
    Abstract: The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 ?m/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: May 31, 2022
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung Min Kim, Joong Kyu An, Shan Hua Jin
  • Publication number: 20220098746
    Abstract: Disclosed herein is an electrolytic copper foil including a copper layer, wherein the copper layer includes a (220) surface, and an orientation index M(220) of the (220) surface is one or more.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 31, 2022
    Inventors: Young Tae KIM, Sang Hyun JUN, Shan Hua JIN, An Na LEE
  • Publication number: 20210025067
    Abstract: The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 ?m/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
    Type: Application
    Filed: January 25, 2019
    Publication date: January 28, 2021
    Inventors: Seung Min KIM, Joong Kyu AN, Shan Hua JIN
  • Publication number: 20210025066
    Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|?(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|?PD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.
    Type: Application
    Filed: January 25, 2019
    Publication date: January 28, 2021
    Inventors: Seung Min KIM, Shan Hua JIN
  • Patent number: 10741848
    Abstract: Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 ?m to 3.5 ?m, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: August 11, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD
    Inventors: Seung Min Kim, Shan Hua Jin
  • Publication number: 20200181790
    Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
    Type: Application
    Filed: July 25, 2018
    Publication date: June 11, 2020
    Inventors: Shan Hua JIN, An Na LEE, Seung Min KIM
  • Patent number: 10658655
    Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, wherein the copper foil has a first surface of a direction of the matte surface of the copper layer and a second surface of a direction of the shiny surface of the copper layer, wherein a dynamic friction coefficient of the first surface is designated by ?k1 and a dynamic friction coefficient of the second surface is designated by ?k2. A ratio of three-dimensional surface area to two-dimensional surface area of the first surface is designated by Fs1, a ratio of three-dimensional surface area to two-dimensional surface area of the second surface is designated by Fs2.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: May 19, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Young Wook Chae, Young Hyun Kim, Shan Hua Jin
  • Patent number: 10547081
    Abstract: An electrolytic copper foil capable of improving a capacity retention rate of a secondary battery, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first surface has a peak density (PD) of 3 to 110, a texture coefficient [TC(220)] of a (220) plane of 1.32 or less, and a surface roughness (Rz) of 0.5 to 2.7 ?m.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 28, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung Min Kim, Shan Hua Jin
  • Patent number: 10403898
    Abstract: A high strength electrolytic copper foil preventing generation of folds, wrinkles, pleats, and breaks during a roll-to-roll (RTR) process, a method of manufacturing the same, and an electrode and a secondary battery which allow high productivity to be secured by being manufactured with such an electrolytic copper foil. The electrolytic copper foil includes a copper film including 99 weight % or more of copper and a protective layer on the copper film, wherein the electrolytic copper foil has a tensile strength of 45 to 65 kgf/mm2.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: September 3, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung Min Kim, Jeong Gil Lee, Shan Hua Jin
  • Publication number: 20190036126
    Abstract: A high strength electrolytic copper foil preventing generation of folds, wrinkles, pleats, and breaks during a roll-to-roll (RTR) process, a method of manufacturing the same, and an electrode and a secondary battery which allow high productivity to be secured by being manufactured with such an electrolytic copper foil. The electrolytic copper foil includes a copper film including 99 weight % or more of copper and a protective layer on the copper film, wherein the electrolytic copper foil has a tensile strength of 45 to 65 kgf/mm2.
    Type: Application
    Filed: July 27, 2017
    Publication date: January 31, 2019
    Inventors: Seung Min KIM, Jeong Gil LEE, Shan Hua JIN
  • Publication number: 20190003066
    Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra??[Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
    Type: Application
    Filed: August 17, 2018
    Publication date: January 3, 2019
    Inventors: Seung Min KIM, An Na LEE, Ho Gun KIM, Shan Hua JIN
  • Publication number: 20190006658
    Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, wherein the copper foil has a first surface of a direction of the matte surface of the copper layer and a second surface of a direction of the shiny surface of the copper layer, wherein a dynamic friction coefficient of the first surface is designated by ?k1 and a dynamic friction coefficient of the second surface is designated by ?k2. A ratio of three-dimensional surface area to two-dimensional surface area of the first surface is designated by Fs1, a ratio of three-dimensional surface area to two-dimensional surface area of the second surface is designated by Fs2.
    Type: Application
    Filed: August 27, 2018
    Publication date: January 3, 2019
    Inventors: Young Wook CHAE, Young Hyun KIM, Shan Hua JIN
  • Publication number: 20180261850
    Abstract: Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 ?m to 3.5 ?m, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.
    Type: Application
    Filed: March 7, 2018
    Publication date: September 13, 2018
    Inventors: Seung Min KIM, Shan Hua JIN
  • Publication number: 20180062199
    Abstract: An electrolytic copper foil capable of improving a capacity retention rate of a secondary battery, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first surface has a peak density (PD) of 3 to 110, a texture coefficient [TC(220)] of a (220) plane of 1.32 or less, and a surface roughness (Rz) of 0.5 to 2.7 ?m.
    Type: Application
    Filed: July 28, 2017
    Publication date: March 1, 2018
    Inventors: Seung Min KIM, Shan Hua JIN